| Material | FR4 / Rogers / Polyimide / Ceramic |
| Surface Finish | HASL / ENIG / OSP / Immersion Silver / Immersion Tin |
| Dielectric Constant | 3.5 - 10 (depending On Substrate) |
| Operating Temperature | -40°C To 130°C |
| Minimum Trace Spacing | 3 Mil (0.075mm) |
| Number Of Layers | 1 - 32 Layers |
| Minimum Trace Width | 3 Mil (0.075mm) |
| Place Of Origin | China |
| Thermal Conductivity | 0.3 - 3.0 W/mK (depending On Substrate) |
| Model Number | H-STP |
| Brand Name | Hing |
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Product Specification
| Material | FR4 / Rogers / Polyimide / Ceramic | Surface Finish | HASL / ENIG / OSP / Immersion Silver / Immersion Tin |
| Dielectric Constant | 3.5 - 10 (depending On Substrate) | Operating Temperature | -40°C To 130°C |
| Minimum Trace Spacing | 3 Mil (0.075mm) | Number Of Layers | 1 - 32 Layers |
| Minimum Trace Width | 3 Mil (0.075mm) | Place Of Origin | China |
| Thermal Conductivity | 0.3 - 3.0 W/mK (depending On Substrate) | Model Number | H-STP |
| Brand Name | Hing |
The Substrate PCB is a highly advanced and versatile electronic component designed to meet the demanding requirements of modern electronic applications. With a thickness range from 0.1mm to 3.0mm, this substrate offers flexibility and robustness that can be tailored to suit various design needs. Its wide operating temperature range, from -40°C to 130°C, ensures reliable performance in extreme environmental conditions, making it an ideal choice for industries requiring durability and stability.
One of the standout features of this substrate PCB is its excellent dielectric properties. The dielectric constant ranges from 3.5 to 10, depending on the specific substrate material used. This variability allows engineers to select the optimal substrate that matches the electrical performance requirements of their circuits. Such characteristics are particularly crucial in high-frequency circuits and RF modules, where signal integrity and minimal loss are paramount for achieving superior performance.
The substrate PCB is widely utilized in a variety of applications including high-frequency circuits, RF modules, LED lighting, and automotive electronics. Its design and material properties make it especially suitable for semiconductor package substrate applications, where the substrate must provide mechanical support and electrical insulation for semiconductor devices. The substrate’s ability to operate reliably within a working temperature range of -40°C to +85°C further underscores its suitability for automotive electronics, which often face harsh temperature fluctuations and demanding operational conditions.
In the semiconductor industry, obtaining an accurate IC substrate quote is critical for project planning and cost management. This substrate PCB offers competitive pricing without compromising on quality, making it an excellent option for manufacturers seeking cost-effective semiconductor package substrates. Whether you are developing cutting-edge semiconductor packages or looking to enhance the performance of your electronic assemblies, this substrate PCB provides a solid foundation for your designs.
Moreover, the substrate PCB is engineered to support the next generation of semiconductor package substrates, accommodating advanced packaging techniques and fine-pitch components. This ensures compatibility with evolving semiconductor technologies and helps extend the lifecycle and reliability of electronic products. The substrate’s mechanical strength combined with its superior electrical properties contribute to improved heat dissipation and enhanced overall device performance.
In summary, the Substrate PCB is a high-performance, adaptable, and reliable solution for various demanding applications. Its thickness range from 0.1mm to 3.0mm, operating temperature tolerance from -40°C to 130°C, and customizable dielectric constant between 3.5 and 10 make it an excellent choice for high frequency circuits, RF modules, LED lighting, and automotive electronics. Its role as a semiconductor package substrate is pivotal, supporting the structural and electrical needs of semiconductor devices. For companies seeking an efficient and cost-effective IC substrate quote, this substrate PCB stands out as a superior option, delivering exceptional quality and performance for advanced semiconductor packaging and electronic applications.
The Hing H-STP Substrate PCB, originating from China, is a highly reliable and versatile product designed for a wide range of applications in the electronics industry. With its exceptional specifications, including a minimum trace width and spacing of 3 Mil (0.075mm), this custom IC substrate is ideal for high-density circuit designs requiring precision and performance. The versatility in thickness, ranging from 0.1mm to 3.0mm, allows it to be tailored to meet various design and functionality requirements.
