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Shenzhen Hongxinteng Technology Co., Ltd.

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China High Precision Semiconductor Equipment Die Bonding Machine Fully Automatic
China High Precision Semiconductor Equipment Die Bonding Machine Fully Automatic

  1. China High Precision Semiconductor Equipment Die Bonding Machine Fully Automatic
  2. China High Precision Semiconductor Equipment Die Bonding Machine Fully Automatic

High Precision Semiconductor Equipment Die Bonding Machine Fully Automatic

  1. MOQ: 1
  2. Price: 28000
  3. Get Latest Price
Payment Terms T/T
Supply Ability The production capacity is 50 units a month
Delivery Time 25-30
Packaging Details Vacuum packing plus wooden box packing
Application COB Light source
Name Semiconductor die Bonder smt Machine
Maximum board size 500mmx120mm
Condition Original new
Usage SMD LED SMT
core components PLC, Engine, Bearing, Gearbox, motor, Pressure vessel, Gear, Pump
Brand HOSON
Brand Name HOSON
Model Number GTS80AH-I
Certification CE
Place of Origin China

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  1. Product Details
  2. Company Details

Product Specification

Payment Terms T/T Supply Ability The production capacity is 50 units a month
Delivery Time 25-30 Packaging Details Vacuum packing plus wooden box packing
Application COB Light source Name Semiconductor die Bonder smt Machine
Maximum board size 500mmx120mm Condition Original new
Usage SMD LED SMT core components PLC, Engine, Bearing, Gearbox, motor, Pressure vessel, Gear, Pump
Brand HOSON Brand Name HOSON
Model Number GTS80AH-I Certification CE
Place of Origin China

Semiconductor Equipment Die Bonding Machine Fully Automatic Double Swing  Die Bonder Die Bonding Machine


Strip Die Bonder-Dual Dispensing

Machine Features
● Front-loading and rear-loading methods, compatible with a docking station, facilitate operator operation and connection, improving production cycle time;
● Utilizes internationally leading dual die bonding, dual dispensing, and dual wafer search systems;
● Utilizes a direct-drive motor to drive the bonding head;
● Utilizes a linear motor to drive the wafer search platform (X/Y) and feed platform (B/C);
● Utilizes an automatic angle correction system for the wafer frame;
● Equipped with an automatic wafer ring loading and unloading system, effectively improving production efficiency;
● Precision automation equipment effectively ensures that businesses improve production efficiency and reduce costs, thereby effectively enhancing their competitiveness.


Mainly used in flip-chip applications such as 0.5-meter flexible light strips

Cycle: 150ms


Product specification

Production Cycle 150ms cycle depends on chip size and bracket
XY Accuracy ±1mil(±0.025mm)
Die Rotation ±3°
Die XY Workbench
Die Dimensions 3mil×3mil-80mil×80mil (0.076mm*0.076mm-2mm*2mm)
Max. Angle Correction ±15°
Max. Die Ring Size 6″ (152mm) outer diameter
Max. Die Area 4.7″ (119mm) after expansion
Resolution Ratio 0.04mil  (1μm)
Thimble Z Height Stroke 80mil(2mm)
Image Recognition System
Grey Scale 256 (Level Grey)
Resolution 720(H)×540(V)(Pixels)
Die Bonder’s Swing Arm-and-hand system
Swing Arm of Die Bonder 105° rotatable die bonding
Die Bond Pressure Adjustable 30g-250g
Loading Workbench
Range of Stroke 500mmx120mm
XY Resolution 0.02mil(0.5μm)
Suitable Holder’s Size
Length 300mm-500mm
Width 80mm-120mm
Facilities Needed
Voltage/Frequency 220V AC±5%/50HZ
Compressed Air 0.5MPa(MIN)
Rated Power 1200W
Gas Consumption 40L/min
Volume and Weight
Length x Width x Height 1900×980×1620mm
Weight 1200KG


Applications:

For LED packaging, screen display field, consumer electronics, smart home, intelligent lighting and other fields of high-precision & high-speed solidification equipment.

Applicable products: LED 2835,5050,21211010,0603,020, semiconductor and COB LED products such as solid crystal.



Company Details

Bronze Gleitlager

,

Bronze Sleeve Bushings

 and 

Graphite Plugged Bushings

 from Quality China Factory
  • Business Type:

    Manufacturer

  • Year Established:

    2008

  • Total Annual:

    5000000-8000000

  • Employee Number:

    100~150

  • Ecer Certification:

    Verified Supplier

Established in 2008, Shenzhen Hongxinteng Technology Co., Ltd. is a leading manufacturer of Surface Mount Technology (SMT) machines, providing comprehensive solutions for the PCB and electronic manufacturing industries with competitive price supplier in China. We specialize in the design, produ... Established in 2008, Shenzhen Hongxinteng Technology Co., Ltd. is a leading manufacturer of Surface Mount Technology (SMT) machines, providing comprehensive solutions for the PCB and electronic manufacturing industries with competitive price supplier in China. We specialize in the design, produ...

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Get in touch with us

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  • Shenzhen Hongxinteng Technology Co., Ltd.
  • Building No. 142 / B311, Songyu Road, Hongxing Community, Songgang Street, Baoan District, Shenzhen China.
  • https://www.smtpcbmachines.com/

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