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China factory - ShenZhen KaiZhuo Electronic Technology Co.,Ltd

ShenZhen KaiZhuo Electronic Technology Co.,Ltd

  • China,Shenzhen ,Guangdong
  • Verified Supplier

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China Thickness 0.8-1.6mm Custom PCB Assembly Components Standard IPC Class 2 or 3
China Thickness 0.8-1.6mm Custom PCB Assembly Components Standard IPC Class 2 or 3

  1. China Thickness 0.8-1.6mm Custom PCB Assembly Components Standard IPC Class 2 or 3
  2. China Thickness 0.8-1.6mm Custom PCB Assembly Components Standard IPC Class 2 or 3
  3. China Thickness 0.8-1.6mm Custom PCB Assembly Components Standard IPC Class 2 or 3
  4. China Thickness 0.8-1.6mm Custom PCB Assembly Components Standard IPC Class 2 or 3
  5. China Thickness 0.8-1.6mm Custom PCB Assembly Components Standard IPC Class 2 or 3

Thickness 0.8-1.6mm Custom PCB Assembly Components Standard IPC Class 2 or 3

  1. MOQ: 1pc
  2. Price: Negotiation
  3. Get Latest Price
Payment Terms T/T, Western Union;Paypal
Supply Ability 100000pcs/month
Delivery Time 8-10days
Packaging Details Vacuum bag&anti-static bag
PCB Material FR4
Spec As per customer gerber files
Layers 4Layers
Board thickness 0.8-1.6mm
Surface finish ENIG 1-2U"
Quality standard IPC Class 2 or 3
Brand Name Null
Model Number DLP_U205A_V1 PCB
Certification IATF16949-2016 | ISO9001 2015 | UL 337072 | ROHS
Place of Origin Shenzhen China

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  1. Product Details
  2. Company Details

Product Specification

Payment Terms T/T, Western Union;Paypal Supply Ability 100000pcs/month
Delivery Time 8-10days Packaging Details Vacuum bag&anti-static bag
PCB Material FR4 Spec As per customer gerber files
Layers 4Layers Board thickness 0.8-1.6mm
Surface finish ENIG 1-2U" Quality standard IPC Class 2 or 3
Brand Name Null Model Number DLP_U205A_V1 PCB
Certification IATF16949-2016 | ISO9001 2015 | UL 337072 | ROHS Place of Origin Shenzhen China
High Light 1.6mm Custom PCB Assembly0.8mm Custom PCB AssemblyCustom PCB Assembly Components

Surface Mount Technology (SMT): Surface mount technology is a widely used method in printed circuit assembly. It involves placing surface-mount components directly onto the PCB's surface, eliminating the need for through-hole components and allowing for higher component density and smaller PCB sizes. SMT components are typically smaller, lighter, and offer better electrical performance.

Through-Hole Technology (THT): While surface mount technology is prevalent, through-hole technology is still used in certain applications, especially for components that require robust mechanical connections or high-power handling capabilities. Through-hole components have leads that pass through holes drilled in the PCB, and they are soldered on the opposite side. THT components provide mechanical strength and are suitable for applications with higher mechanical stresses.

Automated Assembly: To improve efficiency and accuracy, many printed circuit assembly processes utilize automated equipment. Automated pick-and-place machines are used to precisely position surface-mount components onto the PCB. These machines can handle high volumes, improve placement accuracy, and reduce assembly time compared to manual assembly methods.

Design for Assembly (DFA): Design for Assembly is an approach that focuses on optimizing the PCB design to ensure easy and efficient assembly. DFA principles include minimizing the number of unique components, reducing the number of assembly steps, and optimizing the component placement to minimize the risk of errors or defects during assembly.

In-Circuit Testing (ICT): In-circuit testing is a common method used to verify the electrical integrity and functionality of the assembled circuit. It involves the use of specialized test probes to measure voltages, currents, and other parameters at various points on the PCB. ICT can quickly identify open circuits, short circuits, or component failures, ensuring that the assembled circuit meets the required specifications.

Functional Testing: Functional testing is performed to ensure that the assembled circuit operates as intended and meets the desired performance criteria. It involves applying inputs and checking the outputs to verify the functionality and performance of the circuit under normal operating conditions. Functional testing can be done manually or using automated test equipment, depending on the complexity of the circuit and the test requirements.

Quality Control: Quality control is essential in printed circuit assembly to ensure that the final product meets the required standards. It involves various inspection and testing processes at different stages of assembly, including visual inspection, automated optical inspection (AOI), X-ray inspection, and electrical testing. Quality control measures help identify and rectify any defects or issues, ensuring that the assembled circuit meets the desired quality and reliability.

By following best practices in printed circuit assembly and implementing quality control measures, manufacturers can produce high-quality electronic systems that meet customer requirements and industry standards.

 

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What KAZ Circuit can do for you:

  • PCB Fabrication (prototype, small to medium, mass production)
  • Components Sourcing
  • PCB Assembly/SMT/DIP
  • Box building and testing

To get a full quotation of the PCB/PCBA, pls provide the information as below:

  • Gerber File, with detail specification of the PCB
  • BOM List (Better with excel fomart)
  • Photoes of the PCBA (If you have produced this PCBA before)

Company Informaiton:
 

KAZ Circuit has been operating as a manufacturer of PCB&PCBA since 2007. specialized in quick-turn manufacturing of prototypes and small to middle volume series of rigid, flex, rigid-flex and multilayer boards.

as well as aluminium substrate circuit board.we have a strong strength on fabrication of Roger board, MEGTRON MATERIAL board and 2&3 steps HDI boards and etc.

Beside with six SMT production lines and 2 DIP lines.we provide one-stop service to our customers as well.



Manufacturer Capacity:

Capacity Double Sided: 12000 sq.m / month
Multilayers: 8000sq.m / month
Min Line Width/Gap 4/4 mil (1mil=0.0254mm)
Board Thickness 0.3~4.0mm
Layers 1~30 layers
Material FR-4, Aluminum, PI,MEGTRON MATERIAL
Copper Thickness 0.5~4oz
Material Tg Tg140~Tg170
Max PCB Size 600*1200mm
Min Hole Size 0.2mm (+/- 0.025)
Surface Treatment HASL, ENIG, OSP


 

Company Details

Bronze Gleitlager

,

Bronze Sleeve Bushings

 and 

Graphite Plugged Bushings

 from Quality China Factory
  • Business Type:

    Manufacturer

  • Year Established:

    2007

  • Total Annual:

    8,800,000-11,000,000

  • Employee Number:

    300~350

  • Ecer Certification:

    Verified Supplier

In the year of 2024, SHENZHEN KAIZUO ELECTRONIC TECHNOLOGY CO., LTD (KAZ CIRCUIT) has joined Kingsum group (www.kingsumpcba.com), to seek for a larger market share from PCB manufacturing, component sourcing, pcb assembly, and box build assembly with better price and lead time. Founded in 2007, Ka... In the year of 2024, SHENZHEN KAIZUO ELECTRONIC TECHNOLOGY CO., LTD (KAZ CIRCUIT) has joined Kingsum group (www.kingsumpcba.com), to seek for a larger market share from PCB manufacturing, component sourcing, pcb assembly, and box build assembly with better price and lead time. Founded in 2007, Ka...

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Get in touch with us

  • Reach Us
  • ShenZhen KaiZhuo Electronic Technology Co.,Ltd
  • Room 502, 26# Building, Funing Hi-Tech Industrial Park, Fuhai Street, Bao'an, Shenzhen, Guangdong, China, 518103
  • https://www.smt-pcbassembly.com/

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