One of the primary application occasions for the Hing H-STP substrate PCB is in the manufacturing of advanced electronic devices where ceramic substrate materials are preferred for their superior thermal conductivity and electrical insulation properties. This makes it an excellent choice for high-frequency and high-power applications such as RF modules, power amplifiers, and LED lighting systems. The dielectric constant range of 3.5 to 10 (depending on the substrate) provides flexibility in tuning electrical characteristics to optimize device performance.
In scenarios where operating environments are harsh, the Hing H-STP substrate PCB demonstrates outstanding durability with an operating temperature range from -40°C to 130°C. This makes it well-suited for automotive electronics, aerospace systems, and industrial machinery where temperature stability and reliability are critical. Additionally, the substrate’s fine trace capabilities support the miniaturization trend in electronics, enabling compact and lightweight designs without compromising on functionality.
When seeking an IC substrate quote, manufacturers and designers often turn to Hing for its reputation in delivering high-quality ceramic substrates and custom IC substrates. The ability to customize trace width, spacing, and thickness ensures that the H-STP model can be adapted for various circuit complexities and manufacturing processes. This flexibility supports rapid prototyping as well as large-scale production, catering to diverse market demands.
Overall, the Hing H-STP Substrate PCB is a preferred choice for applications requiring precision, durability, and thermal management. Its use spans consumer electronics, telecommunications, medical devices, and more, making it a cornerstone in the development of next-generation electronic components and systems.
Hing offers high-quality Substrate PCB products under the model number H-STP, originating from China. Our substrates are designed to meet a wide range of applications with excellent reliability and performance.
We provide customization services for various materials including FR4, Rogers, Polyimide, and Ceramic, allowing you to select the best substrate material for your specific needs. Our substrates support operating temperatures ranging from -40°C to 130°C, with a working temperature range of -40 to +85°C, ensuring durability under harsh conditions.
Our substrates feature thermal conductivity between 0.3 and 3.0 W/mK, depending on the substrate material chosen, which is critical for effective heat dissipation in electronic components.
Hing's Substrate PCB products accommodate from 1 up to 32 layers, providing versatile solutions for complex circuit designs.
We specialize in package substrate and BT substrate customization, delivering tailored solutions to meet your precise requirements. For customers seeking an IC substrate quote, Hing guarantees competitive pricing and excellent service quality.
Choose Hing for your substrate PCB needs and benefit from our expertise in advanced materials, reliable manufacturing, and comprehensive customization options.
Our Product Technical Support and Services for Substrate PCB are designed to ensure optimal performance and customer satisfaction. We offer comprehensive assistance throughout the product lifecycle, including design consultation, manufacturing support, and troubleshooting.
Our experienced technical team provides guidance on material selection, layer stack-up, and signal integrity to help you achieve the best results for your specific application. We also assist with prototype development, testing, and validation to ensure your substrate PCBs meet all required specifications.
In addition, we offer repair and rework services to extend the life of your PCBs, as well as failure analysis to identify and address any issues promptly. Our commitment to quality and continuous improvement guarantees that you receive reliable and high-performance substrate PCB solutions.
Q1: What is the brand name of the Substrate PCB?
A1: The Substrate PCB is manufactured under the brand name Hing.
Q2: What is the model number of this Substrate PCB?
A2: The model number of the Substrate PCB is H-STP.
Q3: Where is the Hing Substrate PCB produced?
A3: The Hing Substrate PCB is made in China.
Q4: What applications is the H-STP Substrate PCB suitable for?
A4: The H-STP Substrate PCB is suitable for various electronic applications, including circuit boards for consumer electronics, automotive, and industrial devices.
Q5: What materials are used in the construction of the Hing H-STP Substrate PCB?
A5: The Hing H-STP Substrate PCB is made using high-quality materials that ensure durability and excellent electrical performance, typically including a fiberglass base and copper foil layers.
Company Details
Business Type:
Manufacturer,Seller,Exporter
Year Established:
2016
Total Annual:
4000000-5000000
Employee Number:
200~300
Ecer Certification:
Verified Supplier
Shenzhen Hing Technology Co., Ltd was established in 2016. The company is a national high-tech enterprise specializing in the research and development, production and sales of printed circuit boards. Since its establishment, the company has long adhered to the development strategy of quality first,... Shenzhen Hing Technology Co., Ltd was established in 2016. The company is a national high-tech enterprise specializing in the research and development, production and sales of printed circuit boards. Since its establishment, the company has long adhered to the development strategy of quality first,...
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