| Payment Terms | TT |
| Supply Ability | 100000pcs/day |
| Delivery Time | 3-5 days |
| Packaging Details | 1000pcs/bag |
| Products name | High Thermally Conductive 15W/MK Soft Thermally Conductive Gap Filler Pads For 5G Base Stations |
| Thermal conductivity | 15.0W/m-K |
| Hardness | 35 Shore 00 |
| Density(g/cm³) | 3.25 |
| Keywords | Thermal pad |
| Application | 5G Base Stations |
| Dielectric Constant @1MHz | 8.0 |
| Fire rating | 94-V0 |
| Brand Name | ZIITEK |
| Model Number | TIF800SE |
| Certification | UL and RoHs |
| Place of Origin | China |
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Product Specification
| Payment Terms | TT | Supply Ability | 100000pcs/day |
| Delivery Time | 3-5 days | Packaging Details | 1000pcs/bag |
| Products name | High Thermally Conductive 15W/MK Soft Thermally Conductive Gap Filler Pads For 5G Base Stations | Thermal conductivity | 15.0W/m-K |
| Hardness | 35 Shore 00 | Density(g/cm³) | 3.25 |
| Keywords | Thermal pad | Application | 5G Base Stations |
| Dielectric Constant @1MHz | 8.0 | Fire rating | 94-V0 |
| Brand Name | ZIITEK | Model Number | TIF800SE |
| Certification | UL and RoHs | Place of Origin | China |
| High Light | 15W/MK thermal gap filler pads ,soft thermal conductive pads for 5G ,thermally conductive pads for base stations | ||
High Thermally Conductive 15W/MK Soft Thermally Conductive Gap Filler Pads For 5G Base Stations
Company pfofile
Ziitek company is a high-tech enterprise dedicated to the R&D, manufacture and sales of thermal interface materials (TIMs). With rich experience in this field, we provide the latest, most effective one-step thermal management solutions. Our facility includes advanced production equipment, full test equipment, and fully automatic coating production lines capable of manufacturing high performance thermal products including:
All products are compliant with UL94 V-0, SGS and ROHS standards.
Certifications: ISO9001:2015, ISO14001:2004, IATF16949:2016, IECQ QC 080000:2017, UL
The TIF®800SE Series is a high-end compressible thermal pad that meets top-level cooling requirements while also ensuring excellent assembly workability. Through an innovative material formulation, it successfully achieves an ideal combination of ultra-high thermal conductivity and moderate hardness.This unique performance balance allows it to efficiently handle the cooling challenges posed by extremely high heat fluxes,kwhile álso possessing good mechanical_strength and compressibility, making it easy to manufacture and install. It provides a thermal interface material solution with both outstanding heat dissipation performance and high reliability for high-power-density electronic devices.
Features:
> Excellent thermal conductive 15.0W/mK
> Moldability for complex parts
> Soft and compressible for low stress applications
> Broad range of hardnesses available
> Outstanding thermal performance
> High tack surface reduces contact resistance
Applications:
> Mainboard/mother board
> Notebook
> Power supply
> Heat pipe thermal solutions
> Signal communication
> New energy vehicle
> Motherboard chip
> Radiator
> AI Processors AI Servers
> Routers
> Medical Devices
> Auditioning electronic products
> Unmanned aerial vehicle(UAV)
> Photovoltaic
| Typical Properties of TIF®800SE Series | |||
| Property | Value | Test method | |
| Color | Gray | Visual | |
| Construction & Compostion | Ceramic filled silicone elastomer | ****** | |
| Density(g/cm³) | 3.25 | ASTM D792 | |
| Thickness Range(inch/mm) | 0.030 | 0.040~0.200 | ASTM D374 |
| (0.75) | (1.00~5.00) | ||
| Hardness | 35 Shore 00 | 35 Shore 00 | ASTM 2240 |
| Recommended Operating Temperature | -40 to 200℃ | ****** | |
| Breakdown Voltage(V/mm) | ≥5500 | ASTM D149 | |
| Dielectric Constant | 8.0 MHz | ASTM D150 | |
| Volume Resistivity | >1.0X1012 Ohm-meter | ASTM D257 | |
| Flame rating | V-0 | UL 94 (E331100) | |
| Thermal conductivity | 15W/m-K | ASTM D5470 | |
| 15W/m-K | ISO22007 | ||
Packaging Details & Lead time
The packaging of thermal pad
1.with PET film or foam-for protection
2. use Paper Card To Separate Each Layer
3. export carton inside and outside
4. meet with customers' requirement-customized
Lead Time :Quantity(Pieces):5000
Est. Time(days): To be negotiated
FAQ:
Q: What thermal conductivity test method was used to achieve the values given on the data sheets?
A: A test fixture is utilized that meets the specifications outlined in ASTM D5470.
Q: Is GAP PAD offered with an adhesive?
A: Currently, Most of thermal gap pad surface has double side natural inherent tack,Non-stick surface can also be treated according to customer's requirements.
Q: Are you trading company or manufacturer ?
A: We are manufacturer in China.
Q: How long is your delivery time?
A: Generally it is 3-7 work days if the goods are in stock. or it is 7-10 work days if the goods are not in stock, it is according to quantity.
Q: Do you provide samples ? is it free or extra cost?
A: Yes, we could offer samples free of charge.
Company Details
Business Type:
Manufacturer
Year Established:
2006
Total Annual:
30000000-35700000
Employee Number:
600~700
Ecer Certification:
Verified Supplier
Dongguan Ziitek Electronical Material and Technology, Ltd. provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent. ENTERPRISE CULTURE VIS... Dongguan Ziitek Electronical Material and Technology, Ltd. provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent. ENTERPRISE CULTURE VIS...
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