| Payment Terms | TT |
| Supply Ability | 100000pcs/day |
| Delivery Time | 3-5 days |
| Packaging Details | 1000pcs/bag |
| Products name | High Performance Thermally Conductive 6.5W Soft Thermally Conductive Gap Filler Pads For AI Processors AI Servers |
| Application | AI Processors AI Servers |
| Hardness | 35/65 Shore 00 |
| Density(g/cm³) | 3.4 |
| Keywords | Soft Thermally gap Filler Pads |
| Dielectric Constant @1MHz | 7.0 MHz |
| Fire rating | 94-V0 |
| Thermal conductivity | 6.5W/m-K |
| Brand Name | ZIITEK |
| Model Number | TIF700NS |
| Certification | UL and RoHs |
| Place of Origin | China |
View Detail Information
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Product Specification
| Payment Terms | TT | Supply Ability | 100000pcs/day |
| Delivery Time | 3-5 days | Packaging Details | 1000pcs/bag |
| Products name | High Performance Thermally Conductive 6.5W Soft Thermally Conductive Gap Filler Pads For AI Processors AI Servers | Application | AI Processors AI Servers |
| Hardness | 35/65 Shore 00 | Density(g/cm³) | 3.4 |
| Keywords | Soft Thermally gap Filler Pads | Dielectric Constant @1MHz | 7.0 MHz |
| Fire rating | 94-V0 | Thermal conductivity | 6.5W/m-K |
| Brand Name | ZIITEK | Model Number | TIF700NS |
| Certification | UL and RoHs | Place of Origin | China |
| High Light | 6.5W thermally conductive pad ,soft thermal gap filler for AI processors ,thermal pad for AI servers | ||
High Performance Thermally Conductive 6.5W Soft Thermally Conductive Gap Filler Pads For AI Processors AI Servers
Company pfofile
The TIF®700NS Series a well-balanced, general-purpose thermal pad. It offers excellent thermal conductivity and moderate hardness. This balanced design provides both good surface conformity and excellent ease of use, making it capable of effectively transferring heat and providing basic physical protection for a wide range of electronic components. It is an ideal choice for addressing medium to high power heat dissipation needs, achieving the best balance between cost and performance.
Features:
> Good thermal conductive 6.5W
> Moldability for complex parts
> Soft and compressible for low stress applications
> Naturally tacky needing no further adhesive coating
> Available in varies thicknesses
Applications:
> Telecommunication hardware
> Handheld portable electronics
> Semiconductor automated test equipment (ATE)
> CPU
> Display card
> Mainboard/mother board
> Notebook
> Power supply
> Heat pipe thermal solutions
> Signal communication
> New energy vehicle
> Motherboard chip
> Radiator
> AI Processors AI Servers
| Typical Properties of TIF®700NS Series | |||
| Property | Value | Test method | |
| Color | Gray | Visual | |
| Construction & Compostion | Ceramic filled silicone elastomer | ****** | |
| Density(g/cm³) | 3.4 | ASTM D792 | |
| Thickness Range(inch/mm) | 0.010~0.030 | 0.040~0.200 | ASTM D374 |
| (0.25~0.75) | (1.00~5.00) | ||
| Hardness | 60 Shore 00 | 45 Shore 00 | ASTM 2240 |
| Recommended Operating Temperature | -40 to 200℃ | ****** | |
| Breakdown Voltage(V/mm) | ≥5500 | ASTM D149 | |
| Dielectric Constant | 7.0 MHz | ASTM D150 | |
| Volume Resistivity | >1.0X1012 Ohm-meter | ASTM D257 | |
| Flame rating | V-0 | UL 94 (E331100) | |
| Thermal conductivity | 6.5W/m-K | ASTM D5470 | |
| 6.5W/m-K | ISO22007 | ||
Packaging Details & Lead time
The packaging of thermal pad
1.with PET film or foam-for protection
2. use Paper Card To Separate Each Layer
3. export carton inside and outside
4. meet with customers' requirement-customized
Lead Time :Quantity(Pieces):5000
Est. Time(days): To be negotiated
Independent R&D team
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Company Details
Business Type:
Manufacturer
Year Established:
2006
Total Annual:
30000000-35700000
Employee Number:
600~700
Ecer Certification:
Verified Supplier
Dongguan Ziitek Electronical Material and Technology, Ltd. provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent. ENTERPRISE CULTURE VIS... Dongguan Ziitek Electronical Material and Technology, Ltd. provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent. ENTERPRISE CULTURE VIS...
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