Shenzhen Hongxinteng Technology Co., Ltd.
| Machine Type | SPI Equipment |
| Product name | 3D SPI Automatic Machine |
| Type | Automatic |
| Application | SMT PCB Solder paste test |
| Usage | SMD LED SMT |
| Place of Origin | Guangdong, China |
| Brand Name | Snicktek |
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Product Specification
| Machine Type | SPI Equipment | Product name | 3D SPI Automatic Machine |
| Type | Automatic | Application | SMT PCB Solder paste test |
| Usage | SMD LED SMT | Place of Origin | Guangdong, China |
| Brand Name | Snicktek | ||
| High Light | 3D Solder Paste Inspection Equipment ，High Speed Testing SPI Automatic Machine ，In-line SPI Automatic Machine | ||
High-Speed 3D Scanning Technology: Utilizes fast Moiré, phase-shift, or laser scanning to capture millions of data points in seconds, enabling sub-micron height resolution and high repeatability.
True Volumetric Measurement: Calculates the precise volume of each solder paste deposit, which is the most critical parameter for ensuring a reliable solder joint after reflow.
Ultra-Fast Throughput: High-speed cameras, optimized motion control, and efficient algorithms allow for cycle times often under 5-10 seconds per board, matching high-mix or high-volume production needs.
Automatic Programming & Alignment: Features like CAD import, automatic fiducial marking, and component library generation significantly reduce setup time for new products.
Closed-Loop Control Integration: Can communicate directly with solder paste printers (like DEK, Ekra, MPM) to automatically adjust stencil alignment, pressure, or squeegee speed to correct drifting processes in real-time.
Comprehensive Defect Detection: Identifies and classifies a wide range of paste printing defects including:
Insufficient/Excessive Paste: Low volume/high volume.
Height Variations: Bridges, insufficient height.
Shape Defects: Skewing, smear, dog-ears, scooping.
Presence/Absence: Missing deposits or gross misalignment.
User-Friendly Software: Intuitive GUI with SPC (Statistical Process Control) reporting, real-time dashboards, trend charts (Cp/Cpk), and detailed defect visualization for root cause analysis.
Robust Construction: Designed for 24/7 factory operation with stable granite bases, precision linear guides, and maintenance-friendly designs.
| Technology Platform | Type-B/C | Type-B/C | Super large platform |
| Series | Hero/Ultra | Hero/Ultra | 1.2m/1.5m series |
| Model | S8080/S2020/Hero/Ultra | S8080D/S2020D/HeroD/UltraD | L1200/DL1200/DL1500 |
| Measurement Principle | 3D white light PSLM PMP (Programmable Spatial Light Modulation, Phase Measurement Profilometry) | ||
| Measurements | Volume, area, height, XY offset, shape | ||
| Detection of Non-Performing Types | Missing printing, insufficient tin, excessive tin, bridging tin, offset, poor shape, board surface pollution | ||
| Lens Resolution | 4.5um/5um/6um/8um/10um/12um/15um/16um/18um/20um (Optional for different camera models) | ||
| Accuracy | XY (Resolution):10um | ||
| Repeatability | height:≤1um (4 Sigma);volume/acreage:<1%(4 Sigma); | ||
| Gage R&R | <<10% | ||
| Inspection Speed | 0.35sec/FOV-0.5sec/FOV (Determined according to actual configuration) | ||
| Quanlity of Inspection Head | Standard 1, optional 2, 3 | ||
| Mark-point Detection Time | 0.3sec/piece | ||
| Maximun Meauring Head | ±550um (±1200um as option) | ||
| Maximun Measuring Height of PCB Warp | ±5mm | ||
| Minimun Pad Spacing | 100um (pad height is 150um pad as reference) 80um/100um/150um/200um (determined according to actual configuration) | ||
| Minimum element | 01005/03015/008004 (Optional) | 01005/03015/008004 (Optional) | 201 |
| Maximun Loading PCB Size(X*Y) | 450x500mm(B) 470x500mm (C) (Measurable range 630x550mm Large platform) |
450x310+450x310(B) 470x310+470x310(C) 630x310+630x310 (Large platform ) |
1200x650mm (measurable range 1200x650mm one-stage) 600x2x650mm (Measurable range 1200x550mm two-stage) |
| Conveyor Setup | front orbit (back orbit as option) | 1 front orbit , 2,3,4 Dynamic Orbit | front orbit (back orbit as option) |
| PCB Transfer Direction | Left to right or Right to left | ||
| Conveyor Width Adjustment | manual & automatic | ||
| SPC/Engineering Statistics | Histogram；Xbar-R Chart；Xbar-S Chart；CP&CPK；%Gage Repartability Data；SPI Daily/Weekly/Monthly Reports | ||
| Gerber & CAD Data Import | Support Gerber format (274x, 274d), manual teach mode, CAD X/Y, Part No., Package Type, etc. import | ||
| Operating System Support | Windows 10 Professional (64 bit) | ||
| Equipment Diemension and Weight | W1000xD1150xH1530(B), 965Kg W1000xD1174xH1550(C), 985Kg |
W1000xD1350xH1530(B) ,1200Kg W1000xD1350xH1550(C) ,1220Kg |
W1730xD1420xH1530mm (one-stage), 1630Kg W1900xD1320xH1480mm two-stage), 1250Kg W2030xD1320xH1480(1500), 1450Kg |
| Optional | 1 with multiple centralized control software, network SPC software, 1D/2D Barcode scanner, offline programming software, UPS uninterruptible power supply | ||
SINICTEK SPI machines are essential in modern electronics manufacturing where high first-pass yield is critical. Key application areas include:
High-Reliability Industries: Automotive electronics, aerospace, medical devices, and military hardware where zero defects are paramount.
Advanced Packaging: For processes like System-in-Package (SiP) and flip-chip where paste volume control is extremely sensitive.
Miniaturized Components: Essential for inspecting ultra-fine pitch components such as 01005 chips, microBGAs, and QFNs where printing defects are common and hard to see.
Lead-Free & Challenging Pastes: Inspecting the behavior of no-clean, lead-free, or high-viscosity solder pastes which can be harder to print consistently.
Process Monitoring & Optimization: Used as a core tool for SPC, providing data to optimize stencil design, printer parameters, and paste formulations, reducing rework costs and improving overall line efficiency.
Any SMT Line Aiming for "Zero Defect" Manufacturing: Implementing SPI is a foundational step towards a fully automated, data-driven smart factory (Industry 4.0) by providing the critical process feedback loop at the very first step of the SMT process.
Company Details
Business Type:
Manufacturer
Year Established:
2008
Total Annual:
5000000-8000000
Employee Number:
100~150
Ecer Certification：
Verified Supplier
Established in 2008, Shenzhen Hongxinteng Technology Co., Ltd. is a leading manufacturer of Surface Mount Technology (SMT) machines, providing comprehensive solutions for the PCB and electronic manufacturing industries with competitive price supplier in China. We specialize in the design, produ... Established in 2008, Shenzhen Hongxinteng Technology Co., Ltd. is a leading manufacturer of Surface Mount Technology (SMT) machines, providing comprehensive solutions for the PCB and electronic manufacturing industries with competitive price supplier in China. We specialize in the design, produ...
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