LPM1040/1045 Series Shielded SMD Power Inductor for High Current POL Converters

LPM1040/1045 Series high current power inductors

The LPM1040/1045 series shielded SMD power inductor features a composite structure and shielded design, offering the lowest height in its package size, the lowest DCR/μH in its package size, and high-frequency response, effectively handling high transient current spikes without saturation.The composite structure significantly reduces audible noise, making it suitable for noise-sensitive applications.It is widely used in PDA/laptops/desktops/servers, high-current POL converters, low-profile high-current power supplies, battery-powered devices, distributed power systems, and DC-DC converters for FPGA power supplies. It is an ideal choice for compact high-density power supply designs.

FEATURES:

• Shielded construction
• Lowest height in this package footprint.
• Shielded construction.
• Lowest DCR/H, in this package size.
• Handles high transient current spikes without saturation.
• Ultra low buzz noise, due to composite construction.
• Frequency up to 5MHz.

APPLCATIONS:

• PDA/notebook/desktop/server applications
• High current POL converters
• Low profile, high current power supplies
• Battery powered devices
• DC/DC converters in distributed power systems
• DC/DC converter for Field Programmable Gate Array (FPGA)
• Applications usedin power switching
• Personal computers and other handheldelectronic equipment.

NOTES:·

• Test Frequency : 100KHz / 0.25Vdc
• Testing Instrument : L:HP4284A, CH11025,CH3302, CH1320, CH1320S LCR METER/Rdc:CH16502, Agilent33420A MICRO OHMMETER.
• Heat Rated Current (Irms) will cause the coil temperature rise approximately,△T=40℃ without core loss.
• Saturation Current (Isat) will cause L0 to drop approximately 20%
• The part temperature (ambient + temp rise) should not exceed 125℃ under worst case operating conditions. Circuit design, component, PCB trace size and thickness, airflow and other cooling provisions all affect the part temperature. Part temperature should be verified in the end application.
• Operating Temperature & Storage Temperature: -40℃ - +105℃.

Note: Product specifications can be customized.

FAQ

Q: How does the composite structure reduce audible noise?

A: The composite structure uses special core materials and filling processes to effectively reduce vibration caused by the magnetostrictive effect. This significantly reduces audible noise in the audible frequency range, making it especially suitable for noise-sensitive portable devices and consumer electronics applications.

Q: What are the advantages of the lowest height design in its package size?

A: The lowest height design in its package size saves PCB vertical space, making it especially suitable for height-constrained compact device designs, meeting the trends of miniaturisation and slim form factors without compromising power handling capability.

Q: What does the lowest DCR/μH in its package size mean?

A: The lowest DCR/μH in its package size means this inductor offers the lowest DC resistance and power loss per microhenry in the same package size, ensuring high conversion efficiency and low heat generation. It is suitable for high-density power supply designs with strict efficiency and thermal management requirements.

Q: What are the advantages of the shielded structure?

A: The shielded structure uses a closed magnetic circuit design to confine magnetic flux inside the core. It effectively reduces leakage flux and electromagnetic interference to nearby sensitive circuits, improving system EMC performance.