| Packaging Details | Carton packaging |
| Supply Ability | 200pcs |
| Delivery Time | 5-7 work days |
| Description | DL360GEN9 8SFF |
| Hard Disk Slot | Up to 4 LFF SAS/SATA/SSD (3.5”) |
| Management | HPE iLO (Integrated Lights-Out) Management |
| Drive Bays | 8*2.5 Hot Swap |
| Cpu | AMD EPYC™ 7000 Series |
| Nvdimm Capacity | 16 GB |
| Memory Capacity | 32 GB |
| Pcie | PCIE4.0 |
| Brand Name | HPE |
| Model Number | HPE ProLiant DL345 Gen12 |
| Place of Origin | CHINA |
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Product Specification
| Packaging Details | Carton packaging | Supply Ability | 200pcs |
| Delivery Time | 5-7 work days | Description | DL360GEN9 8SFF |
| Hard Disk Slot | Up to 4 LFF SAS/SATA/SSD (3.5”) | Management | HPE iLO (Integrated Lights-Out) Management |
| Drive Bays | 8*2.5 Hot Swap | Cpu | AMD EPYC™ 7000 Series |
| Nvdimm Capacity | 16 GB | Memory Capacity | 32 GB |
| Pcie | PCIE4.0 | Brand Name | HPE |
| Model Number | HPE ProLiant DL345 Gen12 | Place of Origin | CHINA |
| High Light | 8TB DDR5 HPE ProLiant Server ,AMD EPYC HPE ProLiant Server ,1U Rack hpe proliant dl345 | ||
Hpe Proliant Server Dl345 Gen12 1U Rack Amd Epyc 8Tb Ddr5 High Performance
Product Description
The HPE ProLiant Compute DL360 Gen12 is a 1U dual‑socket rack server powered by Intel Xeon 6 processors (up to 144 cores, 350W TDP) with 32 DDR5 DIMM slots (up to 8TB at 6400 MT/s). It features flexible front storage (10 SFF, 4 LFF, or 20 EDSFF), PCIe 5.0 expansion, and support for up to 3 NVIDIA L4 GPUs. With iLO 7, Silicon Root of Trust 2.0, and optional direct liquid cooling (DLC), the DL360 Gen12 delivers high density, AI‑driven automation, and next‑gen security for virtualization, hybrid cloud, and HPC.
Key Differentiators
Dual Intel Xeon 6 (up to 144 cores, 350W TDP) — 2× average performance gain
32 x DDR5 DIMM slots — up to 8TB at 6400 MT/s, 14% memory bandwidth increase
Flexible front bays: 10 SFF, 4 LFF, or 20 EDSFF E3.S NVMe
Up to 3 single‑width NVIDIA L4 GPUs
3 x PCIe 5.0 + 2 x OCP 3.0 slots
Air, closed‑loop liquid, or direct liquid cooling (DLC)
iLO 7 with Secure Enclave, iLO firmware intrusion protection, full recovery
Silicon Root of Trust 2.0 — chip‑rooted tamper‑proof chain
SPDM authentication for NICs and storage controllers
ASHRAE A3/A4 support — higher temperature operation
Optional Energy Star certification
Specifications
| Category | Specification |
|---|---|
| Model | HPE ProLiant Compute DL360 Gen12 |
| Form Factor | 1U rackmount, dual‑socket |
| CPU | Intel Xeon 6 (E‑core / P‑core) |
| Max Cores | Up to 144 cores |
| Max CPU TDP | 350W |
| Memory Slots | 32 x DDR5 DIMM |
| Max Memory | 8TB at 6400 MT/s |
| Front Storage Options | 10 SFF, 4 LFF, or 20 EDSFF E3.S NVMe |
| Storage Controllers | MR Gen11 Smart Array / Intel VROC / NS204i‑u V2 |
| GPU Support | Up to 3 single‑width NVIDIA L4 |
| PCIe Slots | 3 x PCIe 5.0 |
| OCP Slots | 2 x OCP 3.0 |
| Cooling | Air, closed‑loop liquid, or DLC |
| Management | iLO 7, Compute Ops Management (AI‑driven) |
| Security | Silicon Root of Trust 2.0, Secure Enclave, SPDM |
| SFF Dimensions (HxWxD) | 4.29 x 43.46 x 75.31 cm |
| LFF Dimensions (HxWxD) | 4.29 x 43.46 x 77.31 cm |
| Operating Temp | 10° to 35° C |
| Warranty | 3‑year on‑site, next‑business‑day |
Primary Workloads
Virtualization: VDI, server virtualization
Hybrid cloud: Azure Local, enterprise platforms
Containers: orchestration and deployment
General compute: enterprise daily operations
Company Details
Business Type:
Distributor/Wholesaler,Exporter,Trading Company,Seller
Year Established:
2018
Ecer Certification:
Verified Supplier
Hongkun Technology is a privately held organisation with its headquarter in Beiijing, China and we have been providing our services for end to end ICT solutions, development of commercial grade software products and applications to new, emerging and established technology companies & ICT enabled... Hongkun Technology is a privately held organisation with its headquarter in Beiijing, China and we have been providing our services for end to end ICT solutions, development of commercial grade software products and applications to new, emerging and established technology companies & ICT enabled...
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