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Hing Technology Co. Ltd

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China Minimumtracewidth 0.003 Inches 75 Microns HDI PCBs FR4 Material Offering
China Minimumtracewidth 0.003 Inches 75 Microns HDI PCBs FR4 Material Offering

  1. China Minimumtracewidth 0.003 Inches 75 Microns HDI PCBs FR4 Material Offering
  2. China Minimumtracewidth 0.003 Inches 75 Microns HDI PCBs FR4 Material Offering
  3. China Minimumtracewidth 0.003 Inches 75 Microns HDI PCBs FR4 Material Offering
  4. China Minimumtracewidth 0.003 Inches 75 Microns HDI PCBs FR4 Material Offering
  5. China Minimumtracewidth 0.003 Inches 75 Microns HDI PCBs FR4 Material Offering
  6. China Minimumtracewidth 0.003 Inches 75 Microns HDI PCBs FR4 Material Offering

Minimumtracewidth 0.003 Inches 75 Microns HDI PCBs FR4 Material Offering

  1. MOQ: 1
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Signalintegrity Controlled Impedance, High-frequency Support
Payment Terms T/T
Supply Ability 1000000/Month
Type High-Density Interconnect Printed Circuit Boards
Layercount 2 To 40+ Layers
Surfacefinish ENIG, HASL, OSP, Immersion Silver
Packaging Details Discuss
Delivery Time 7
Productname HDI PCBs
Thermalmanagement Embedded Heat Sinks, Thermal Vias
Minimumspacing 0.003 Inches (75 Microns)
Material FR4, Rogers, Polyimide
Place Of Origin China
Brand Name Hing
Model Number H-HDI
Certification ISO UL RoHs

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Product Specification

Signalintegrity Controlled Impedance, High-frequency Support Payment Terms T/T
Supply Ability 1000000/Month Type High-Density Interconnect Printed Circuit Boards
Layercount 2 To 40+ Layers Surfacefinish ENIG, HASL, OSP, Immersion Silver
Packaging Details Discuss Delivery Time 7
Productname HDI PCBs Thermalmanagement Embedded Heat Sinks, Thermal Vias
Minimumspacing 0.003 Inches (75 Microns) Material FR4, Rogers, Polyimide
Place Of Origin China Brand Name Hing
Model Number H-HDI Certification ISO UL RoHs

Product Description:

HDI PCBs (High-Density Interconnect Printed Circuit Boards) represent a cutting-edge solution in the world of electronics manufacturing, delivering exceptional performance and reliability for a wide range of applications. Designed to meet the ever-increasing demand for miniaturization and high functionality, HDI PCBs incorporate advanced design features such as microvias, blind and buried vias, and fine line circuitry, enabling higher wiring density and enhanced signal integrity.

One of the standout attributes of HDI PCBs is their superior signal integrity. These boards are engineered with controlled impedance to ensure consistent and reliable signal transmission, which is essential for high-speed digital circuits and high-frequency applications. The controlled impedance in HDI PCBs minimizes signal reflection and electromagnetic interference, resulting in clear, fast, and accurate data communication. This capability makes HDI PCBs an excellent choice for applications requiring high-frequency support, such as telecommunications, aerospace, and advanced computing devices.

Material selection plays a critical role in the performance of HDI PCBs. This product line offers a variety of substrate options, including the popular FR4, Rogers, and Polyimide materials. FR4 is widely used for its cost-effectiveness and balanced electrical and mechanical properties, which make it suitable for many standard applications. For environments where enhanced high-frequency performance is required, Rogers materials provide low dielectric loss and excellent thermal stability. Polyimide, known for its flexibility and high thermal resistance, is ideal for flexible HDI PCBs and applications exposed to harsh environmental conditions. This material versatility allows designers to tailor HDI PCBs to meet specific project requirements and optimize performance.

HDI PCBs are available in a wide range of layer counts, from 2 layers up to more than 40 layers. This flexibility enables the creation of complex, multi-layered circuits that support high-density component placement and sophisticated routing architectures. Whether you need a simple 2-layer HDI PCB prototype for initial testing or a highly complex 40+ layer microvia PCB for advanced production, this product line accommodates various design complexities and project scales.

The standard thickness of these HDI PCBs is 2.0MM, which strikes an ideal balance between mechanical strength and compactness. This thickness is sufficient to support robust assembly processes and reliable electrical performance while allowing the board to fit into compact device enclosures. For applications demanding different thickness specifications, customization options are often available to meet unique design needs.

