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Shenzhen Hongxinteng Technology Co., Ltd.

  • China,Shenzhen
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China Fully Automatic High Precision Flip Chip Die Bonder Machine SMT Production Line
China Fully Automatic High Precision Flip Chip Die Bonder Machine SMT Production Line

  1. China Fully Automatic High Precision Flip Chip Die Bonder Machine SMT Production Line
  2. China Fully Automatic High Precision Flip Chip Die Bonder Machine SMT Production Line
  3. China Fully Automatic High Precision Flip Chip Die Bonder Machine SMT Production Line
  4. China Fully Automatic High Precision Flip Chip Die Bonder Machine SMT Production Line

Fully Automatic High Precision Flip Chip Die Bonder Machine SMT Production Line

  1. MOQ: 1
  2. Price: $28,000-28,500
  3. Get Latest Price
Payment Terms T/T
Supply Ability 50
Delivery Time 20day
Packaging Details Vacuum Wooden Box Packaging
Weight 1200KG
Cycle Time 150ms
Die Dimensions 0.076mm*0.076mm-2mm*2mm
Name Flip Chip Die Bonder Machine
Application LED Chip Manufacturing
Type SMT Production Line
Brand Name GKG
Certification ce
Place of Origin China

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  1. Product Details
  2. Company Details

Product Specification

Payment Terms T/T Supply Ability 50
Delivery Time 20day Packaging Details Vacuum Wooden Box Packaging
Weight 1200KG Cycle Time 150ms
Die Dimensions 0.076mm*0.076mm-2mm*2mm Name Flip Chip Die Bonder Machine
Application LED Chip Manufacturing Type SMT Production Line
Brand Name GKG Certification ce
Place of Origin China
High Light High‑Precision Flip Chip Die BonderFlip Chip Die Bonder MachineDie Bonder Machine SMT Production Line
Fully Automatic High Precision Die Bonder Machine SMT Production Line for Semiconductor Packaging Chip Mounting
Machine Features
  • Front-loading and rear-loading methods, compatible with docking station for improved operator efficiency and production cycle time
  • Internationally leading dual die bonding, dual dispensing, and dual wafer search systems
  • Direct-drive motor for bonding head operation
  • Linear motor driven wafer search platform (X/Y) and feed platform (B/C)
  • Automatic angle correction system for wafer frame
  • Automatic wafer ring loading/unloading system for enhanced production efficiency
  • Precision automation ensures improved production efficiency and reduced operational costs
Technical Specifications
Production Cycle 150ms (depends on chip size and bracket)
XY Accuracy ±1mil (±0.025mm)
Die Rotation ±3°
Die XY Workbench
Die Dimensions 3mil*3mil-80mil*80mil (0.076mm*0.076mm-2mm*2mm)
Max. Angle Correction ±15°
Max. Die Ring Size 6″ (152mm) outer diameter
Max. Die Area 4.7″ (119mm) after expansion
Resolution Ratio 0.04mil (1μm)
Thimble Z Height Stroke 80mil (2mm)
Image Recognition System
Grey Scale 256 (Level Grey)
Resolution 720(H)*540(V)(Pixels)
Die Bonder's Swing Arm-and-hand System
Swing Arm of Die Bonder 105° rotatable die bonding
Die Bond Pressure Adjustable 30g-250g
Loading Workbench
Range of Stroke 500mm*120mm
XY Resolution 0.02mil (0.5μm)
Suitable Holder's Size
Length 300mm-500mm
Width 80mm-120mm
Facilities Needed
Voltage/Frequency 220V AC±5%/50HZ
Compressed Air 0.5MPa (MIN)
Rated Power 1200W
Gas Consumption 40L/min
Volume and Weight
Dimensions (L*W*H) 1900*980*1620mm
Weight 1200KG
Die Bonder Machine side view
Frequently Asked Questions
Is this machine easy to operate for first-time users?

An English manual and guide video are provided to demonstrate machine operation. For additional questions, contact us via email, Skype, phone, or our online trade manager service.

What if the machine has problems after delivery?

We provide free replacement parts during the warranty period. For parts under 0.5KG, we cover postage; for heavier parts, the customer pays shipping.

What is the minimum order quantity?

Minimum order is 1 machine, and mixed orders are welcome.

How can I purchase this machine?
  1. Consult with us online or via email
  2. Negotiate and confirm final price, shipping, and payment terms
  3. Receive and confirm proforma invoice
  4. Make payment as specified
  5. We prepare your order after full payment confirmation
  6. 100% quality check before shipping
  7. Delivery by air or sea
Why choose our company?
  1. We are the actual manufacturers
  2. Over ten years of experience in the machine industry
  3. Commitment to high quality and timely delivery
  4. 24-hour after-sales support

Company Details

Bronze Gleitlager

,

Bronze Sleeve Bushings

 and 

Graphite Plugged Bushings

 from Quality China Factory
  • Business Type:

    Manufacturer

  • Year Established:

    2008

  • Total Annual:

    5000000-8000000

  • Employee Number:

    100~150

  • Ecer Certification:

    Verified Supplier

Established in 2008, Shenzhen Hongxinteng Technology Co., Ltd. is a leading manufacturer of Surface Mount Technology (SMT) machines, providing comprehensive solutions for the PCB and electronic manufacturing industries with competitive price supplier in China. We specialize in the design, produ... Established in 2008, Shenzhen Hongxinteng Technology Co., Ltd. is a leading manufacturer of Surface Mount Technology (SMT) machines, providing comprehensive solutions for the PCB and electronic manufacturing industries with competitive price supplier in China. We specialize in the design, produ...

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Get in touch with us

  • Reach Us
  • Shenzhen Hongxinteng Technology Co., Ltd.
  • Building No. 142 / B311, Songyu Road, Hongxing Community, Songgang Street, Baoan District, Shenzhen China.
  • https://www.smtpcbmachines.com/

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