| Supply Ability | 100000pcs/day |
| Delivery Time | 3-5 work days |
| Packaging Details | 1000pcs/bag |
| Payment Terms | T/T |
| Products name | 1.2W High-Strength High-Temperature Resistant Thermal Silicon Insulator Pad Thermal Pad For IGBTs |
| Sample | Sample free |
| Thermal conductivity | 1.2W/m-K |
| Thickness | 0.010"(0.25mm)~0.200"(5.0mm) |
| Hardness | 65/20 Shore 00 |
| Color | Blue |
| Density ( g/cm³) | 2.0 |
| Application | IGBTs |
| Keywords | Thermal Pad |
| Brand Name | ZIITEK |
| Model Number | TIF100-12-05US |
| Certification | UL and RoHs |
| Place of Origin | China |
View Detail Information
Explore similar products
Factory Price Hot Selling Thermal Conductive Silicon Pad1.5W 0.5~5.0mm Thick
Pink 3.0W/MK CPU Heatsink Colling Thermal Conductive Ultra Soft Gap Filler Pad
Yellow High Dielectric Strength Thermal Conductive Pad 3.0W/MK For Telecommunica
1mm thickness 2W/m.K sticky silicone thermal conductive pad 45 SHORE00 2.32 g/cc
Product Specification
| Supply Ability | 100000pcs/day | Delivery Time | 3-5 work days |
| Packaging Details | 1000pcs/bag | Payment Terms | T/T |
| Products name | 1.2W High-Strength High-Temperature Resistant Thermal Silicon Insulator Pad Thermal Pad For IGBTs | Sample | Sample free |
| Thermal conductivity | 1.2W/m-K | Thickness | 0.010"(0.25mm)~0.200"(5.0mm) |
| Hardness | 65/20 Shore 00 | Color | Blue |
| Density ( g/cm³) | 2.0 | Application | IGBTs |
| Keywords | Thermal Pad | Brand Name | ZIITEK |
| Model Number | TIF100-12-05US | Certification | UL and RoHs |
| Place of Origin | China | ||
| High Light | 1.2W thermal pad for IGBTs ,high-temperature resistant thermal insulator ,high-strength silicon thermal pad | ||
1.2W High-Strength High-Temperature Resistant Thermal Silicon Insulator Pad Thermal Pad For IGBTs
Products description
The TIF®100-12-05US is not only designed to take advantage of the gap heat transfer, to fill gaps, complete the heat transfer between heating and cooling parts, but also played insulation, damping, sealing and so on, to meet the equipment miniaturization and ultra-thin design Requirements, which is a highly technology and use, and the thickness of the wide range of applications, is also an excellent thermal conductivity filler material.
Features
> Good thermal conductive: 1.2W/mK
> Naturally tacky needing no further adhesive coating
> Soft and Compressible for low stress applications
> Available in varies thickness
> RoHS compliant
> UL recognized
Applications
> Cpu heat sinking
> High speed mass storage drives
> Heat Sinking Housing at LED-lit BLU in LCD
> LED TV and LED-lit lamps
> RDRAM memory modules
> Micro heat pipe thermal solutions
> Automotive engine control units
> Telecommunication hardware
> Handheld portable electronics
> Semiconductor automated test equipment (ATE)
> Notebook
> Power supply
> Heat pipe thermal solutions
| Typical Properties of TIF®100-12-05US Series | |||
| Property | Value | Test method | |
| Color | Blue | Visual | |
| Construction & Compostion | Ceramic filled silicone elastomer | ****** | |
| Density(g/cm³) | 2.0 | ASTM D792 | |
| Thickness Range(inch/mm) | 0.010~0.020 | 0.030~0.200 | ASTM D374 |
| (0.25~0.50) | (0.75~5.00) | ||
| Hardness | 65 Shore 00 | 20 Shore 00 | ASTM 2240 |
| Recommended Operating Temperature | -40 to 200℃ | ****** | |
| Breakdown Voltage(V/mm) | ≥5500 | ASTM D149 | |
| Dielectric Constant | 4.5 MHz | ASTM D150 | |
| Volume Resistivity | >1.0X1012 Ohm-meter | ASTM D257 | |
| Flame rating | V-0 | UL 94 (E331100) | |
| Thermal conductivity | 1.2 W/m-K | ASTM D5470 | |
| 1.2 W/m-K | ISO22007 | ||
Product Specifications
Standard Thickness: 0.010" (0.25 mm)~0.200" (5.00 mm) with increments of 0.010" (0.25 mm)
Standard Size: 16"×16" (406 mmX406 mm)
Component Codes:
Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment),
DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).
The TIF® series is available in custom shapes and various forms.
For other thicknesses or more information, please contact us.
![]()
Company Profile
With a wide range, good quality, reasonable prices and stylish designs, Ziitek thermal conductive interface materials are extensively used in Mainboards, VGA cards, Notebooks, DDR&DDR2 products, CD-ROM ,LCD TV, PDP products, Server Power products, Down lamps, Spotlights, Street lamps, Daylight lamps, LED Server Power products and others.
Certifications:
ISO9001:2015
ISO14001: 2004 IATF16949:2016
IECQ QC 080000:2017
UL
Why Choose us ?
1.Our value message is'' Do it right the First time, total quality control''.
2.Our core competencies is thermal conductive interface materials.
3.Competitive advantage products.
4.Condidentiality agreement Bussiness Secrect Contract.
5.Free sample offer.
6.Quality assurance contract.
Company Details
Business Type:
Manufacturer
Year Established:
2006
Total Annual:
30000000-35700000
Employee Number:
600~700
Ecer Certification:
Verified Supplier
Dongguan Ziitek Electronical Material and Technology, Ltd. provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent. ENTERPRISE CULTURE VIS... Dongguan Ziitek Electronical Material and Technology, Ltd. provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent. ENTERPRISE CULTURE VIS...
Get in touch with us
Leave a Message, we will call you back quickly!