When it comes to prototyping, the HDI PCB prototype service offers rapid turnaround times without compromising quality. Utilizing advanced manufacturing techniques and stringent quality control, the HDI PCB prototype facilitates early-stage testing and validation of circuit designs. This is especially valuable in modern electronics development cycles, where time-to-market and design accuracy are critical. The microvia PCB technology employed in these prototypes ensures that even the most intricate designs can be accurately realized, providing engineers with a dependable platform to refine their products before full-scale production.

In summary, HDI PCBs deliver a combination of high-density interconnect technology, exceptional signal integrity with controlled impedance, and robust material options including FR4, Rogers, and Polyimide. With layer counts ranging from 2 to over 40 layers and a standard thickness of 2.0MM, these PCBs are suitable for a broad spectrum of applications from simple prototypes to complex multi-layer circuits. The availability of HDI PCB prototype services ensures that designers can quickly iterate and perfect their designs using microvia PCB technology, ultimately leading to better performance and reliability in the final product. Whether you are developing next-generation communication devices, advanced computing systems, or aerospace electronics, HDI PCBs provide the necessary foundation for innovation and success.


Features:

  • Product Name: HDI PCBs
  • Type: High-Density Interconnect Printed Circuit Boards
  • Thermal Management: Embedded Heat Sinks, Thermal Vias
  • Working Temperature Range: -40°C to +85°C
  • Minimum Trace Width: 0.003 Inches (75 Microns)
  • Applications: Smartphones, Wearables, Medical Devices, Aerospace
  • Expertise in HDI PCB fabrication ensuring high quality and reliability
  • Leading China HDI PCB manufacturer with advanced production capabilities

Technical Parameters:

Product Name HDI PCBs
Surface Finish ENIG, HASL, OSP, Immersion Silver
Board Thickness 0.4mm To 3.2mm
Minimum Trace Width 0.003 Inches (75 Microns)
Minimum Spacing 0.003 Inches (75 Microns)
Working Temperature -40~+85 °C
Material FR4, Rogers, Polyimide
Lead Time 2 To 4 Weeks
Copper Thickness 0.5oz To 3oz
Signal Integrity Controlled Impedance, High-frequency Support

Applications:

The Hing H-HDI HDI PCBs are designed to meet the demanding needs of modern electronic applications, offering exceptional performance and reliability. Originating from China, these high-quality HDI PCBs are certified by ISO, UL, and RoHS, ensuring compliance with international standards and environmental safety. With a board thickness ranging from 0.4mm to 3.2mm, the Hing H-HDI model is versatile enough to suit a wide array of industries and applications.

One of the key application occasions for Hing HDI PCBs is in advanced communication devices. Thanks to their controlled impedance and high-frequency support, these PCBs enable superior signal integrity, making them ideal for 5G communication equipment, high-speed data transmission, and RF modules. The embedded heat sinks and thermal vias incorporated in the design provide excellent thermal management, ensuring stable operation even under high power and temperature conditions.

In consumer electronics, the microvia PCB technology used in Hing’s China HDI PCB allows for compact and lightweight designs without compromising performance. This makes the product perfect for smartphones, tablets, wearable devices, and other portable gadgets where space-saving and high-density interconnects are critical. The ability to support complex multilayer structures also makes these PCBs suitable for advanced computing devices and IoT products.

Industrial automation and automotive electronics are other significant application scenarios. The robust design, combined with reliable thermal management features, ensures that Hing H-HDI PCBs can withstand harsh environments and continuous operation. This makes them suitable for use in sensors, control systems, and electric vehicle components that require durability and precision.

When requesting an HDI PCB quote, customers benefit from Hing’s flexibility, with a minimum order quantity of just 1 unit and a supply ability of up to 1,000,000 units per month. The delivery time is typically 7 days, with a lead time of 2 to 4 weeks depending on complexity. Payment terms are convenient through T/T, and packaging details can be discussed to meet specific logistical needs.

Overall, the Hing H-HDI HDI PCBs stand out for their excellent signal integrity, thermal management, and adaptability across a broad spectrum of application occasions and scenarios. Whether for cutting-edge communication devices, compact consumer electronics, or rugged industrial systems, these China HDI PCBs offer a reliable and efficient solution that meets modern electronic design requirements.


Customization:

Hing offers customized HDI PCBs under model number H-HDI, originating from China, with ISO, UL, and RoHs certifications ensuring high quality and reliability. We specialize in any-layer HDI solutions, providing HDI boards with layer counts ranging from 2 to 40+ layers to meet diverse design requirements.

