TKM MEMBRANE TECHNOLOGY LTD.
Products
Manufacturer of a wide range of products which include Keyboard Flexible Printed Printing FPC Circuit Board,Keyboard Pet Flexible Printing Circuit Board Electrionic Membrane Switch,Rigid Flexible Printing Electric FPC Circuit Boar...
MOQ: 100
Price: 0.6
| Model NO. | HC-FPC-009 |
| Combination Mode | Adhesive Flexible Plate |
| Conductive Adhesive | Conductive Silver Paste |
| Flame Retardant | HB |
| Processing Technology | Electrolytic Foil |
| Base Material | Copper |
| Insulation Materials | Organic Resin |
| Size | 289.00mm * 216.00mm |
| Key Count | 136 Keys |
| Key Type | Metal Dome and Embossing |
| Connector Type | 65pin (Zif) |
| Overlay Colors | 11 Colors |
| LED Count | 12PCS |
| Wire Resistance | ≤ 1 Ohm/cm |
| Current Rating | 25-100mA, 0-30V DC |
MOQ: 100
Price: 0.6
| Model NO. | HC-FPC-008 |
| Combination Mode | Adhesive Flexible Plate |
| Conductive Adhesive | Conductive Silver Paste |
| Flame Retardant | HB |
| Processing Technology | Electrolytic Foil |
| Base Material | Copper |
| Insulation Materials | Organic Resin |
| Size | 230.00mm * 176.00mm |
| Connector | 65pin (Zif) |
| LED Count | 12PCS |
| Wire Resistance | ≤ 1 Ohm/cm |
| Current Rating | 25-100mA, 0-30V DC |
| Work Voltage | ≤ 50V DC |
| Insulation Voltage | ≤ 100M Ohm 250V DC |
| Working Life | Over One Million Times |
MOQ: 100
Price:
| Model NO. | HC-FPC-020 |
| Combination Mode | Adhesive Flexible Plate |
| Conductive Adhesive | Conductive Silver Paste |
| Flame Retardant | HB |
| Processing Technology | Electrolytic Foil |
| Base Material | Copper |
| Insulation Materials | Organic Resin |
| Size | 289.00mm * 216.00mm |
| Key Count | 136 Keys with Metal Dome and Embossing |
| Connector Type | 65pin (Zif) |
| LED Count | 12PCS |
| Wire Resistance | ≤ 1 Ohm/cm |
| Current Rating | 25-100mA, 0-30V DC |
| Work Voltage | ≤ 50V DC |
| Insulation Voltage | ≤ 100M Ohm 250V DC |
MOQ: 100
Price:
| Model NO. | HC-FPC-006 |
| Material | Synthetic Fiber |
| Flame Retardant | V2 |
| Mechanical Rigid | Rigid |
| Processing Technology | Electrolytic Foil |
| Base Material | Copper |
| Insulation Materials | Epoxy Resin |
| Size | 289.00mm * 216.00mm |
| Key Count | 136 Keys |
| Connector Type | 65pin (Zif) |
| LED Count | 12PCS |
| Wire Resistance | ≤ 1 Ohm/cm |
| Current Rating | 25-100mA, 0-30V DC |
| Work Voltage | ≤ 50V DC |
| Insulation Voltage | ≤ 100M Ohm 250V DC |
MOQ: 100
Price:
| Model NO. | HC-FPC-011 |
| Material | Complex |
| Flame Retardant | V2 |
| Mechanical Rigid | Fexible |
| Processing Technology | Electrolytic Foil |
| Base Material | Aluminum |
| Insulation Materials | Organic Resin |
| Wire Resistance | ≤ 1 Ohm/cm |
| Current Rating | 25-100mA, 0-30V DC |
| Work Voltage | ≤ 50V DC |
| Insulation Voltage | ≤ 100M Ohm 250V DC |
| Working Life | ≤ One Million Times |
| Work Temperature | -40 Centigrade-70 Centigrade |
| Work Humidity | 40 Centigrade-≤ 98%RH |
