Dongguan Ziitek Electronic Materials & Technology Ltd.
| Supply Ability | 100000pcs/day |
| Delivery Time | 3-5 work days |
| Packaging Details | 1000pcs/bag |
| Payment Terms | T/T |
| Products name | Pink 1.0W/M.K Cooling Gap Filler Insulation Silicone Thermal Pad For Semiconductor Heat Dissipation |
| Hardness | 10 Shore 00 |
| Application | Semiconductor Heat Dissipation |
| Thermal conductivity | 1.0W/m-K |
| Color | Pink/ White |
| Continuous Use Temp | -40 to 200℃ |
| Sample | Sample free |
| Thickness | 0.010"(0.25mm)~0.200"(5.0mm) |
| Keywords | Silicone Thermal Pad |
| Brand Name | ZIITEK |
| Model Number | TIF200-10-02ES |
| Certification | UL and RoHs |
| Place of Origin | China |
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Product Specification
| Supply Ability | 100000pcs/day | Delivery Time | 3-5 work days |
| Packaging Details | 1000pcs/bag | Payment Terms | T/T |
| Products name | Pink 1.0W/M.K Cooling Gap Filler Insulation Silicone Thermal Pad For Semiconductor Heat Dissipation | Hardness | 10 Shore 00 |
| Application | Semiconductor Heat Dissipation | Thermal conductivity | 1.0W/m-K |
| Color | Pink/ White | Continuous Use Temp | -40 to 200℃ |
| Sample | Sample free | Thickness | 0.010"(0.25mm)~0.200"(5.0mm) |
| Keywords | Silicone Thermal Pad | Brand Name | ZIITEK |
| Model Number | TIF200-10-02ES | Certification | UL and RoHs |
| Place of Origin | China | ||
| High Light | 1.5W/M.K thermal gap filler ，high conductive silicone rubber pad ，semiconductor heat dissipation pad | ||
Pink 1.0W/M.K Cooling Gap Filler Insulation Silicone Thermal Pad For Semiconductor Heat Dissipation
The TIF®200-10-02ES Series is a compound thermal interface material that combines good thermal conductivity,reliable electrical insulation, and extremely soft characteristics. This product not only provides excellent thermal conductivity but also ensures superior breakdown voltage strength,effectively preventing circuit short circuits. Its soft characteristic allows it to fully fill uneven interfaces, providing excellent cushioning protection for precision components while dissipating heat. This series is an ideal choice for applications requiring electrical isolation,such as power devices,new energy vehicles,and portable electronic devices.
Features
> Good thermal conductive: 1.0W/mK
> Moldability for complex parts
> Soft and compressible for low stress applications
> Fiberglass reinforced for puncture, shear and tear resistance
> Easy release construction
> Electrically isolating
> High durability
Applications
Electronic components, 5G, Aerospace, AI, AIoT, AR/VR/MR/XR, Automotive, Consumer Devices, Datacom, Electric Vehicle, Electronic Products, Energy Storage, Industrial, Lighting Equipment, Medical, Netcom, Panel, Power Electronics, Robot, Servers, Smart Home, Telecom, etc.
| Typical Properties of TIF®200-10-02ES Series | |||
| Property | Value | Test method | |
| Color | Pink/White | Visual | |
| Construction & Compostion | Ceramic filled silicone elastomer | ****** | |
| Density(g/cm³) | 2.8 | ASTM D792 | |
| Thickness Range(inch/mm) | 0.010~0.020 | 0.030~0.200 | ASTM D374 |
| (0.25~0.50) | (0.75~5.00) | ||
| Hardness | 10 Shore 00 | 10 Shore 00 | ASTM 2240 |
| Continuos Use Temp | -40 to 200℃ | ****** | |
| Breakdown Voltage(V/mm) | ≥ 5500 | ASTM D149 | |
| Dielectric Constant | 5.0 MHz | ASTM D150 | |
| Volume Resistivity | ＞1.0X1012 Ohm-meter | ASTM D257 | |
| Thermal Conductivity (W/m-K) | 1.0 | ASTM D5470 | |
| 1.0 | ISO22007 | ||
| Fire rating | V-0 | UL 94 (E331100) | |
The packaging of thermal pad
1.with PET film or foam-for protection
2. use Paper Card To Separate Each Layer
3. export carton inside and outside
4. meet with customers' requirement-customized
Lead Time :Quantity(Pieces):5000
Est. Time(days): To be negotiated
Company profile
Dongguan Ziitek Electronic Material Technology Co., Ltd. was established in 2006. Is a high-tech enterprise specializing in the research, development, production and sales of thermal interface materials. We mainly produce: heat-conducting joint filler, low melting point thermal interface materials, heat-conducting insulator, heat-conducting adhesive tape, heat-conducting interface pad and heat-conducting grease, heat-conducting plastic, silicone rubber, silicone rubber foam, etc. We adhere to the business philosophy of "survival by quality, development by quality", and continue to provide the most efficient and best service for new and old customers with excellent quality in the spirit of rigor, pragmatism and innovation.
Certifications:
ISO9001:2015
ISO14001: 2004 IATF16949:2016
IECQ QC 080000:2017
UL
Why Choose us ?
1.Our value message is'' Do it right the First time, total quality control''.
2.Our core competencies is thermal conductive interface materials.
3.Competitive advantage products.
4.Condidentiality agreement Bussiness Secrect Contract.
5.Free sample offer.
6.Quality assurance contract.
Company Details
Business Type:
Manufacturer
Year Established:
2006
Total Annual:
30000000-35700000
Employee Number:
600~700
Ecer Certification：
Verified Supplier
Dongguan Ziitek Electronical Material and Technology, Ltd. provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent. ENTERPRISE CULTURE VIS... Dongguan Ziitek Electronical Material and Technology, Ltd. provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent. ENTERPRISE CULTURE VIS...
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