PCB Depaneling Equipment Laser Depaneling of Flex PCB-FPC Cutting Machine

Product Specification

PCB Depaneling Equipment Laser Depaneling of Flex PCB-FPC Cutting Machine
 
1. Description
 
Neat and smooth edge, no burr or overflow
Wide application range, including FPC exterior cutting, profile cutting, drilling, opening window for covering, etc.
Laser wavelength: 355nm
Rated power: 10W/12W/15W/18W@30KHz
Galvanometer working field Per One Process: 40 × 40mm
Power consumption for the hole machine: 2KW
 
2. Features
 
More quick and easy, shorten the delivery time;
High quality ,no distortion,surface clean& uniformity;
Gathering the CNC tech,laser tech,software tech…High accuracy,High speed;
 
3. Cutting Application
 
FPC and some relative materials;
FPC/PCB/ Rigid-Flex PCB cutting, Camera module cutting.
 
Challenges of Depaneling using Routing/Die Cutting/Dicing Saws
 
Damages and fractures to substrates and circuits due to mechanical stress
Damages to PCB due to accumulated debris
Constant need for new bits, custom dies, and blades
Lack of versatility – each new application requires ordering of custom tools, blades, and dies
Not good for high precision, multi-dimensional or complicated cuts
Not useful PCB depaneling/singulation smaller boards
Lasers, on the other hand, are gaining control of the PCB depaneling/singulation market due to higher precision, lower stress on the parts, and higher throughput. Laser depaneling can be applied to a variety of applications with a simple change in settings. There is no bit or blade sharpening, lead time reordering dies and parts, or cracked/broken edges due to torque on the substrate. Application of lasers in PCB depaneling is dynamic and a non-contact process.
 
Advantages of Laser PCB depaneling/singulation
 
No mechanical stress on substrates or circuits;
No tooling cost or consumables;
Versatility – ability to change applications by simply changing settings;
Fiducial Recognition – more precise and clean cut;
Optical Recognition before PCB depaneling/singulation process begins;
Ability to depanel virtually any substrate. (Rogers, FR4, ChemA, Teflon, ceramics, aluminum, brass, copper, etc);
Extraordinary cut quality holding tolerances as small as < 50 microns;
No design limitation – ability to cut virtually and size PCB board including complex contours and multidimensional boards.
 
PCB Depaneling Equipment Laser Depaneling of Flex PCB-FPC Cutting Machine Parameters:
 

 
PCB Depaneling Equipment Laser Depaneling of Flex PCB-FPC Cutting Machine​ Description:
 
PCB depaneling (singulation) laser machines and systems have been gaining popularity over recent years. Mechanical depanaling/singulation is done with routing, die cutting, and dicing saw methods. However, as the boards get smaller, thinner, flexible, and more sophisticated, those methods produce even more exaggerated mechanical stress to the parts. Large boards with heavy substrates absorb these stresses better, while these methods used on ever-shrinking and complex boards can result in breakage. This brings lower throughput, along with the added costs of tooling and waste removal associated with mechanical methods.
Increasingly, flexible circuits are found in the PCB industry, and they also present challenges to the old methods. Delicate systems reside on these boards and non-laser methods struggle to cut them without damaging the sensitive circuitry. A non-contact depaneling method is required and lasers provide a highly precise way of singulation without any risk of harming them, regardless of substrate.
 
   
 
More information welcome to contact us:
 
WhatsApp/Wechat(Bunny): +86 136 8490 4990

Email:s5@smtfly.com