Dongguan Ziitek Electronic Materials & Technology Ltd.
| Color | Blue |
| Thermal conductivity | 5.0 W/m-K |
| Product name | Telecommunication Hardware Blue 5.0W/mK Thermal Gap Filler Materials Thermal Silicone Rubber Pad |
| Application | Telecommunication Hardware |
| Supply Ability | 10000/day |
| Delivery Time | 3-5work days |
| Packaging Details | 1000pcs/bag |
| Payment Terms | T/T |
| Thickness | Available In Varies Thicknes |
| Keywords | Thermal Gap Filler |
| Model | TIF100-50-05S |
| Density | 3.4 g/cm³ |
| Construction | Ceramic filled silicone elastomer |
| Brand Name | ZIITEK |
| Model Number | TIF100-50-05S |
| Certification | UL and RoHs |
| Place of Origin | China |
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Product Specification
| Color | Blue | Thermal conductivity | 5.0 W/m-K |
| Product name | Telecommunication Hardware Blue 5.0W/mK Thermal Gap Filler Materials Thermal Silicone Rubber Pad | Application | Telecommunication Hardware |
| Supply Ability | 10000/day | Delivery Time | 3-5work days |
| Packaging Details | 1000pcs/bag | Payment Terms | T/T |
| Thickness | Available In Varies Thicknes | Keywords | Thermal Gap Filler |
| Model | TIF100-50-05S | Density | 3.4 g/cm³ |
| Construction | Ceramic filled silicone elastomer | Brand Name | ZIITEK |
| Model Number | TIF100-50-05S | Certification | UL and RoHs |
| Place of Origin | China | ||
| High Light | thermally conductive filler ，thermal conductivity silicone ，5.0W/mK Thermal Gap Filler Materials | ||
Telecommunication Hardware Blue 5.0W/mK Thermal Gap Filler Materials Thermal Silicone Rubber Pad
Company Profile
Dongguan Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite thermal solution and manufacturing superior thermal interface materials for competitive market. Our vast experience allows us to assist our customers best in thermal engineering field. We serve customers with customized products, full product lines and flexible production, which makes us be the best and reliable partner of you. Let's make your design more perfect!
Products description
The TIF®100-50-05S is not only designed to take advantage of the gap heat transfer, to fill gaps, complete the heat transfer between heating and cooling parts, but also played insulation, damping, sealing and so on, to meet the equipment miniaturization and ultra-thin design Requirements, which is a highly technology and use, and the thickness of the wide range of applications, is also an excellent thermal conductivity filler material.
Features:
> Good thermal conductive: 5.0 W/mK
> Naturally tacky needing no further adhesive coating
> Soft and Compressible for low stress applications
> Broad range of hardnesses available
> Outstanding thermal performance
Applications:
> mainboard/mother board
> LED TV and LED-lit lamps
> RDRAM memory modules
> Micro heat pipe thermal solutions
> Automotive engine control units
> Automotive electronics
> Handheld portable electronics
> Semiconductor automated test equipment (ATE)
> GPS navigation and other portable devices
| Typical Properties of TIF®100-50-05S Series | |||
| Property | Value | Test method | |
| Color | Blue | Visual | |
| Construction | Ceramic filled silicone elastomer | ****** | |
| Density(g/cm³) | 3.4 | ASTM D792 | |
| Thickness Range(inch/mm) | 0.010~0.020 | 0.030~0.200 | ASTM D374 |
| (0.25~0.50) | (0.75~5.00) | ||
| Hardness | 65 Shore 00 | 45 Shore 00 | ASTM 2240 |
| Recommended Operating Temperature | -40 to 200℃ | ****** | |
| Breakdown Voltage(V/mm) | ≥5500 | ASTM D149 | |
| Dielectric Constant | 7.5 MHz | ASTM D150 | |
| Volume Resistivity | ＞1.0X1012 Ohm-meter | ASTM D257 | |
| Flame rating | V-0 | UL 94 (E331100) | |
| Thermal conductivity | 5.0 W/m-K | ASTM D5470 | |
| 5.0 W/m-K | ISO22007 | ||
Products specification
Standard Thickness: 0.010"(0.25 mm)~0.200" (5.00 mm) with increments of 0.010" (0.25 mm).
Standard Size:16"×16" (406 mm×406 mm).
Component Codes:
Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment), DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).
The TIF® series is available in custom shapes and various forms.
For other thicknesses or more information, please contact us.
Packaging Details & Lead time
The packaging of thermal pad
1.with PET film or foam-for protection
2. use Paper Card To Separate Each Layer
3. export carton inside and outside
4. meet with customers' requirement-customized
Lead Time :Quantity(Pieces):5000
Est. Time(days): To be negotiated
Why Choose us ?
1.Our value message is'' Do it right the First time, total quality control''.
2.Our core competencies is thermal conductive interface materials
3.Competitive advantage products.
4.Condidentiality agreement Bussiness Secrect Contract
5.Free sample offer
6.Quality assurance contract
FAQ:
Q: Are you trading company or manufacturer ?
A: We are manufacturer in China.
Q: How long is your delivery time?
A: Generally it is 3-7 work days if the goods are in stock. or it is 7-10 work days if the goods are not in stock, it is according to quantity.
Q: Do you provide samples ? is it free or extra cost?
A: Yes, we could offer samples free of charge.
Company Details
Business Type:
Manufacturer
Year Established:
2006
Total Annual:
30000000-35700000
Employee Number:
600~700
Ecer Certification：
Verified Supplier
Dongguan Ziitek Electronical Material and Technology, Ltd. provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent. ENTERPRISE CULTURE VIS... Dongguan Ziitek Electronical Material and Technology, Ltd. provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent. ENTERPRISE CULTURE VIS...
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