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Hing Technology Co. Ltd

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China Copperfoilthickness 18μm to 35μm SLP Substrate Like PCB Incorporating Glasstrans
China Copperfoilthickness 18μm to 35μm SLP Substrate Like PCB Incorporating Glasstrans

  1. China Copperfoilthickness 18μm to 35μm SLP Substrate Like PCB Incorporating Glasstrans
  2. China Copperfoilthickness 18μm to 35μm SLP Substrate Like PCB Incorporating Glasstrans
  3. China Copperfoilthickness 18μm to 35μm SLP Substrate Like PCB Incorporating Glasstrans
  4. China Copperfoilthickness 18μm to 35μm SLP Substrate Like PCB Incorporating Glasstrans
  5. China Copperfoilthickness 18μm to 35μm SLP Substrate Like PCB Incorporating Glasstrans
  6. China Copperfoilthickness 18μm to 35μm SLP Substrate Like PCB Incorporating Glasstrans

Copperfoilthickness 18μm to 35μm SLP Substrate Like PCB Incorporating Glasstrans

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Productname SLP Substrate Like PCB
Operatingtemperaturerange -40°C To 125°C
Working Temp -40~+85
Place Of Origin China
Coefficientofthermalexpansion 10 - 15 Ppm/°C
Thermalconductivity 0.8 - 1.2 W/mK
Copperfoilthickness 18μm - 35μm
Surfacefinish ENIG / OSP / HASL
Materialtype Substrate-like PCB Material
Brand Name Hing
Model Number H-SSL

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  1. Product Details
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Product Specification

Productname SLP Substrate Like PCB Operatingtemperaturerange -40°C To 125°C
Working Temp -40~+85 Place Of Origin China
Coefficientofthermalexpansion 10 - 15 Ppm/°C Thermalconductivity 0.8 - 1.2 W/mK
Copperfoilthickness 18μm - 35μm Surfacefinish ENIG / OSP / HASL
Materialtype Substrate-like PCB Material Brand Name Hing
Model Number H-SSL

Product Description:

The SLP Substrate Like PCB is an advanced printed circuit board solution designed to meet the rigorous demands of modern electronic devices. Known for its exceptional performance and reliability, this substrate-like PCB offers a versatile platform for high-density interconnect applications, making it an ideal choice for industries ranging from consumer electronics to automotive and telecommunications.

One of the defining characteristics of the SLP substrate like PCB is its precise thickness, which ranges from 0.1mm to 0.3mm. This ultra-thin profile enables compact device designs without compromising structural integrity or electrical performance. The slim form factor facilitates the production of smaller, lighter, and more efficient electronic products, which is increasingly important in today’s fast-evolving technological landscape.

Thermal management is a critical factor in the performance and longevity of electronic components. The SLP PCB fabrication process incorporates materials with excellent thermal conductivity, ranging between 0.8 to 1.2 W/mK. This effective thermal conductivity allows for efficient heat dissipation, reducing the risk of overheating and ensuring stable operation even under high power or continuous use conditions. As a result, devices utilizing substrate-like PCB technology benefit from enhanced reliability and extended service life.

Moisture absorption is another vital attribute of the SLP substrate like PCB. With a moisture absorption rate of less than 0.1%, this substrate-like PCB is highly resistant to environmental humidity and moisture ingress. This low moisture uptake prevents degradation of electrical properties and physical deformation, which is especially crucial for applications exposed to varying environmental conditions or high humidity levels.

Electrical insulation resistance is a key performance metric for any PCB, as it ensures the prevention of electrical leakage and short circuits. The SLP substrate like PCB boasts an electrical insulation resistance exceeding 10^12 Ohms. This outstanding electrical isolation capability guarantees the integrity of signal transmission and the safety of electronic circuits, making it suitable for sensitive and high-frequency applications.

The operating temperature range of the substrate-like PCB spans from -40°C to 125°C, demonstrating its robustness in extreme thermal environments. This wide temperature tolerance makes the SLP PCB fabrication ideal for use in automotive electronics, industrial equipment, and outdoor applications where temperature fluctuations are common and reliability is paramount.

Overall, the SLP substrate like PCB represents a cutting-edge solution that combines ultra-thin design, excellent thermal management, superior moisture resistance, outstanding electrical insulation, and broad operating temperature range. These attributes collectively contribute to the superior performance and durability of devices incorporating substrate-like PCB technology.

As the demand for miniaturized and high-performance electronics continues to grow, the role of SLP PCB fabrication becomes increasingly significant. By leveraging the unique properties of the substrate-like PCB, manufacturers can achieve higher circuit density, improved signal integrity, and enhanced thermal stability, all within a compact form factor. This makes the SLP substrate like PCB an indispensable component in the future of electronic manufacturing and innovation.


Applications:

The Hing brand SLP Substrate Like PCB, model number H-SSL, originating from China, is an advanced solution designed for a wide range of high-tech applications. Known for its high flexibility and excellent solderability, this product is ideal for industries that demand reliable and efficient printed circuit boards. The SLP PCB fabrication process used by Hing ensures precision and quality, making it suitable for complex and compact electronic devices.

