| Payment Terms | T/T, D/A, D/P |
| Packaging Details | 25KG/barrel |
| Name | Epoxy potting compound |
| Sample | Can be offered |
| Keyword | Epoxy Resin Ab Glue For Electronic Potting |
| Color | Black,clear |
| Mix ratio | 5:1 |
| Application | led transformers/coils electronics |
| Shelf time | 6months |
| Thermal conductivity | 0.5 |
| The hardness of SHORE A | 85-95 |
| Brand Name | Hanast |
| Model Number | HN-5508AB |
| Certification | ROHS SGS |
| Place of Origin | Guangdong, China |
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Product Specification
| Payment Terms | T/T, D/A, D/P | Packaging Details | 25KG/barrel |
| Name | Epoxy potting compound | Sample | Can be offered |
| Keyword | Epoxy Resin Ab Glue For Electronic Potting | Color | Black,clear |
| Mix ratio | 5:1 | Application | led transformers/coils electronics |
| Shelf time | 6months | Thermal conductivity | 0.5 |
| The hardness of SHORE A | 85-95 | Brand Name | Hanast |
| Model Number | HN-5508AB | Certification | ROHS SGS |
| Place of Origin | Guangdong, China | ||
| High Light | 2 Component raw silicone material ,Potting raw silicone material ,Silicone low viscosity potting compound | ||
Product Description of epoxy potting compound:
Epoxy potting compound is a liquid or paste-like composite material made from epoxy resin as the base material, combined with a curing agent, fillers, and various modifying additives. Through a chemical reaction (curing), it forms a hard, dense, three-dimensional cross-linked network structure, completely encapsulating and sealing the electronic components, assemblies, or circuits that need protection within a solidified epoxy resin shell.
Feature of epoxy potting compound:
Electrical Insulation and Protection: Prevents short circuits and leakage, and resists environmental corrosion from dust, moisture, and salt spray.
Mechanical Support and Protection: Resists vibration, shock, and stress, securing internal components and preventing them from loosening or being damaged.
Thermal Management: For thermally conductive potting compounds with added thermal fillers, it helps dissipate heat from electronic components.
Chemical Corrosion Protection: Protects components from damage by acids, bases, solvents, and other chemicals.
Confidentiality and Tamper Protection: Once cured, it is difficult to remove without damage, protecting core circuit designs and intellectual property.
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Product Application of epoxy potting compound::
Power modules (such as transformers, inductors, AC/DC modules)
Automotive electronics (ECU, sensors, ignition coils)
New energy (photovoltaic inverters, battery management systems (BMS), charging stations)
Underwater equipment, outdoor LED drivers
Precision sensors, aerospace electronic equipment
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technical parameter of epoxy potting compound
| uring | builder | Epoxy resin 5508 | Curing agent 5508 |
| pigment | Black / White et al | Ruburn / transparent surface | |
| A sticky epoxy resin water | r liquid specific | ||
| c gravity, g / cm3 | 1.4-1.5 | 1.05 | |
| Viscosity of 25℃ | 4,500—6,000cp s | 150—250cp storage | |
| e Period (25℃) | Six months | x months | |
|
processabili
| mixing ratio | A: B =5:1 (weight ratio) | |
| Available for a time of 25℃ | 2-3H (100g mix) | ||
| curing time | 25℃ / 6-8H surface stem, 12-16H fully cured or 60-80℃/1.5-2H | ||
| After curing | 2 Tensile strength of kg/cm | 16-18 | |
| 2 Compressive strength of kg/cm | 18-22 | ||
| Resistance to the voltage of kv/mm | 20-22 | ||
| Surface resistance ofΩ-cm | 14 1.2*10 | ||
| Volume resistance ofΩ-cm | 15 1.1*10 | ||
| contraction percentage% | 0.35-0.55 | ||
| Water absorption rate was 25℃ * 24H | <0.03% | ||
| The hardness of SHORE A | 85-95 |
| distortion temperature ℃ | 130-150 |
| low temperature resistant ℃ | -30 |
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About us
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Company Details
Business Type:
Manufacturer,Agent,Trading Company
Year Established:
2010
Total Annual:
5000000-10000000
Employee Number:
50~100
Ecer Certification:
Verified Supplier
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