Shenzhen Hongxinteng Technology Co., Ltd.
| Payment Terms | T/T |
| Supply Ability | The production capacity is 100 units a month |
| Delivery Time | 5-15 |
| Packaging Details | Vacuum packing plus wooden box packing |
| Name | BGA Rework Station Machine |
| Supplier | HXT |
| Model number | DH-A2E |
| Function | Fully automatic |
| Usage | SMT Production Line |
| PCB size L*W (mm) | 370mm-370mm |
| Power | 220V/50HZ |
| Warranty | 1 Year |
| Dimension L*W*H(mm) | 600mm x 700mm x 850mm |
| Weight (kg) | 70kg |
| Package | Wooden Box Packaging |
| Brand Name | HXT |
| Model Number | RF-A500 |
| Certification | CE |
| Place of Origin | China |
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Product Specification
| Payment Terms | T/T | Supply Ability | The production capacity is 100 units a month |
| Delivery Time | 5-15 | Packaging Details | Vacuum packing plus wooden box packing |
| Name | BGA Rework Station Machine | Supplier | HXT |
| Model number | DH-A2E | Function | Fully automatic |
| Usage | SMT Production Line | PCB size L*W (mm) | 370mm-370mm |
| Power | 220V/50HZ | Warranty | 1 Year |
| Dimension L*W*H(mm) | 600mm x 700mm x 850mm | Weight (kg) | 70kg |
| Package | Wooden Box Packaging | Brand Name | HXT |
| Model Number | RF-A500 | Certification | CE |
| Place of Origin | China | ||
| High Light | Lead Free Reflow Oven ，Mini Desktop SMT Soldering Machine ，Dual Heating System PCB Assembly Machine | ||
Desktop Reflow Oven Machine For Pcb Smt Soldering Production Line
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The Mini Desktop Reflow Oven is a professional-grade, compact thermal processing solution designed for prototyping, low-volume SMT assembly, and R&D. It combines space-saving design with industrial performance, featuring an advanced Dual Heating System that merges Strong 3D Hot Air Circulation with Super Infrared Radiation Heating. This innovative technology ensures precise, even, and efficient heat distribution across the entire PCB, achieving perfect solder reflow profiles for a wide range of lead-free and leaded solders. It is the ideal tool for engineers, labs, makerspaces, and small-batch production.
| Model | RF-A200 | RF-A250 | RF-A350 | RF-A500 |
| Power Supply | AC220V+10% 50Hz (AV110V Custom-Made) | |||
| Max Power | 700W | 1600W | 2400W | 3600W |
| Heating Method | Infrared Radiation Heating | Infrared Radiation Heating and Hot Air Circulation | ||
| Effective Welding Area | 200x150mm | 250x200mm | 350x300mm | 500x400mm |
| Drawer Size | L250xW180xH20mm | L300xW250xH30mm | L400xW330xH30mm | L550xW430xH30mm |
| Remark: Regard these sizes as valid welding area, please pay attention and distinguish | ||||
| Operating System | Chinese and English Bilingual Language Operate System | |||
| Display Mode | Graph Mode/Text Mode and Display Mode Optional | |||
| Temperature Range | Room Temperature -300'C | |||
| Temperature Curve Zones | Preheating Zone, Heating Zone, Holding Zone and Cooling Zone Totally Five Zones | |||
| Outline Size (LxWxH) | 375 x 350 x 312mm | 425 x 400 x 312 mm | 525 x 500 x 312 mm | 675 x 600 x 312 mm |
| Weight | 13.5kg | 19kg | 24.9KG | 37.1kg |
1. Advanced Dual Heating System
Strong 3D Hot Air Circulation + Super Infrared Radiation Heating: This hybrid technology delivers rapid, uniform heating from all directions. The infrared radiation provides direct, efficient energy transfer to components and the board, while the forced 3D hot air eliminates cold spots, ensuring every part of the assembly reaches the target temperature simultaneously.
2. Superior Thermal Performance
Heat Circulates Evenly: Patented airflow design and strategically placed heating elements guarantee a consistent temperature gradient across the entire heating chamber, critical for complex or densely populated boards.
Full Utilization of Thermal Energy: The system minimizes heat loss, translating to faster heating rates, lower energy consumption, and reduced operating costs.
Balanced Heating: Prevents component damage (tombstoning, cracking) caused by uneven thermal expansion, ensuring higher first-pass yield.
3. Optimal Welding Quality
Precision Profile Control: Achieves perfect reflow curves (preheat, soak, reflow, cooling) for various solder pastes, resulting in shiny, reliable solder joints with minimal voids.
Consistent, Repeatable Results: Essential for process control and quality assurance in professional settings.
4. User-Centric Design & Control
Intuitive Touchscreen/Controller: Easily set, store, and monitor custom reflow profiles.
Compact Desktop Footprint: Saves valuable bench space without compromising on chamber size.
Robust Safety Features: Includes over-temperature protection, automatic cooling, and safety lock.
Widely used in electronics manufacturing, consumer electronics, automobile electronics, communications equipment, aerospace, medical equipment, LED lamps, computers and peripherals, smart home, smart logistics, miniature and high power ratio electronic devices.
Company Details
Business Type:
Manufacturer
Year Established:
2008
Total Annual:
5000000-8000000
Employee Number:
100~150
Ecer Certification：
Verified Supplier
Established in 2008, Shenzhen Hongxinteng Technology Co., Ltd. is a leading manufacturer of Surface Mount Technology (SMT) machines, providing comprehensive solutions for the PCB and electronic manufacturing industries with competitive price supplier in China. We specialize in the design, produ... Established in 2008, Shenzhen Hongxinteng Technology Co., Ltd. is a leading manufacturer of Surface Mount Technology (SMT) machines, providing comprehensive solutions for the PCB and electronic manufacturing industries with competitive price supplier in China. We specialize in the design, produ...
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