Dongguan Ziitek Electronic Materials & Technology Ltd.
| Supply Ability | 10000/day |
| Delivery Time | 3-5work days |
| Packaging Details | 1000pcs/bag |
| Payment Terms | T/T |
| Product name | Highly Efficient Thermal Conductivity 1.2W/MK Silicone Thermal Pads For Laptop Heat Insulation Materials |
| Sample | Sample free |
| Keywords | Silicone Thermal Pads |
| Flame Rating | UL 94 V-0 |
| Continuos Use Temp | -40 to 200℃ |
| Hardness | 65/27 Shore 00 |
| Thermal conductivity（W/mk） | 1.2W/mK |
| Dielectric Constant @1MHz | 4.0 |
| Construction & Compostion | Ceramic filled silicone elastomer |
| Application | Laptop Heatsink CPU GPU LED Cooler |
| Brand Name | ZIITEK |
| Model Number | TIF100-12-66U |
| Certification | UL and RoHs |
| Place of Origin | China |
View Detail Information
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Product Specification
| Supply Ability | 10000/day | Delivery Time | 3-5work days |
| Packaging Details | 1000pcs/bag | Payment Terms | T/T |
| Product name | Highly Efficient Thermal Conductivity 1.2W/MK Silicone Thermal Pads For Laptop Heat Insulation Materials | Sample | Sample free |
| Keywords | Silicone Thermal Pads | Flame Rating | UL 94 V-0 |
| Continuos Use Temp | -40 to 200℃ | Hardness | 65/27 Shore 00 |
| Thermal conductivity（W/mk） | 1.2W/mK | Dielectric Constant @1MHz | 4.0 |
| Construction & Compostion | Ceramic filled silicone elastomer | Application | Laptop Heatsink CPU GPU LED Cooler |
| Brand Name | ZIITEK | Model Number | TIF100-12-66U |
| Certification | UL and RoHs | Place of Origin | China |
| High Light | 100x100mm silicone thermal pad ，1.2W/MK thermal conductive pad ，laptop heat insulation silicone pad | ||
Highly Efficient Thermal Conductivity 1.2W/MK Silicone Thermal Pads For Laptop Heat Insulation Materials
Products description
The TIF®100-12-66U thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base.Their flexibility and elasticity make them suited to coat very uneven surfaces.Heat can transmit to the metal housing or dissipation plate from the heating elements or even the entire PCB, which effecitly enhances the efficiency and life-time of the heat-generating electronic components.
Features:
> Good thermal conductive :1.2W/mK
> Moldability for complex parts
> Soft and compressible for low stress applications
> Naturally tacky needing no further adhesive coating
> Available in varies thicknesses
Applications:
> Cooling components to the chassis of frame
> High speed mass storage drives
> Heat Sinking Housing at LED-lit BLU in LCD
> LCD TV and LED-lit lamps
> RDRAM memory modules
> Micro heat pipe thermal solutions
> Automotive engine control units
> Telecommunication hardware
> CPU
> Memory Modules
> Mass storage devices
> Automotive electronics
> Set top boxes
| Typical Properties of TIF®100-12-66U Series | |||
| Property | Value | Test method | |
| Color | Green | Visual | |
| Construction & Compostion | Ceramic filled silicone elastomer | ****** | |
| Density(g/cm³) | 2.0 | ASTM D792 | |
| Thickness Range(inch/mm) | 0.010~0.020 | 0.030~0.200 | ASTM D374 |
| (0.25~0.50) | (0.75~5.00) | ||
| Hardness | 65 Shore 00 | 27 Shore 00 | ASTM 2240 |
| Recommended Operating Temperature | -40 to 200℃ | ****** | |
| Breakdown Voltage(V/mm) | ≥5500 | ASTM D149 | |
| Dielectric Constant | 4.0 MHz | ASTM D150 | |
| Volume Resistivity | ＞1.0X1012 Ohm-meter | ASTM D257 | |
| Flame rating | V-0 | UL 94 (E331100) | |
| Thermal conductivity | 1.2 W/m-K | ASTM D5470 | |
| 1.2 W/m-K | ISO22007 | ||
Product Specifications
Standard Thickness: 0.010" (0.25 mm)~0.200" (5.00 mm) with increments of 0.010" (0.25 mm)
Standard Size: 16"×16" (406 mmX406 mm)
Component Codes:
Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment),
DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).
The TIF® series is available in custom shapes and various forms.
For other thicknesses or more information, please contact us.
Packaging Details & Lead time
The packaging of thermal pad
1.with PET film or foam-for protection
2. use Paper Card To Separate Each Layer
3. export carton inside and outside
4. meet with customers' requirement-customized
Lead Time :Quantity(Pieces):5000
Est. Time(days): To be negotiated
Dongguan Ziitek Electronic Material Technology Co., Ltd. was established in 2006. Is a high-tech enterprise specializing in the research, development, production and sales of thermal interface materials. We mainly produce: heat-conducting joint filler, low melting point thermal interface materials, heat-conducting insulator, heat-conducting adhesive tape, heat-conducting interface pad and heat-conducting grease, heat-conducting plastic, silicone rubber, silicone rubber foam, etc. We adhere to the business philosophy of "survival by quality, development by quality", and continue to provide the most efficient and best service for new and old customers with excellent quality in the spirit of rigor, pragmatism and innovation.
Certifications:
ISO9001:2015
ISO14001: 2004 IATF16949:2016
IECQ QC 080000:2017
UL
Independent R&D team
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Company Details
Business Type:
Manufacturer
Year Established:
2006
Total Annual:
30000000-35700000
Employee Number:
600~700
Ecer Certification：
Verified Supplier
Dongguan Ziitek Electronical Material and Technology, Ltd. provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent. ENTERPRISE CULTURE VIS... Dongguan Ziitek Electronical Material and Technology, Ltd. provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent. ENTERPRISE CULTURE VIS...
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