Dongguan Ziitek Electronic Materials & Technology Ltd.
| Payment Terms | T/T |
| Supply Ability | 10000/day |
| Delivery Time | 3-5work days |
| Packaging Details | 1000pcs/bag |
| Product name | 5.0 W/MK Heat Transfer Thermal Silicone Gel Pad High Performance Thermal Pad For AI Processors Cooling |
| Construction & Compostion | Ceramic filled silicone elastomer |
| Color | Dark Gray |
| Thermal conductivity | 5.0W/m-K |
| Hardness | 27 Shore 00 |
| Applicatioon | Laptop AI Processors Cooling |
| Thickness range | 0.25~5.0mm(0.010~0.20 inch) |
| Keywords | Heat Transfer Thermal Pad |
| Brand Name | ZIITEK |
| Model Number | TIF500-50-11U |
| Certification | UL and RoHs |
| Place of Origin | China |
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Product Specification
| Payment Terms | T/T | Supply Ability | 10000/day |
| Delivery Time | 3-5work days | Packaging Details | 1000pcs/bag |
| Product name | 5.0 W/MK Heat Transfer Thermal Silicone Gel Pad High Performance Thermal Pad For AI Processors Cooling | Construction & Compostion | Ceramic filled silicone elastomer |
| Color | Dark Gray | Thermal conductivity | 5.0W/m-K |
| Hardness | 27 Shore 00 | Applicatioon | Laptop AI Processors Cooling |
| Thickness range | 0.25~5.0mm(0.010~0.20 inch) | Keywords | Heat Transfer Thermal Pad |
| Brand Name | ZIITEK | Model Number | TIF500-50-11U |
| Certification | UL and RoHs | Place of Origin | China |
| High Light | 5.0 W/MK thermal silicone gel pad ，high performance thermal pad for AI processors ，thermal conductive pad for cooling | ||
5.0 W/MK Heat Transfer Thermal Silicone Gel Pad High Performance Thermal Pad For AI Processors Cooling
Company Profile
Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite thermal solution and manufacturing superior thermal interface materials for competitive market. Our vast experience allows us to assist our customers best in thermal engineering field.We serve customers with customized products, full product lines and flexible production, which makes us be the best and reliable partner of you. Let's make your design more perfect!
Products description
TIF®500-50-11U Series is an ultra-soft thermal interface material designed specifically to protect precision components that are extremely sensitive to mechanical stress. This product combines high thermal conductivity with exceptional gel-level softness,achieving a perfectly low-stress fit. It is suitable for addressing issues such as large tolerances, uneven surfaces,and the susceptibility of precision components to mechanical damage in high-precision assemblies.
Features:
> High thermal conductivity
> Super soft and highly compliant
> Self-adhesive without the need for additional surface adhesives
> Good insulation performance
> Available in varies thicknesses
> Broad range of hardnesses available
> Outstanding thermal performance
Applications:
> Power tools
> Network communication products
> Electric vehicle batteries
> Computer CPU/GPU Cooling
> New energy vehicle power systems
> Heat pipe thermal solutions
> Memory Modules
> Mass storage devices
> Automotive electronics
| Typical Properties of TIF®500-50-11U Series | |||
| Property | Value | Test method | |
| Color | Dark Gray | Visual | |
| Construction & Compostion | Ceramic filled silicone elastomer | ****** | |
| Density(g/cm³) | 3.3 | ASTM D792 | |
| Thickness Range(inch/mm) | 0.010~0.020 | 0.030~0.200 | ASTM D374 |
| (0.25~0.5) | (0.75~5.0) | ||
| Hardness | 65 Shore 00 | 27 Shore 00 | ASTM 2240 |
| Recommended Operating Temperature | -40 to 200℃ | ****** | |
| Breakdown Voltage(V/mm) | ≥5500 | ASTM D149 | |
| Dielectric Constant | 7.0 MHz | ASTM D150 | |
| Volume Resistivity | ＞1.0X1012 Ohm-meter | ASTM D257 | |
| Flame rating | V-0 | UL 94 (E331100) | |
| Thermal conductivity | 5.0 W/m-K | ASTM D5470 | |
| 5.0 W/m-K | ISO22007 | ||
Packaging Details & Lead time
The packaging of thermal pad
1.with PET film or foam-for protection
2. use Paper Card To Separate Each Layer
3. export carton inside and outside
4. meet with customers' requirement-customized
Lead Time :Quantity(Pieces):5000
Est. Time(days): To be negotiated
FAQ:
Q: Are you trading company or manufacturer ?
A: We are manufacturer in China.
Q: What thermal conductivity test method was used to achieve the values given on the data sheets?
A: A test fixture is utilized that meets the specifications outlined in ASTM D5470.
Q: Is GAP PAD offered with an adhesive?
A: Currently, Most of thermal gap pad surface has double side natural inherent tack,Non-stick surface can also be treated according to customer's requirements.
Independent R&D team
Q: How do I place an order?
A:1. Click the "Sent messages" button to continue with the process.
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4. We will reply you as soon as possible with Email or online.
Company Details
Business Type:
Manufacturer
Year Established:
2006
Total Annual:
30000000-35700000
Employee Number:
600~700
Ecer Certification：
Verified Supplier
Dongguan Ziitek Electronical Material and Technology, Ltd. provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent. ENTERPRISE CULTURE VIS... Dongguan Ziitek Electronical Material and Technology, Ltd. provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent. ENTERPRISE CULTURE VIS...
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