Dongguan Ziitek Electronic Materials & Technology Ltd.
| Supply Ability | 10000/day |
| Delivery Time | 3-5work days |
| Packaging Details | 1000pcs/bag |
| Payment Terms | T/T |
| Products name | High Temperature Resistant Heatsink Cooling Gap Filler Pad Thermal Conductive Silicone Pad For Mainboard/Mother Boa/Memory Modules |
| Continuos Use Temp | -40℃ to 200℃ |
| Application | Mainboard/Mother Boa/Memory Modules Cooling |
| Density | 2.0g/cm³ |
| Hardness | 65/27 Shore 00 |
| Color | Green |
| Thermal conductivity& Compostion | 1.2W/m-K |
| Thickness | 0.010~0.20inch / 0.25~5.0mm |
| Construction | Ceramic filled silicone elastomer |
| Keywords | Thermal Conductive Silicone Pad |
| Brand Name | ZIITEK |
| Model Number | TIF100-12-66U |
| Certification | UL and RoHs |
| Place of Origin | China |
View Detail Information
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Product Specification
| Supply Ability | 10000/day | Delivery Time | 3-5work days |
| Packaging Details | 1000pcs/bag | Payment Terms | T/T |
| Products name | High Temperature Resistant Heatsink Cooling Gap Filler Pad Thermal Conductive Silicone Pad For Mainboard/Mother Boa/Memory Modules | Continuos Use Temp | -40℃ to 200℃ |
| Application | Mainboard/Mother Boa/Memory Modules Cooling | Density | 2.0g/cm³ |
| Hardness | 65/27 Shore 00 | Color | Green |
| Thermal conductivity& Compostion | 1.2W/m-K | Thickness | 0.010~0.20inch / 0.25~5.0mm |
| Construction | Ceramic filled silicone elastomer | Keywords | Thermal Conductive Silicone Pad |
| Brand Name | ZIITEK | Model Number | TIF100-12-66U |
| Certification | UL and RoHs | Place of Origin | China |
| High Light | high temperature resistant thermal pad ，motherboard heatsink cooling pad ，thermal conductive silicone pad | ||
High Temperature Resistant Heatsink Cooling Gap Filler Pad Thermal Conductive Silicone Pad For Mainboard/Mother Boa/Memory Modules
Product description
TIF®100-12-66U Series is an ultra-soft thermal interface material designed specifically to protect precision components that are extremely sensitive to mechanical stress. This product combines good thermal conductivity with an exceptionally gel-like softness, achieving a low-stress perfect fit.
Features
> Excellent thermal conductivity: 1.2W/mK
> Soft and compressible for low stress applications
> Naturally tacky needing no further adhesive coating
> Available in varies thicknesses
> High tack surface reduces contact resistance
> RoHS compliant
> UL recognized
Applications
> Cooling components to the chassis of frame
> High speed mass storage drives
> Heat Sinking Housing at LED-lit BLU in LCD
> LED TV and LED-lit lamps
> RDRAM memory modules
> Micro heat pipe thermal solutions
> Automotive engine control units
> Telecommunication hardware
> Handheld portable electronics
> Semiconductor automated test equipment (ATE)
> CPU
> Display card
| Typical Properties of TIF®100-12-66U Series | |||
| Property | Value | Test method | |
| Color | Green | Visual | |
| Construction & Compostion | Ceramic filled silicone elastomer | ****** | |
| Density(g/cm³) | 2.0 | ASTM D792 | |
| Thickness Range(inch/mm) | 0.010~0.020 | 0.030~0.200 | ASTM D374 |
| (0.25~0.50) | (0.75~5.00) | ||
| Hardness | 65 Shore 00 | 27 Shore 00 | ASTM 2240 |
| Recommended Operating Temperature | -40 to 200℃ | ****** | |
| Breakdown Voltage(V/mm) | ≥5500 | ASTM D149 | |
| Dielectric Constant | 4.0 MHz | ASTM D150 | |
| Volume Resistivity | ＞1.0X1012 Ohm-meter | ASTM D257 | |
| Flame rating | V-0 | UL 94 (E331100) | |
| Thermal conductivity | 1.2 W/m-K | ASTM D5470 | |
| 1.2 W/m-K | ISO22007 | ||
Product Specifications
Standard Thickness: 0.010" (0.25 mm)~0.200" (5.00 mm) with increments of 0.010" (0.25 mm)
Standard Size: 16"×16" (406 mmX406 mm)
Component Codes:
Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment),
DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).
The TIF® series is available in custom shapes and various forms.
For other thicknesses or more information, please contact us.
Packaging Details & Lead time
The packaging of thermal pad
1.with PET film or foam-for protection
2. use Paper Card To Separate Each Layer
3. export carton inside and outside
4. meet with customers' requirement-customized
Lead Time :Quantity(Pieces):5000
Est. Time(days): To be negotiated
Company profile
With professional R&D capabilities and many year experiences in thermal interface material industry, Ziitek company own many unique formulations which are our core technologies and advantages. Our goal is to provide quality & competitive products to our customers worldwide aiming for long-term business cooperation.
Certifications:
ISO9001:2015
ISO14001: 2004 IATF16949:2016
IECQ QC 080000:2017
UL
Independent R&D team
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Company Details
Business Type:
Manufacturer
Year Established:
2006
Total Annual:
100000-160000
Employee Number:
100~150
Ecer Certification：
Verified Supplier
Dongguan Ziitek Electronical Material and Technology Ltd. provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent. ENTERPRISE CULTURE VISI... Dongguan Ziitek Electronical Material and Technology Ltd. provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent. ENTERPRISE CULTURE VISI...
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