Our HDI circuit boards are engineered for excellent signal integrity, featuring controlled impedance and high-frequency support, making them ideal for advanced applications such as smartphones, wearables, medical devices, and aerospace.

Thermal management is a key aspect of our customization services, incorporating embedded heat sinks and thermal vias to enhance performance and durability in demanding environments.

We support flexible order quantities, with a minimum order quantity of just 1 unit and a supply ability of up to 1,000,000 units per month. Pricing and packaging details are available upon discussion to best suit your project needs.

Delivery time is typically 7 days, and we accept payment terms via T/T. Trust Hing for your HDI board customization needs, delivering precision-engineered HDI circuit boards tailored for your cutting-edge applications.


Support and Services:

Our HDI PCBs (High-Density Interconnect Printed Circuit Boards) are designed to meet the most demanding requirements of modern electronic applications. To ensure optimal performance and reliability, we offer comprehensive technical support and services tailored to your project needs.

Technical Support:

Our experienced engineers are available to assist you throughout the design and manufacturing process. We provide guidance on material selection, stack-up design, via technology, and signal integrity considerations to help you achieve the best results with your HDI PCB.

Design for Manufacturability (DFM) Review:

We offer detailed DFM reviews to identify potential issues early in the design phase, reducing the risk of production delays and ensuring your PCB meets all quality standards. Our team works closely with your designers to optimize layouts for HDI technology, including microvias, blind and buried vias, and sequential lamination.

Prototyping and Small Batch Production:

To facilitate rapid development cycles, we provide prototyping services and small batch production runs. This allows you to validate your HDI PCB designs before moving to full-scale manufacturing, minimizing risk and enabling quicker time-to-market.

Quality Assurance:

We adhere to strict quality control processes, including automated optical inspection (AOI), X-ray inspection, and electrical testing, to ensure the integrity and performance of every HDI PCB we produce. Our facilities comply with industry standards such as IPC-6012 and ISO 9001.

Customization and Consultation:

Understanding that each project has unique requirements, we offer customized solutions and consulting services. Whether you need assistance with complex layer stacking, impedance control, or advanced materials, our team is ready to support your innovation.

After-Sales Support:

Our commitment to customer satisfaction extends beyond delivery. We provide ongoing support to address any technical questions or issues that arise during assembly or in-field use, helping you maintain the highest level of product performance.

Partner with us for your HDI PCB needs and benefit from expert technical support and services designed to bring your electronic designs to life with precision and reliability.


FAQ:

Q1: What is the brand and model number of the HDI PCBs?

A1: The HDI PCBs are branded as Hing, and the model number is H-HDI.

Q2: Where are the HDI PCBs manufactured?

A2: The HDI PCBs are manufactured in China.

Q3: What certifications do the Hing HDI PCBs have?

A3: The Hing HDI PCBs come with ISO, UL, and RoHS certifications.

Q4: What is the minimum order quantity for the H-HDI PCBs?

A4: The minimum order quantity for the H-HDI PCBs is 1 unit.

Q5: What are the payment terms and delivery time for these HDI PCBs?

A5: The payment terms are T/T, and the delivery time is typically 7 days.

Q6: How many HDI PCBs can Hing supply per month?

A6: Hing has a supply ability of up to 1,000,000 HDI PCBs per month.

Q7: Can the price and packaging details for the H-HDI PCBs be discussed?

A7: Yes, both the price and packaging details are negotiable and can be discussed upon inquiry.


Company Details

Bronze Gleitlager

,

Bronze Sleeve Bushings

 and 

Graphite Plugged Bushings

 from Quality China Factory
  • Business Type:

    Manufacturer,Seller,Exporter

  • Year Established:

    2016

  • Total Annual:

    4000000-5000000

  • Employee Number:

    200~300

  • Ecer Certification:

    Verified Supplier

Shenzhen Hing Technology Co., Ltd was established in 2016. The company is a national high-tech enterprise specializing in the research and development, production and sales of printed circuit boards. Since its establishment, the company has long adhered to the development strategy of quality first,... Shenzhen Hing Technology Co., Ltd was established in 2016. The company is a national high-tech enterprise specializing in the research and development, production and sales of printed circuit boards. Since its establishment, the company has long adhered to the development strategy of quality first,...

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  • Hing Technology Co. Ltd
  • Building No1 Niumendi Industrial Park Number 171 Longwei Road, Longwei Community Meilin Street,Futian district Shenzhen
  • https://www.szhingtech.com/

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