This substrate like PCB finds extensive application in scenarios where space-saving and high-performance are critical. For instance, it is widely used in the manufacturing of smartphones, tablets, and wearable devices, where the high flexibility of the PCB allows for innovative designs and compact assembly. The excellent solderability provided by the ENIG, OSP, or HASL surface finishes guarantees strong and durable connections, essential for consumer electronics that undergo frequent handling and movement.

In addition to consumer electronics, the H-SSL substrate like PCB is highly suitable for medical devices and automotive electronics. The dielectric constant range of 3.5 to 4.5 ensures stable signal integrity and minimal interference, which is crucial in sensitive medical instruments and advanced automotive control systems. Furthermore, the outstanding electrical insulation resistance greater than 10^12 Ohms offers superior protection against electrical leakage, enhancing the safety and reliability of the final products.

Engineers and product developers frequently seek an SLP PCB quote when planning projects that require substrate like PCB technology to meet stringent performance and durability standards. The Hing H-SSL model is preferred in prototype development and mass production alike, due to its consistent quality and adaptability to various surface finishes like ENIG, OSP, and HASL.

In summary, the Hing SLP Substrate Like PCB (model H-SSL) is an excellent choice for any scenario demanding high flexibility, reliable soldering, and robust electrical properties. Whether for cutting-edge consumer electronics, automotive systems, or medical devices, this product supports innovative designs and ensures long-term performance. For those interested in SLP PCB fabrication, obtaining an SLP PCB quote from Hing can be the first step toward integrating this versatile substrate like PCB into their next generation of electronic products.


Customization:

Hing proudly presents the H-SSL model, our premium SLP Substrate Like PCB designed to meet diverse electronic manufacturing needs. Originating from China, this product offers exceptional performance with a moisture absorption rate of less than 0.1%, ensuring durability and reliability in various environments.

The SLP Substrate Like PCB features excellent thermal conductivity ranging from 0.8 to 1.2 W/mK, allowing efficient heat dissipation for high-performance applications. Its electrical insulation resistance exceeds 10^12 Ohms, providing superior electrical isolation essential for sensitive circuits.

Operating smoothly within a temperature range of -40 to +85 degrees Celsius, the H-SSL model is ideal for use in demanding conditions. Whether you require a custom SLP PCB for specialized designs or an SLP motherboard for advanced electronics, our product customization services can provide precise solutions tailored to your specifications.

For those seeking an SLP PCB quote or interested in custom SLP PCB manufacturing, Hing offers expert support and flexible options to ensure your project’s success with high-quality SLP substrates.


Support and Services:

Our SLP (Substrate Like PCB) product is designed to meet the highest standards of quality and performance in advanced electronic applications. To ensure optimal use and longevity of your SLP substrates, we provide comprehensive technical support and services tailored to your needs.

Technical Support:

Our team of experts is available to assist with any technical inquiries related to the SLP substrate. This includes guidance on design considerations, material selection, layer stack-up, electrical performance, thermal management, and compatibility with various assembly processes. We also offer troubleshooting support to address any issues encountered during manufacturing or implementation.

Design Assistance:

We offer design consultation services to help you maximize the benefits of SLP technology. This includes advice on layout optimization, signal integrity, and mechanical stability to ensure your product meets all functional and reliability requirements.

Customization Services:

Understanding that different applications may require unique specifications, we provide customization options for our SLP substrates. This can include adjustments in thickness, copper weight, surface finish, and other parameters to align with your project’s demands.

Quality Assurance:

Our SLP products undergo rigorous quality control processes to ensure they meet international standards. We provide detailed documentation and test reports to verify material properties, electrical characteristics, and mechanical robustness.

Training and Resources:

To support your team, we offer training sessions and provide comprehensive technical documentation, including application notes, best practice guides, and FAQs related to SLP substrates.

Continuous Improvement:

We are committed to continuous improvement and innovation in our SLP product line. Feedback from customers is highly valued and used to enhance product performance and support services.

By choosing our SLP substrates, you gain access to a dedicated support network aimed at ensuring your success in deploying advanced PCB solutions.


Company Details

Bronze Gleitlager

,

Bronze Sleeve Bushings

 and 

Graphite Plugged Bushings

 from Quality China Factory
  • Business Type:

    Manufacturer,Seller,Exporter

  • Year Established:

    2016

  • Total Annual:

    4000000-5000000

  • Employee Number:

    200~300

  • Ecer Certification:

    Verified Supplier

Shenzhen Hing Technology Co., Ltd was established in 2016. The company is a national high-tech enterprise specializing in the research and development, production and sales of printed circuit boards. Since its establishment, the company has long adhered to the development strategy of quality first,... Shenzhen Hing Technology Co., Ltd was established in 2016. The company is a national high-tech enterprise specializing in the research and development, production and sales of printed circuit boards. Since its establishment, the company has long adhered to the development strategy of quality first,...

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  • Hing Technology Co. Ltd
  • Building No1 Niumendi Industrial Park Number 171 Longwei Road, Longwei Community Meilin Street,Futian district Shenzhen
  • https://www.szhingtech.com/

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