Dongguan Ziitek Electronic Materials & Technology Ltd.
| Supply Ability | 100000pcs/day |
| Delivery Time | 3-5 days |
| Packaging Details | 1000pcs/bag |
| Payment Terms | T/T |
| Products name | Easy Assembly 3.0W Cost-Effective General Economic Thermal Gap Filling Gasket For Electron Components |
| Color | Blue |
| Thermal conductivity | 3.0W/mK |
| Hardness | 50/20 Shore 00 |
| Specific Gravity | 3.0 g/cm³ |
| Dielectric Constant @1MHz | 7.0 |
| Recommended Operating Temperature (°C) | -40 ~ 200℃ |
| Keywords | Thermal Gap Filling |
| Application | Electron Components |
| Brand Name | ZIITEK |
| Model Number | TIF100-30-05US |
| Certification | UL and RoHs |
| Place of Origin | China |
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Product Specification
| Supply Ability | 100000pcs/day | Delivery Time | 3-5 days |
| Packaging Details | 1000pcs/bag | Payment Terms | T/T |
| Products name | Easy Assembly 3.0W Cost-Effective General Economic Thermal Gap Filling Gasket For Electron Components | Color | Blue |
| Thermal conductivity | 3.0W/mK | Hardness | 50/20 Shore 00 |
| Specific Gravity | 3.0 g/cm³ | Dielectric Constant @1MHz | 7.0 |
| Recommended Operating Temperature (°C) | -40 ~ 200℃ | Keywords | Thermal Gap Filling |
| Application | Electron Components | Brand Name | ZIITEK |
| Model Number | TIF100-30-05US | Certification | UL and RoHs |
| Place of Origin | China | ||
| High Light | thermal conductive gap filler 7.5 MHz ，thermal conductive gap filler 2mmT ，2mmT thermal gap filler pad | ||
Easy Assembly 3.0W Cost-Effective General Economic Thermal Gap Filling Gasket For Electron
Components
Products description
The TIF100-30-05US Series thermal pad is a very cost-effective general economic thermal gap filling gasket, soft with its own micro-stick, easy assembly. Under low compressing force to show good thermal conductivity and electrical insulation properties. Bedding on the gap between the heat device and the heat sink or the machine shell to extrude air to reach the full contact forming a continuous thermal conduction. Using heat sink or machine shell as a cooling device can effectively increase the cooling area to achieve a good cooling purposes.
Features:
> RoHS compliant 1.5 W/mK
> UL recognized
> Fiberglass reinforced for puncture, shear and tear resistance3 W/mK
> Easy release construction
> Electrically isolating
> High durability
Applications:
> Rainproof LED Power
> Waterproof LED Power
> SMD LED module
> LED Flesible strip, LED bar
> LED Panel Light
> LED floor light
> Routers
> Medical Devices
> Auditioning electronic products
> Unmanned aerial vehicle(UAV)
> Photovoltaic
> Signal communication
> New energy vehicle
> Motherboard chip
> Radiator
> AI Processors AI Servers
> CPU
> Display card
> Mainboard/mother board
| Typical Properties of TIF®100-30-05US Series | |||
| Property | Value | Test method | |
| Color | Blue | Visual | |
| Construction & Compostion | Ceramic filled silicone elastomer | ****** | |
| Density(g/cm³) | 3.0 | ASTM D792 | |
| Thickness Range(inch/mm) | 0.010~0.020 | 0.030~0.200 | ASTM D374 |
| (0.25~0.50) | (0.75~5.00) | ||
| Hardness | 50 Shore 00 | 20 Shore 00 | ASTM 2240 |
| Recommended Operating Temperature | -40 to 200℃ | ****** | |
| Breakdown Voltage(V/mm) | ≥5500 | ASTM D149 | |
| Dielectric Constant | 7.0 MHz | ASTM D150 | |
| Volume Resistivity | ＞1.0X1012 Ohm-meter | ASTM D257 | |
| Flame rating | V-0 | UL 94 (E331100) | |
| Thermal conductivity | 3.0 W/m-K | ASTM D5470 | |
| 3.0 W/m-K | ISO22007 | ||
Product Specification
Product Thicknesses: 0.010"(0.25mm)~ 0.200" (5.00mm) with increments of 0.010"(0.25mm).
Product Sizes: 16" x 16" (406mm x 406mm)
Component Codes:
Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment),
DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).
The TIF® series is available in custom shapes and various forms.
For other thicknesses or more information, please contact us.
Company profile
Dongguan Ziitek Electronic Material Technology Co., Ltd. was established in 2006. Is a high-tech enterprise specializing in the research, development, production and sales of thermal interface materials. We mainly produce: heat-conducting joint filler, low melting point thermal interface materials, heat-conducting insulator, heat-conducting adhesive tape, heat-conducting interface pad and heat-conducting grease, heat-conducting plastic, silicone rubber, silicone rubber foam, etc. We adhere to the business philosophy of "survival by quality, development by quality", and continue to provide the most efficient and best service for new and old customers with excellent quality in the spirit of rigor, pragmatism and innovation.
Factory Size:8000~10,000 square meters
Factory Country/Region:No.12, Xiju Road, Hengli Township, Dongguan City, Guangdong Province, P.R.China
Online-service : 12 hours , Inquiry reply within fastest.
Working time: 8:00am - 5:30pm, Monday to Saturday (UTC+8).
Well-trained & experienced staff are to answer all your inquiries in English of course.
Standard Export Carton Or Marked With Customer's Information Or Customized.
Provide free samples
After-service: Even our products have passed strict inspection, if you find the parts can not work well, please show us the proof.
we will help you to deal with it and give you satisfactory solution.
Company Details
Business Type:
Manufacturer
Year Established:
2006
Total Annual:
30000000-35700000
Employee Number:
600~700
Ecer Certification：
Verified Supplier
Dongguan Ziitek Electronical Material and Technology, Ltd. provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent. ENTERPRISE CULTURE VIS... Dongguan Ziitek Electronical Material and Technology, Ltd. provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent. ENTERPRISE CULTURE VIS...
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