
Dongguan Ziitek Electronical Material and Technology Co., Ltd
| Keywords | Silicone Gap Pad |
| Application | For Thermal Management |
| Products name | Thermal Gap Filler Silicone Gap Pad With Electrical Isolation And Naturally Tacky Surface For Thermal Management |
| Payment Terms | T/T |
| Recommended Operating Temperature (℃) | -40 to 200℃ |
| Color | Blue |
| Hardness | 65/45 Shore 00 |
| Supply Ability | 10000/day |
| Delivery Time | 3-5work days |
| Packaging Details | 1000pcs/bag |
| Thermal conductivity | 2.0W/mK |
| Density | 2.65 g/cm³ |
| Brand Name | ZIITEK |
| Model Number | TIF130-20-05S |
| Certification | UL and RoHs |
| Place of Origin | China |
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Product Specification
| Keywords | Silicone Gap Pad | Application | For Thermal Management |
| Products name | Thermal Gap Filler Silicone Gap Pad With Electrical Isolation And Naturally Tacky Surface For Thermal Management | Payment Terms | T/T |
| Recommended Operating Temperature (℃) | -40 to 200℃ | Color | Blue |
| Hardness | 65/45 Shore 00 | Supply Ability | 10000/day |
| Delivery Time | 3-5work days | Packaging Details | 1000pcs/bag |
| Thermal conductivity | 2.0W/mK | Density | 2.65 g/cm³ |
| Brand Name | ZIITEK | Model Number | TIF130-20-05S |
| Certification | UL and RoHs | Place of Origin | China |
| High Light | thermally conductive filler ,thermal conductivity silicone ,Thermal Gap Filler Naturally tacky | ||
Thermal Gap Filler Silicone Gap Pad With Electrical Isolation And Naturally Tacky Surface For Thermal Management
The TIF®130-20-05S is recommended for applications that require a minimum amount of pressure on components. The viscoelastic nature of the material also gives excellent low-stress vibration dampening and shock absorbing characteristics. Ziitek TIF®130-20-05S is an electrically isolating material, which allows its use in applications requiring isolation between heat sinks and high-voltage, bare-leaded devices.
Features:
> Good thermal conductive: 2 W/mK
> Naturally tacky needing no further adhesive coating
> Soft and Compressible for low stress applications
> Outstanding thermal performance
> Available in varies thickness
Applications:
> Cooling components to the chassis of frame
> High speed mass storage drives
> Heat Sinking Housing at LED-lit BLU in LCD
> LED TV and LED-lit lamps
> RDRAM memory modules
> Micro heat pipe
> Automotive engine control units
> Telecommunication hardware
> Cooling components to chassis frame or other mating components
> Home and small office network equipment
> Handheld portable electronics
> Plasma supply panels
> Semiconductor automated test equipment (ATE)
> Heat pipe thermal solutions
> Memory Modules
> Mass storage devices
> Automotive electronics
| Typical Properties of TIF®100-20-05S Series | |||
| Property | Value | Test method | |
| Color | Blue | Visual | |
| Construction & Compostion | Ceramic filled silicone elastomer | ****** | |
| Density(g/cm³) | 2.65 | ASTM D792 | |
| Thickness Range(inch/mm) | 0.010~0.020 | 0.030~0.200 | ASTM D374 |
| 0.25~0.50 | 0.75~5.00 | ||
| Hardness(Shore 00) | 65 | 45 | ASTM 2240 |
| Recommended Operating Temperature (℃) | -40 to 200 | *** | |
| Breakdown Voltage(V/mm) | ≥5500 | ASTM D149 | |
| Dielectric Constant @1Mhz | 4.7 | ASTM D150 | |
| Volume Resistivity(Ohm-cm) | >1.0X1012 | ASTM D257 | |
| Thermal Conductivity (W/m-K) | 2.0 | ASTM D5470 | |
| 2.0 | ISO22007 | ||
| Fire rating | V-0 | UL 94 (E331100) | |
Product Specifications
Standard Thickness:0.010" (0.25 mm)~0.200" (5.00 mm) with increments of 0.010" (0.25 mm)
Standard Size: 16"X 16" (406 mmX406 mm)
Component Codes:
Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment),
DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).
The TIF® series is available in custom shapes and various forms.
For other thicknesses or more information, please contact us.
Packaging Details & Lead time
The packaging of thermal pad
1.with PET film or foam-for protection
2. use Paper Card To Separate Each Layer
3. export carton inside and outside
4. meet with customers' requirement-customized
Lead Time :Quantity(Pieces):5000
Est. Time(days): To be negotiated
Company Profile
Ziitek company is a manufacturer of thermal conductive gap fillers, low melting point thermal interface materials, thermal conductive insulators, thermally conductive tapes, electrically & thermally conductive Interface pads and thermal grease,Thermal Conductive plastic,Silicone Rubber,Silicone Foams,Phase Changing Materials products, with well-equipped testing equipment and strong technical force.
FACTORY INFORMATION:
Factory Size
5,000-10,000 square meters
Factory Country/Region
Building B8, Industry District Ⅱ, Xicheng, Hengli Township, Dongguan City, Guangdong Province, P.R.China
Annual Output Value
US$1 Million - US$2.5 Million
Q&A
Q: Are you trading company or manufacturer ?
A: We are manufacturer in China.
Q: How long is your delivery time?
A: Generally it is 3-7 work days if the goods are in stock. or it is 7-10 work days if the goods are not in stock, it is according to quantity.
Q: Do you provide samples ? is it free or extra cost?
A: Yes, we could offer samples free of charge.
Company Details
Business Type:
Manufacturer
Year Established:
2006
Total Annual:
30000000-35700000
Employee Number:
600~700
Ecer Certification:
Verified Supplier
Dongguan Ziitek Electronical Material and Technology Co., Ltd. provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent. ENTERPRISE CULTUREVISIONBui... Dongguan Ziitek Electronical Material and Technology Co., Ltd. provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent. ENTERPRISE CULTUREVISIONBui...
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