Product Specification

Automatic SMT Machines For LED Production Pick and Place Machine HCT-610LV LED Chip Mounter Machine SMT PCB Assembly Line

Description

Full Automatic SMT Machines Assembly Line  

This state-of-the-art SMT (Surface Mount Technology) assembly line is engineered for high-volume, precision-driven electronics manufacturing, integrating advanced automation to streamline PCB assembly from solder paste printing to final quality testing supporting components as small as 0402 (0.4mm x 0.2mm). The line includes five core machines: Automatic solder paste printer machine, HCT-530LV pick and place machine, HXT reflow oven machine, HXT unloader machine and HXT DOB LED Testing Machine.

HXT Automatic Solder Paste Printer

Function: Applies solder paste to PCB pads with micron-level accuracy to prepare for component placement.  

Key Specifications:

  - PCB Capacity: Supports boards up to 520 × 400 mm and thicknesses from 0.4mm to 6mm.  

  - Stencil Frame: Accommodates frames up to 800 × 700 mm for large or multi-panel PCBs.  

  - Speed: Programmable conveyor speed up to 1000 mm/s and printing speed adjustable between 10–200 mm/sec.  

  - Power & Dimensions: Operates on AC 220V ±10%, 2KW single-phase power, housed in a compact 1180mm × 1120mm × 1480 mm chassis.

SMT Pick and Place Machine HCT-610LV

- Function: Precision placement of surface-mount components onto PCBs.  

- Key Specifications:  

  - Speed: 55,000 CPH with 10 placement heads for rapid throughput.  

  - Component Range: Handles 0603-sized chips (0.6 × 0.3 mm) to large 74mm × 74 mm modules and high-power LEDs.  

  - Vision System: Equipped with a flying camera for real-time component alignment and inspection.  

  - Workspace: 600mm × 500 mm SMD area for large or multi-board panels.  

  - Power and Build: Requires 0.55 MPa air pressure, housed in a rugged 1230mm × 1530mm × 1360 mm frame weighing 1600 kg.

HXT Reflow Oven Machine 8 Zone

- Function: Melts solder paste to form permanent electrical connections between components and PCBs.  

- Key Specifications:  

  - Heating Zones: 8 zones (8 upper/ 8 lower) over 2800 mm, enabling precise thermal profiling.  

  - Cooling Zone: 350 mm section with fans for controlled cooling to prevent warping.  

  - Conveyor System: Chain-driven transport adjustable from 0–2000 mm/min, handling PCBs up to 350 mm wide.  

  - Temperature Control: Range up to 350°C, with 3-phase 380V power and 6–10 KW operating consumption.  

  - Footprint: 4800mm × 1200mm × 1350 mm, designed for high-throughput environments.  

HXT Unloader Machine  

- Function: Automatically offloads processed PCBs post-reflow for downstream handling.  

- Key Specifications:  

  - Modular Design: Configurable with 1–4 tables and 1–2 robotic arms to match production demands.  

  - PCB Compatibility: Manages single-sided LED boards and standard PCBs, including long boards up to 1.2 meters.  

  - Flexibility: Small PCBs use 4 arms with 4 tables for parallel processing; larger boards use 1–2 arms with 1–2 tables.

HXT DOB LED Testing Machine  

- Function: Validates LED light source performance and electrical functionality.  

- Key Specifications:  

  - Speed: Tests 5 small panels in 3 seconds, achieving 6,000 units/hour.  

  - Product Size: Accommodates components from 260 mm to 350 mm.  

  - Control System: 7-inch HMI (Human-Machine Interface) with PLC for automated test sequences.  

  - Power & Build: Runs on AC220V, 50Hz, housed in a 96 × 102 × 147.7 cm stand-type unit weighing 125 kg.

Applications:

LED Manufacturing: High-speed assembly and testing of LED panels and automotive lighting systems.