High Density H3C Server R5500 G6 8 GPU AI Training With 8x H200/H100 GPU 24x3

The H3C UniServer R5500 G6 is a flagship 6U high-density 8-GPU AI training server purpose-built for large-scale generative AI model training, trillion-parameter model fine-tuning, high-performance computing (HPC), and enterprise-level massive data processing. Adopting H3C’s exclusive modular intelligent computing architecture, this server delivers ultra-high parallel computing efficiency, industry-leading local storage capacity, and flexible hardware compatibility, standing out from conventional AI servers with superior scalability and operational reliability. It is fully optimized to tackle the most demanding heavy-load AI workloads for data centers, scientific research institutions, and enterprise intelligent computing platforms.

This fully configured system supports dual Intel Xeon 8558+ / 8468 scalable processors for flexible CPU performance matching, paired with 32x64GB high-speed DDR5 ECC memory to ensure ultra-large dataset real-time processing and multi-task concurrency. It is equipped with a massive 24x3.84TB NVMe high-speed storage array, breaking the local storage bottleneck of most standard AI servers. Compatible with 8x NVIDIA H200 or H100 flagship GPUs with full high-speed interconnection, and integrated with OCP 3.0 high-efficiency expansion interface, this machine achieves comprehensive upgrades in computing power, storage capacity, expansion flexibility and operational stability, perfectly adapting to long-duration distributed AI training and high-concurrency inference scenarios.

• Dual Compatibility & Flexible Configuration: Supports dual Intel Xeon CPU generations and H200/H100 dual flagship GPU adaptation, freely matching lightweight inference and ultra-heavy large model training tasks with strong scenario adaptability
• Industry-Leading Massive Local Storage: Equipped with 24x3.84TB NVMe high-speed storage array, realizing ultra-large dataset local storage, avoiding cross-network data transmission delay, greatly improving AI training efficiency
• OCP 3.0 High-Speed Expandability: Dedicated OCP 3.0 high-efficiency expansion interface reserves abundant upgrade space for high-speed networking and AI acceleration, perfectly adapting to iterative upgrades of new-generation AI technologies
• High-Density & Efficient Heat Dissipation: Advanced 6U compact high-density design saves data center rack space, while customized intelligent modular cooling completely solves heat dissipation bottlenecks of 8-GPU long-term full-load operation
• Modular High Reliability Design: Five core modules support independent hot-swappable maintenance, effectively reducing equipment failure downtime and maintenance costs, ensuring long-term stable operation of AI computing clusters
• Powerful Full-Load Computing Performance: Dual high-end CPUs + 8 flagship GPUs + ultra-large memory and storage combination deliver explosive parallel computing power, specially optimized for trillion-parameter LLM training, AIGC generation, scientific HPC simulation and big data intelligent analysis

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