Shenzhen Hongxinteng Technology Co., Ltd.
| Payment Terms | T/T |
| Supply Ability | 1000 unit / month |
| Delivery Time | 10-15 days |
| Packaging Details | Wodden box |
| Weight | 1050kg |
| Voltage | AC110-220V 50-60HZ |
| Spatial resolution | 3 μm |
| Tube voltage | 130kv |
| Tube current | 300μA |
| Imaging precision | Flat-panel Digital |
| A/D convert density | 16bit (65536) |
| DPI | 1536*1536px |
| Frame frequency | 20 FPS |
| Optical magnification | 450X |
| System magnification | 2000X |
| Power | 1200W |
| Machine size | L1098 x W1389 x H2157mm |
| Place of Origin | Guangdong, China |
| Brand Name | rmi |
| Model Number | X-7900 |
| Certification | CE |
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Product Specification
| Payment Terms | T/T | Supply Ability | 1000 unit / month |
| Delivery Time | 10-15 days | Packaging Details | Wodden box |
| Weight | 1050kg | Voltage | AC110-220V 50-60HZ |
| Spatial resolution | 3 μm | Tube voltage | 130kv |
| Tube current | 300μA | Imaging precision | Flat-panel Digital |
| A/D convert density | 16bit (65536) | DPI | 1536*1536px |
| Frame frequency | 20 FPS | Optical magnification | 450X |
| System magnification | 2000X | Power | 1200W |
| Machine size | L1098 x W1389 x H2157mm | Place of Origin | Guangdong, China |
| Brand Name | rmi | Model Number | X-7900 |
| Certification | CE | ||
| High Light | 3um Accuracy X-Ray Inspection System ，2000X Magnification X-Ray Tester ，PCB BGA Lithium Battery Testing X-Ray Testing Equipment | ||
The Industrial SMT X-Ray Inspection System is a high-precision non-destructive testing (NDT) solution designed for modern electronics manufacturing. Ideal for PCB assembly lines, R&D labs, and small-batch production, this system delivers automated detection of hidden defects such as BGA solder joint cracks, IC welding voids, and head-in-pillow failures. Available with 110kV closed tube or 150kV open tube options, and resolution down to 2µm, it ensures zero-defect quality control for automotive, semiconductor, consumer electronics, and medical devices.
✅ Advanced Imaging Technology
2µm high-resolution microfocus X-ray tube captures fine details of BGA, QFN, and flip-chip solder joints.
Optional 3D CT (computed tomography) inspection provides cross-sectional views for void volume analysis and solder paste quality evaluation.
✅ Flexible Operation Modes
Manual mode for R&D and failure analysis.
Automated (AXI) mode for high-volume PCB production lines, with programmable inspection paths and auto defect recognition (ADR).
✅ Precision Manipulation
5-axis manipulator (X, Y, Z, tilt, rotation) enables inspection of components from any angle, eliminating blind spots under shields, connectors, and heatsinks.
✅ User-Friendly Software
Intuitive interface with BGA void calculation, solder joint measurement, and pass/fail statistics.
Data export for SPC (statistical process control) and traceability.
✅ Compact & Benchtop Options
Space-saving benchtop design available for laboratories and low-volume assembly.
Inline conveyor type for fully automated SMT lines.
| Model | X-7900 |
| Tube Type | Enclosed Type |
| Spatial Resolution | 3 μm |
| Tube Voltage | 130kV |
| Tube Current | 300μA |
| Image Taking Type | Flat-panel Digital |
| Imaging Precision | 85μm |
| A/D Convert Quantified Density Value | 16bit (65536) |
| DPI | 1536*1536px |
| Frame Frequency | 20 FPS |
| Optical Magnification | 450X |
| System Magnification | 2000X |
| Operating System | Windows 11 |
| Power Supply | AC110-220V 50-60HZ |
| Power Consumption | 1200W |
| Radiation Safety Test | <1 μSV/H |
| Detector Rotation Angle | 60° |
| Stage Size | 540*540mm |
| Sensing Range | 510*510mm |
| Load-bearing Capacity | ≤10kg |
| Machine Size | 1098*1389*2157mm (L*W*H) |
| Machine Size (Including Monitor) | 1601*1920*2157mm (L*W*H) |
| Machine Weight | 1050kg |
| Stage Movement | Automatic / Manual |
PCB Assembly: Inspection of BGA, CSP, QFN, LGA, PoP, and through-hole solder joints.
Semiconductor: Die attach, wire bonding, and void detection in power modules.
Automotive Electronics: Solder quality control for ECUs, LiDAR, and battery management systems.
Medical Devices: High-reliability component inspection.
R&D & Failure Analysis: Root cause analysis of soldering defects.
Reduce rework costs by catching hidden defects early.
Increase throughput with automated inspection routines.
Meet industry standards (IPC-A-610, ISO 9001).
Global support with CE, FCC, and ROHS certifications.
Main X-ray inspection unit
Industrial control PC with pre-installed software
Calibration tool kit
Operation manual and safety guide
One-year warranty and remote technical support
Company Details
Business Type:
Manufacturer
Year Established:
2008
Total Annual:
5000000-8000000
Employee Number:
100~150
Ecer Certification：
Verified Supplier
Established in 2008, Shenzhen Hongxinteng Technology Co., Ltd. is a leading manufacturer of Surface Mount Technology (SMT) machines, providing comprehensive solutions for the PCB and electronic manufacturing industries with competitive price supplier in China. We specialize in the design, produ... Established in 2008, Shenzhen Hongxinteng Technology Co., Ltd. is a leading manufacturer of Surface Mount Technology (SMT) machines, providing comprehensive solutions for the PCB and electronic manufacturing industries with competitive price supplier in China. We specialize in the design, produ...
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