Product Specification

Scienscope X-RAY 3D AXI 8000 Fully Automatic

The Scienscope X-RAY 3D AXI 8000 Fully Automatic is an entirely automated 3D X-ray inspection system that utilizes sophisticated CT (Computed Tomography) technology. Think of it as a highly advanced scanner, providing a complete 360-degree view within your electronic components without requiring disassembly.

How does it work?

The Scienscope X-RAY 3D AXI 8000 Fully Automatic has an innovative system that captures projection mappings by rotating around the object in a full circle. Subsequently, it employs edge-scan and 3D analysis techniques to reconstruct all collected data. It's akin to creating a digital 3D replica that allows you to examine the internal structure from any perspective to identify even the tiniest defects.

What is 3D AXI?

3D Automated X-ray Inspection (AXI) represents a cutting-edge approach in electronics manufacturing, designed to deliver comprehensive evaluations of Printed Circuit Boards (PCBs). Unlike conventional 2D X-ray methods, 3D AXI leverages computed tomography (CT) to produce detailed, three-dimensional visualizations of the internal composition of electronic components and solder connections. This sophisticated technique allows for the identification of defects that are undetectable via 2D X-ray, including voids, misalignments, and inadequate solder application.

Scienscope X-RAY 3D AXI 8000 Fully Automatic Operational Mechanics

3D AXI systems function by capturing projection mappings through a complete 360-degree rotation around the subject object. Subsequently, edge-scan and 3D analytical techniques are employed to reconstruct the collected data, generating a virtual 3D model. This model can be examined from any angle to pinpoint even the most minute anomalies.

Technical Parameter

Scienscope X-RAY 3D AXI 8000 Fully Automatic Key Advantages

• Extensive Flaw Detection : Capable of identifying a broad spectrum of defects, such as issues in solder joint integrity, component displacement, air pockets, and concealed electrical short circuits.
• High-Resolution Imaging : Employs advanced X-ray cameras and sophisticated algorithms to secure detailed imagery, providing critical insights into the internal architecture and robustness of PCBs.
• Streamlined Efficiency and Usability : Equipped with intuitive interfaces and user-friendly software, facilitating straightforward operation and rapid inspection cycles to boost production throughput.
• Automated Calibration : Select systems feature the ability to automatically adjust inspection parameters to accommodate shifts in production items, thereby minimizing initial setup losses and the necessity for manual recalibrations.

Scienscope X-RAY AXI 8000 Essential Attributes & Specifications

• Complete 3D X-Ray Analysis : Offers full 3D reconstruction for thorough assessment.
• Non-Invasive Assessment : Allows for the inspection of circuit boards without inducing damage.
• Adaptable Layer Selection : Permits the selection of the necessary number of layers for examination.
• Customizable Resolution : Enables the adjustment of resolution based on the dimensions of components and solder balls, ensuring precision.
• Accelerated Edge Scanning : Incorporates rapid scanning and reconstruction technologies.
• Broad Ray Cone Angle : Delivers superior longitudinal resolution for enhanced inspection.

Scienscope X-RAY AXI 8000 Common Applications are:

• Inspection of Surface Mount Technology (SMT) and Through-Hole Components : Guarantees the quality of solder joints and the precision of component placement in both SMT and through-hole assemblies.
• Examination of Ball Grid Arrays (BGAs) and Press-Fit Connectors : Detects faults in BGA solder joints and verifies the integrity of press-fit connections.
• Dual-Sided PCB Analysis : Evaluates both faces of a double-sided PCB to ensure uniform quality standards.

Cutting-Edge Technologies

• Computed Tomography (CT) : Utilizes X-rays to create sectional images of an object, which are then compiled to form a 3D representation.
• High-Definition X-Ray Cameras : Capture intricate images of the internal structures of electronic parts.
• Automated Anomaly Recognition (AAR) : Employs software algorithms to automatically identify defects through image analysis.
• Real-Time Oversight and Management : Empowers operators to supervise the inspection process and implement adjustments as required.

Merits of Adopting 3D AXI

• Enhanced Quality Assurance : Identifies defects early in the production cycle, preventing the circulation of defective products.
• Amplified Productivity : Automates the inspection workflow, diminishing the reliance on manual labor and accelerating production speeds.
• Economical Benefits : Lowers waste and the necessity for rework by spotting defects before they escalate into significant problems.
• Heightened Dependability : Confirms that electronic goods adhere to the highest benchmarks of quality and reliability.

Conclusion

Scienscope X-RAY AXI 8000 3D AXI systems are indispensable for upholding the quality and dependability of electronic products. By supplying comprehensive three-dimensional imagery of internal structures, these systems enable manufacturers to uncover defects that might otherwise go unnoticed.

For inquiries, please contact us at +8613537875415 or Lizzy@smtlinemachine.com. Visit us at Xintian Industrial Area, Baoan, Shenzhen City, China.

Packaging and Delivery Information:

Delivery: Expect your order to arrive within 5-8 business days, though this timeframe can vary based on the quantity ordered.

Minimum Order: We accept orders for a single machine or mixed orders to suit your needs.

Transportation: Products are shipped either in bulk or via containers, depending on the order size and destination.

Payment Terms: Flexible payment options are available, including L/C, D/A, D/P, T/T, Western Union, and MoneyGram.

Price: Prices are negotiable to ensure you receive the best possible value.

Packaging: We offer both standard export boxes and robust hardwood packages to ensure your order arrives safely and securely.