2L 1oz FR4 Green Soldmask SMT DIP Printed Circuit Board PCBA Manufacturer SMT

Product Specification

2L 1oz FR4 Green Soldmask SMT DIP Printed Circuit Board PCBA Manufacturer SMT PCB Assembly

Features

1. One Stop OEM Service: Made in Shenzhen of China
2. Manufactured by Gerber File and Bom LIst Offered by Customers
3. SMT, DIP Technology Support
4. FR4 Material Meet 94v0 Standard
5. UL,CE,ROHS Compliant
6. Standard Lead Time: 4-5days for 2L;5-7 for 4L. Expedited Service is available

Specifications

• Material: Shengyi FR4
• Finish Board Thickness: 1.6MM
• Finsh Copper Thickness: 1OZ
• Layer 2
• Solder Mask Color: GREEN
• Silkscreen: WHITE
• Surface Treatment: HASL LF
• Finished Size CUSTOMIZED

What KAZ Circuit can do for you:

• PCB manufacturing (prototype, small to medium, mass production)
• Components Sourcing
• PCB Assembly/SMT/DIP

To get a full quotation of the PCB/PCBA, pls provide the information as below:

• Gerber File, with detail specification of the PCB
• BOM List (Better with excel fomart)
• Photoes of the PCBA (If you have done this PCBA before)

Company Informaiton:
 

    KAZ Circuit is a professional PCB manufacturer from China since 2007, also provide PCB Assembly service for our customers. Now with about 300 employees. Certified with ISO9001,TS16949, UL, RoHS. We are confident to provide you quality products with factory-directed price within the fastest delivery time!

Manufacturer Capacity:

SMT PCB assembly procedure:

PCB Prep:

    Clean the PCB substrate to remove any contaminants that may affect solder joint quality.

    Apply solder mask to the PCB to identify copper pads where components will be placed.

    A surface treatment such as ENIG (Electroless Nickel Immersion Gold) is applied to the copper pads to promote solderability.

Solder paste print:

    Place the stencil over the PCB with the stencil's openings matching the PCB's copper pads.

    The solder paste (a mixture of solder alloy particles and flux) is scraped across the stencil, depositing the solder paste on the pads of the PCB.

    Precise control of stencil thickness, solder paste volume, and squeegee pressure are critical for consistent solder paste deposition.

Element placement:

    Automatic pick-and-place machines use vision systems to accurately identify component locations and place them on the solder paste.

    Component orientation, coplanarity, and positional accuracy are critical to reliable solder joints.

    Additional components such as connectors or heat sinks can be placed manually.

Reflow soldering

    PCB components are passed through a reflow oven with carefully controlled temperature profiles.

    The solder paste melts, moistening the component leads and PCB pads, and forms a solder joint as it cools.

    Different solder alloys, such as lead-free (such as tin-silver-copper), have specific reflow temperature profiles.

Inspection and Testing:

    Visual inspection (manual or automated) checks for proper component placement, solder joint quality, and potential defects.

    Automated optical inspection (AOI) systems use machine vision to quickly identify and locate any problems.

    Electrical testing, such as in-circuit testing (ICT) or functional testing, verifies the electrical performance of the PCB.

Clean and Conformal Coating (optional):

    PCB assemblies may undergo a cleaning process to remove any remaining solder paste or flux.

    Conformal coating is a polymeric protective layer that can be applied to PCBs to increase moisture and environmental resistance.

    SMT PCB assembly requires strict control over the entire process to ensure high quality and reliability of electronic products. Continuous improvements in automation, process control, and inspection technologies are critical to the widespread use of SMT in modern electronics manufacturing.

 Pictures