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Beijing Hongkun Jiasheng Technology Co., Ltd.

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China Huawei FusionServer CH226 V3 Compute Node with Intel Xeon E5-2600 V3, 24 DDR4
China Huawei FusionServer CH226 V3 Compute Node with Intel Xeon E5-2600 V3, 24 DDR4

  1. China Huawei FusionServer CH226 V3 Compute Node with Intel Xeon E5-2600 V3, 24 DDR4
  2. China Huawei FusionServer CH226 V3 Compute Node with Intel Xeon E5-2600 V3, 24 DDR4
  3. China Huawei FusionServer CH226 V3 Compute Node with Intel Xeon E5-2600 V3, 24 DDR4

Huawei FusionServer CH226 V3 Compute Node with Intel Xeon E5-2600 V3, 24 DDR4

  1. MOQ: 1PC
  2. Price: Negotiable
  3. Get Latest Price
Delivery Time 5-7 work days
Payment Terms T/T
Supply Ability 200pcs
Packaging Details Carton packing
Model Number Huawei FusionServer CH226 V3
Place of Origin CHINA
Brand Name Huawei

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Product Specification

Delivery Time 5-7 work days Payment Terms T/T
Supply Ability 200pcs Packaging Details Carton packing
Model Number Huawei FusionServer CH226 V3 Place of Origin CHINA
Brand Name Huawei
High Light huawei fusionservere5-2600 fusionservere5-2600 huawei storage server

The Huawei FusionServer CH226 V3 is a high-performance, enterprise-grade compute node designed exclusively for the Huawei E9000 blade chassis. Built to handle virtualization, cloud computing, databases, big data analytics, and mission-critical business workloads, it supports the Intel Xeon E5‑2600 V3 series processors, features 24 DDR4 DIMM memory slots, and integrates hardware RAID for robust data protection. With outstanding memory scalability, reliable processing power, and high-density deployment design, it provides exceptional efficiency, stability, and long-term value for modern data centers.

Huawei CH226-V3 Specification
Model Huawei CH226 V3 Storage Expansion Compute Node
Brand Huawei
Form Factor Full-width, 2-socket compute node
Number of Processors 1 or 2
Processor Model Intel® Xeon® E5-2600 v3/v4 series
Number of DIMMs 24 DDR4 DIMMs, maximum memory capacity 1.5TB
Number of Hard Disks 6 × 3.5in. SAS/SATA HDDs, and 2 × 2.5in. SAS/SATA HDDs or SSDs
Built-in Storage 2 × SATA DOM; 2 × Micro-SD cards (RAID 1); 1 × USB 3.0 disk
RAID Support RAID 0, 1, 10, 5, 50, 6, 60; 512MB/1GB/2GB RAID cache
PCIe Expansion 2 × PCIe x16 mezz modules; 1 × standard PCIe x8 full-height, half-length card


Operating Temperature 5°C to 40°C
Dimensions (H × W × D) 60.46mm × 423mm × 537.2mm
Weight 15 kg
Key Selling Points
  • Powerful Intel Xeon E5‑2600 V3 processing performance for heavy concurrent workloads
  • 24 DDR4 DIMM slots for ultra-large memory capacity and low-latency access
  • Built‑in hardware RAID for data security, high I/O speed, and disk fault tolerance
  • Optimized for E9000 chassis to achieve extreme density and simplified O&M
  • Enterprise‑grade reliability supporting 7×24 non-stop operation
Key Advantages
High-Performance Processor Platform

Supports Intel Xeon E5‑2600 V3 CPUs with strong multi-core and multi-thread performance, delivering stable computing power for virtual machines, databases, and high-concurrency applications.

Massive Memory Scalability

With 24 DDR4 DIMM slots, the CH226 V3 supports large memory configurations to eliminate bottlenecks in memory‑intensive workloads such as in-memory databases, virtualization clusters, and big data processing.

Reliable RAID Data Protection

Onboard hardware RAID improves storage read/write speed and provides data redundancy, effectively preventing data loss and ensuring business continuity for critical applications.

High-Density Blade Design

As a dedicated compute node for the Huawei E9000 chassis, it maximizes rack space utilization, reduces cabling and power consumption, and lowers total cost of ownership (TCO).

Stable and Easy to Manage

Built with industrial-grade hardware and intelligent cooling, it ensures long-term stable running. Centralized chassis management enables remote monitoring, fault diagnosis, and convenient maintenance.

Key Features
  • Supports Intel Xeon E5‑2600 V3 series processors
  • 24 DDR4 DIMM slots for high-capacity memory expansion
  • Integrated hardware RAID controller
  • High-density compute node for Huawei E9000 blade chassis
  • Efficient power and thermal design
  • Enterprise-level stability and durability
  • Centralized remote management
  • Wide compatibility with mainstream operating systems and virtualization platforms
Get more information

Discover unbeatable prices and fast shipping for the CH226-V3, Huawei FusionServer Compute Node, Intel Xeon E5-2600 V3/RAID/24 DDR4 DIMMs. Access the detailed CH226-V3, Huawei FusionServer Compute Node, Intel Xeon E5-2600 V3/RAID/24 DDR4 DIMMs datasheet and ensure you're getting the best deal with our reliable delivery service. Need assistance? Our free live chat support is here to help. For more information about the product and pricing, contact us via live chat

Company Details

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  • Business Type:

    Distributor/Wholesaler,Exporter,Trading Company,Seller

  • Year Established:

    2018

  • Ecer Certification:

    Verified Supplier

Hongkun Technology is a privately held organisation with its headquarter in Beiijing, China and we have been providing our services for end to end ICT solutions, development of commercial grade software products and applications to new, emerging and established technology companies & ICT enabled... Hongkun Technology is a privately held organisation with its headquarter in Beiijing, China and we have been providing our services for end to end ICT solutions, development of commercial grade software products and applications to new, emerging and established technology companies & ICT enabled...

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  • Beijing Hongkun Jiasheng Technology Co., Ltd.
  • Jin Yan Long Building, Changping District, Beijing, 9th floor
  • https://www.storages-server.com/

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