Dongguan Ziitek Electronic Materials & Technology Ltd.
| Payment Terms | T/T |
| Supply Ability | 100000pcs/day |
| Delivery Time | 3-5 work days |
| Packaging Details | 1000pcs/bag |
| Prodcuts name | Good Thermal Conductivity Silicone-Based Thermal Gap Pad For Electronic Components 5G Aerospace AI |
| Application | Electronic Components 5G Aerospace AI |
| Thickness | 0.010"(0.25mm)~0.200"(5.0mm) |
| Thermal conductivity | 4.0W/m-K |
| Keywords | Thermal Gap Pad |
| Hardness | 65/20 Shore 00 |
| Density | 3.2g/cm³ |
| Color | Dark Grey |
| Recommended Operating Temperature | -40 to 200℃ |
| Brand Name | ZIITEK |
| Model Number | TIF100-40-11US |
| Certification | UL and RoHs |
| Place of Origin | China |
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Product Specification
| Payment Terms | T/T | Supply Ability | 100000pcs/day |
| Delivery Time | 3-5 work days | Packaging Details | 1000pcs/bag |
| Prodcuts name | Good Thermal Conductivity Silicone-Based Thermal Gap Pad For Electronic Components 5G Aerospace AI | Application | Electronic Components 5G Aerospace AI |
| Thickness | 0.010"(0.25mm)~0.200"(5.0mm) | Thermal conductivity | 4.0W/m-K |
| Keywords | Thermal Gap Pad | Hardness | 65/20 Shore 00 |
| Density | 3.2g/cm³ | Color | Dark Grey |
| Recommended Operating Temperature | -40 to 200℃ | Brand Name | ZIITEK |
| Model Number | TIF100-40-11US | Certification | UL and RoHs |
| Place of Origin | China | ||
| High Light | silicone thermal gap pad ，thermal conductive pad for electronics ，5G aerospace thermal pad | ||
Good Thermal Conductivity Silicone-Based Thermal Gap Pad For Electronic Components 5G Aerospace AI
The TIF®100-40-11US Series is an ultra-soft thermal interface material designed specifically to protect precision components that are extremely sensitive to mechanical stress. This product combines high thermal conductivity with exceptional gel-level softness,achieving a perfectly low-stress fit.It is suitable for addressing issues such as large tolerances, uneven surfaces, and the susceptibility of precision components to mechanical damage in high-precision assemblies.
Features
> Good thermal conductive: 4.0W/mK
> Moldability for complex parts
> Soft and compressible for low stress applications
> Naturally tacky needing no further adhesive coating
> Available in varies thicknesses
Applications
> Cpu heat sinking
> High speed mass storage drives
> RDRAM memory modules
> Micro heat pipe thermal solutions
> Automotive engine control units
> Telecommunication hardware
> Handheld portable electronics
> Semiconductor automated test equipment (ATE)
> Home appliance industry
> CPU
> Display card
> Mainboard/mother board
> Notebook
> Power supply
> Heat pipe thermal solutions
> Memory Modules
| Typical Properties of TIF®100-40-11US Series | |||
| Property | Value | Test method | |
| Color | Dark Gray | Visual | |
| Construction & Compostion | Ceramic filled silicone elastomer | ****** | |
| Density(g/cm³) | 3.2 | ASTM D792 | |
| Thickness Range(inch/mm) | 0.010~0.020 | 0.030~0.200 | ASTM D374 |
| (0.25~0.50) | (0.75~5.0) | ||
| Hardness | 65 Shore 00 | 20 Shore 00 | ASTM 2240 |
| Recommended Operating Temperature | -40 to 200℃ | ****** | |
| Breakdown Voltage(V/mm) | ≥5500 | ASTM D149 | |
| Dielectric Constant @ 1MHz | 7.0 MHz | ASTM D150 | |
| Volume Resistivity | ＞1.0X1012 Ohm-meter | ASTM D257 | |
| Flame rating | V-0 | UL 94 (E331100) | |
| Thermal conductivity | 4.0W/m-K | ASTM D5470 | |
| 4.0W/m-K | ISO22007 | ||
Product Specifications
Standard Thickness: 0.010" (0.25 mm)~0.200" (5.00 mm)
with increments of 0.010" (0.25 mm)
Standard Size: 16"X16" (406 mm×406 mm)
Component Codes:
Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment),
DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).
The TIF® series is availablein custom shapes and various forms.
For other thicknesses or more information, please contact us.
Company profile
Ziitek company is a high-tech enterprise dedicated to the R&D, manufacture and sales of thermal interface materials (TIMs). With rich experience in this field, we provide the latest, most effective one-step thermal management solutions. Our facility includes advanced production equipment, full test equipment, and fully automatic coating production lines capable of manufacturing high performance thermal products including:
All products are compliant with UL94 V-0, SGS and ROHS standards.
Certifications: ISO9001:2015, ISO14001:2004, IATF16949:2016, IECQ QC 080000:2017, UL
Independent R&D team
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Company Details
Business Type:
Manufacturer
Year Established:
2006
Total Annual:
30000000-35700000
Employee Number:
600~700
Ecer Certification：
Verified Supplier
Dongguan Ziitek Electronical Material and Technology, Ltd. provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent. ENTERPRISE CULTURE VIS... Dongguan Ziitek Electronical Material and Technology, Ltd. provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent. ENTERPRISE CULTURE VIS...
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