| Supply Ability | 200pcs |
| Delivery Time | 5-7 work days |
| Packaging Details | Carton packaging |
| Place of Origin | CHINA |
| Brand Name | HPE |
| Model Number | HPE ProLiant DL560 Gen11 |
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Product Specification
| Supply Ability | 200pcs | Delivery Time | 5-7 work days |
| Packaging Details | Carton packaging | Place of Origin | CHINA |
| Brand Name | HPE | Model Number | HPE ProLiant DL560 Gen11 |
| High Light | 2U HPE ProLiant Server ,Quad Core HPE ProLiant Server ,2U hpe proliant dl560 | ||
Hpe Proliant Server Dl560 Gen11 2U Rackmounted Quad Core High Speed
Product Description
The HPE ProLiant DL560 Gen11 is a 2U quad‑socket enterprise server delivering exceptional core density for in‑memory databases, big data analytics, and mission‑critical applications. Powered by 4th Gen Intel Xeon Scalable processors (up to 60 cores per CPU, 240 cores total, 350W TDP) and 64 DDR5 DIMM slots (up to 16TB at 4800 MT/s), it offers massive compute and memory capacity in a compact 2U footprint. With flexible front bays (8/16/24 SFF or 12 EDSFF), PCIe Gen5 expansion, and iLO6 management, the DL560 Gen11 is built for core business consolidation.
Key Differentiators
Quad 4th Gen Intel Xeon Scalable (up to 60 cores/CPU, 240 cores total, 350W TDP)
64 x DDR5 DIMM slots — up to 16TB at 4800 MT/s (LRDIMM)
Supports Intel Optane persistent memory (memory mode / app direct)
Flexible front bays: 8SFF, 16SFF, 24SFF, or 12x E3.S (EDSFF) all‑flash
Standard HPE Smart Array E208e-p / P408i-o (PCIe 5.0, RAID 0/1/5/10)
Dual M.2 NVMe (RAID1, hot‑swap) for system boot
Up to 6 x PCIe 5.0 x16 + 2 x OCP 3.0 slots
Supports up to 4 double‑width GPUs (AI training/inference)
2+2 or 4+4 redundant hot‑swap PSUs (800W–2200W, Titanium)
6 dual‑rotor hot‑swap fans; optional closed‑loop liquid cooling
Standard OCP 3.0 4 x 1GbE; optional 10/25/100GbE
iLO6 Standard with OneView (remote monitor/deploy/troubleshoot)
Advanced ECC, memory mirroring, hot spare, ADDDC, lockstep
Specifications
| Category | Specification |
|---|---|
| Model | HPE ProLiant DL560 Gen11 |
| Form Factor | 2U rackmount, quad‑socket |
| CPU | 4th Gen Intel Xeon Scalable (Sapphire Rapids) |
| Max Cores per CPU | 60 cores, up to 350W TDP |
| Max Cores (4S) | 240 cores |
| Memory Slots | 64 x DDR5 DIMM (16 per socket) |
| Max Memory | 16TB (LRDIMM) at 4800 MT/s |
| Optane Support | Yes (persistent memory) |
| Memory Features | Advanced ECC, mirroring, hot spare, ADDDC, lockstep |
| Front Bays (options) | 8SFF, 16SFF, 24SFF, or 12x E3.S (EDSFF) |
| RAID Controller | Smart Array E208e-p / P408i-o (PCIe 5.0, RAID 0/1/5/10) |
| System Drive | Dual M.2 NVMe (RAID1, hot‑swap) |
| PCIe Slots | Up to 6 x PCIe 5.0 x16 + 2 x OCP 3.0 |
| GPU Support | Up to 4 double‑width GPUs |
| PSU | 2+2 or 4+4 hot‑swap redundant (800W–2200W, Titanium) |
| Cooling | 6 dual‑rotor hot‑swap fans; optional liquid cooling |
| Networking | OCP 3.0 4 x 1GbE; optional 10/25/100GbE |
| Management | iLO6, OneView |
| Interfaces | Front/rear USB 3.0, VGA, serial |
| Security | TPM 2.0, chassis intrusion detection |
Company Details
Business Type:
Distributor/Wholesaler,Exporter,Trading Company,Seller
Year Established:
2018
Ecer Certification:
Verified Supplier
Hongkun Technology is a privately held organisation with its headquarter in Beiijing, China and we have been providing our services for end to end ICT solutions, development of commercial grade software products and applications to new, emerging and established technology companies & ICT enabled... Hongkun Technology is a privately held organisation with its headquarter in Beiijing, China and we have been providing our services for end to end ICT solutions, development of commercial grade software products and applications to new, emerging and established technology companies & ICT enabled...
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