| Basic Material Pressurization | 1500V DC |
MOQ:
Price:
| Layers | Overlay, Overlay adhesive, Dome retainer, Metal dome, Spacer adhesive, Circuit, Rear adhesive |
| Wire Resistance | ≤ 1 Ohm/cm |
| Current Rating | 25-100mA, 0-30V DC |
| Work Voltage | ≤ 50V DC |
| Insulation Voltage | ≤ 100M Ohm 250V DC |
| Working Life | ≤ One Million Times |
| Work Temperature | -40 Centigrade-70 Centigrade |
| Work Humidity | 40 Centigrade-≤ 98%RH |
| Basic Material Pressurization | 1500V DC |
MOQ:
Price:
| Wire Resistance | ≤ 1 Ohm/cm |
| Current Rating | 25-100mA, 0-30V DC |
| Work Voltage | ≤ 50V DC |
| Insulation Voltage | ≤ 100M Ohm 250V DC |
| Working Life | ≤ One Million Times |
| Work Temperature | -40°C to 70°C |
| Work Humidity | 40°C to ≤ 98%RH |
| Base Material Voltage | 1500V DC |
| Dome Springback Time | < 5 msec |
| Switch Travel | Flat Type 0.05-0.3mm, Tactile Type 0.3-1.5mm |
| Tail Flexibility | Any angle within 180 degrees |
| Material | PET/PC |
| Adhesive Type | 3M467 & 3M468 or as per request |
| Life Cycle | >1 million times |
| Insulation Resistance | <100MΩ, 250V DC |
MOQ: 100
Price:
| Model NO. | HC-FPC-005 |
| Combination Mode | Adhesive Flexible Plate |
| Conductive Adhesive | Conductive Silver Paste |
| Flame Retardant | V2 |
| Processing Technology | Delay Pressure Foil |
| Base Material | Copper |
| Insulation Materials | Metal Composite Materials |
| Rated Current | 25-100mA, 0~30V DC |
| Life Time | >1 Million Times |
| Average Thickness | 1.1-0. Am |
| Minimum Hole Dimension | 0.3mm |
| Minimum Linear Width | 0.08mm |
| Minimum Linear Distance | 0.08mm |
| External Tolerance | +/-0.05mm |
| Welding Resistance | 280 more than 10 seconds |
MOQ: 100
Price: 5.3
| Combination Mode | Adhesive Flexible Plate |
| Conductive Adhesive | Conductive Silver Paste |
| Flame Retardant | HB |
| Processing Technology | Electrolytic Foil |
| Base Material | Aluminum |
| Insulation Materials | Organic Resin |
| Dimensions | 7.81'' x 6.56'' |
| Wire Lead Resistance | <1Ω/CM |
| Life Time | >1 Million times |
| Rated Current | 25-100mA,0~30V DC |
| Operation Temperature | -40~70°C |
| Rated Voltage | <50V, DC |
| Insulation Resistance | <100MΩ,250V DC |
| Switch Travel | Flat Type 0.05-0.3mm |
| Model Number | HC-FPC-009 |
MOQ: 100
Price:
| Model NO. | HC-FPC-002 |
| Combination Mode | Adhesive Flexible Plate |
| Conductive Adhesive | Conductive Silver Paste |
| Flame Retardant | HB |
| Processing Technology | Electrolytic Foil |
| Base Material | Aluminum |
| Insulation Materials | Organic Resin |
| Average Thickness | 1.1-0. Am |
| Copper Foil Type | Electrolytic and Rolled |
| Copper Foil Thickness | 1oz, 1/2oz, 1/3oz |
| Substrate Film Thickness | 1mil, 1/2mil |
| Cover Film Thickness | 1mil, 1/2mil |
| Stiffener Thickness | 3mil to 9mil |
| Production Capacity | 100,000PCS/Month |
| HS Code | 8536500000 |
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