Dongguan Ziitek Electronic Materials & Technology Ltd.
| Supply Ability | 10000/day |
| Delivery Time | 3-5work days |
| Packaging Details | 1000pcs/bag |
| Hardness | 20 Shore 00 |
| Specific Gravity | 3.1 g/cc |
| Dielectric Breakdown Voltage | >5500 VAC |
| Fire rating | 94-V0 |
| Construction & Compostion | Ceramic filled silicone rubber |
| Tensile Strength | 40 psi |
| Brand Name | ZIITEK |
| Model Number | TIF500-40-11US |
| Certification | UL and RoHs |
| Place of Origin | China |
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Product Specification
| Supply Ability | 10000/day | Delivery Time | 3-5work days |
| Packaging Details | 1000pcs/bag | Hardness | 20 Shore 00 |
| Specific Gravity | 3.1 g/cc | Dielectric Breakdown Voltage | >5500 VAC |
| Fire rating | 94-V0 | Construction & Compostion | Ceramic filled silicone rubber |
| Tensile Strength | 40 psi | Brand Name | ZIITEK |
| Model Number | TIF500-40-11US | Certification | UL and RoHs |
| Place of Origin | China | ||
| High Light | 4.0W/MK Thermally Conductive Gap Filler Pads ，CPU Thermally Conductive Gap Filler Pads ，CPU Heat Dissipation Gap Pad | ||
Naturally tacky gray Good Thermal Conductive pad For CPU Heat Dissipation 4.0 W/mK RoHS compliant TIF500-40-11US
The TIF500-40-11US Series thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base. Their flexibility and elasticity make them suited to the coating of the very uneven surfaces. Heat can transmit to the metal housing or dissipation plate from the separate elements or even the entire PCB, which in effect enhances the efficiency and life-time of the heat-generating electronic components.
Features:
> Good thermal conductive: 4.0 W/mK
> Naturally tacky needing no further adhesive coating
> Soft and Compressible for low stress applications
> Available in varies thickness
Applications:
> Cooling components to the chassis of frame
> High speed mass storage drives
> Heat Sinking Housing at LED-lit BLU in LCD
> LED TV and LED-lit lamps
> RDRAM memory modules
> Micro heat pipe thermal solutions
> Automotive engine control units
> Telecommunication hardware
> Handheld portable electronics
> Semiconductor automated test equipment (ATE)
Typical Properties of TIF500-40-11US Series | ||||
Color | gray | Visual | Composite Thickness | hermalImpedance @10psi (℃-in²/W) |
Construction & Compostion | Ceramic filled silicone rubber | *** | 10mils / 0.254 mm | 0.55 |
| 20mils / 0.508 mm | 0.82 | |||
Specific Gravity | 3.1 g/cc | ASTM D297 | 30mils / 0.762 mm | 1.01 |
40mils / 1.016 mm | 1.11 | |||
Heat Capacity | 1 l/g-K | ASTM C351 | 50mils / 1.270 mm | 1.27 |
60mils / 1.524 mm | 1.45 | |||
Hardness | 20 (Shore 00) | ASTM 2240 | 70mils / 1.778 mm | 1.61 |
80mils / 2.032 mm | 1.77 | |||
| Tensile Strength | 40 psi | ASTM D412 | 90mils / 2.286 mm | 1.91 |
100mils / 2.540 mm | 2.05 | |||
Continuos Use Temp | -40 to 160℃ | *** | 110mils / 2.794 mm | 2.16 |
120mils / 3.048 mm | 2.29 | |||
Dielectric Breakdown Voltage | >5500 VAC | ASTM D149 | 130mils / 3.302mm | 2.44 |
140mils / 3.556 mm | 2.56 | |||
Dielectric Constant | 4.0 MHz | ASTM D150 | 150mils / 3.810 mm | 2.67 |
160mils / 4.064 mm | 2.77 | |||
Volume Resistivity | 6.0X1013 Ohm-meter | ASTM D257 | 170mils / 4.318 mm | 2.89 |
180mils / 4.572 mm | 2.98 | |||
Fire rating | 94 V0 | equivalent UL | 190mils / 4.826 mm | 3.05 |
200mils / 5.080 mm | 3.14 | |||
Thermal conductivity | 4.0 W/m-K | ASTM D5470 | Visua l/ ASTM D751 | ASTM D5470 |
Company Profile
1. Ziitek Electronic Material and Technology Ltd. is a R&D and production company, we have many production lines and processing technology of thermal conductive materials, owns advanced production equipment and optimized process, can provide various thermal solutions for different applications.
FAQ:
Q: How do I request customized samples?
A: To request samples, you can leave us message on website, or just contact us by send email or call us.
Q: What's the thermal conductivity test method given on the data sheet ?
A: All the data in the sheet are actual tested.Hot Disk and ASTM D5470 are utilized to test the thermal conductivity.
Q: How to find a right thermal conductivity for my applications
A: It depends on the watts of power source , ability of heat dissipation. Please tell us your detailed applications and the power, so we can recommend most suitable thermal conductive materials.
TIF500-40-11US Datasheet-REV02.pdf
Company Details
Business Type:
Manufacturer
Year Established:
2006
Total Annual:
100000-160000
Employee Number:
100~150
Ecer Certification：
Verified Supplier
Dongguan Ziitek Electronical Material and Technology Ltd. provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent. Ziitek D-U-N-S... Dongguan Ziitek Electronical Material and Technology Ltd. provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent. Ziitek D-U-N-S...
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