| Payment Terms | T/T |
| Supply Ability | 100000pcs/day |
| Delivery Time | 3-5 work days |
| Packaging Details | 1000pcs/bag |
| Prodcuts name | Low Bleed Thermal Pad Thermal GAP PAD Materials For AI Processors AI Servers |
| Hardness | 55 Shore 00 |
| Thermal conductivity | 2.8 W/m-K |
| Flame Rating | UL 94 V-0 |
| Continuos Use Temp | -40 to 200℃ |
| Keywords | Thermal Pad |
| Specific Gravity | 3.0g/cc |
| Application | AI Processors AI Servers |
| Brand Name | ZIITEK |
| Model Number | TIF100 2855-10 |
| Certification | UL and RoHs |
| Place of Origin | China |
View Detail Information
Explore similar products
Factory Price Hot Selling Thermal Conductive Silicon Pad1.5W 0.5~5.0mm Thick
Pink 3.0W/MK CPU Heatsink Colling Thermal Conductive Ultra Soft Gap Filler Pad
Yellow High Dielectric Strength Thermal Conductive Pad 3.0W/MK For Telecommunica
1mm thickness 2W/m.K sticky silicone thermal conductive pad 45 SHORE00 2.32 g/cc
Product Specification
| Payment Terms | T/T | Supply Ability | 100000pcs/day |
| Delivery Time | 3-5 work days | Packaging Details | 1000pcs/bag |
| Prodcuts name | Low Bleed Thermal Pad Thermal GAP PAD Materials For AI Processors AI Servers | Hardness | 55 Shore 00 |
| Thermal conductivity | 2.8 W/m-K | Flame Rating | UL 94 V-0 |
| Continuos Use Temp | -40 to 200℃ | Keywords | Thermal Pad |
| Specific Gravity | 3.0g/cc | Application | AI Processors AI Servers |
| Brand Name | ZIITEK | Model Number | TIF100 2855-10 |
| Certification | UL and RoHs | Place of Origin | China |
| High Light | low bleed thermal pad ,thermal gap pad for AI processors ,thermal conductive pad for servers | ||
Low Bleed Thermal Pad Thermal GAP PAD Materials For AI Processors AI Servers
The TIF®100 2855-10 is a general-purpose thermal pad with balanced performance. It offers high thermal conductivity and moderate hardness. This balanced design provides good surface conformability and excellent ease of use, effectively delivering a thermal transfer path and basic physical protection for a wide range of electronic components.
Company Profile
With a wide range, good quality, reasonable prices and stylish designs, Ziitek thermal conductive interface materials are extensively used in Mainboards, VGA cards, Notebooks, DDR&DDR2 products, CD-ROM ,LCD TV, PDP products, Server Power products, Down lamps, Spotlights, Street lamps, Daylight lamps, LED Server Power products and others.
Features
> Good thermal conductive: 2.8W/mK
> Good softness and fillability
> Self-adhesive without the need for additional surface adhesive
> Good insulation performance
Applications
> Cpu heat sinking
> High speed mass storage drives
> Heat Sinking Housing at LED-lit BLU in LCD
> LED TV and LED-lit lamps
> RDRAM memory modules
> Micro heat pipe thermal solutions
> Automotive engine control units
> Telecommunication hardware
> Handheld portable electronics
> Semiconductor automated test equipment (ATE)
> Home appliance industry
> Power module
> Wearable device
> Solar photovoltaic panel
> LED lighting fixtures
| Typical Properties of The TIF®100 2855-10 Series | |||
| Property | Value | Test method | |
| Color | Gray | Visual | |
| Construction & Compostion | Ceramic filled silicone elastomer | ****** | |
| Density(g/cm³) | 3.0 | ASTM D792 | |
| Thickness Range(inch/mm) | 0.010~0.020 | 0.030~0.200 | ASTM D374 |
| (0.25~0.5) | (0.75~5.0) | ||
| Hardness | 65 Shore 00 | 55 Shore 00 | ASTM 2240 |
| Recommended Operating Temperature | -40 to 200℃ | ****** | |
| Breakdown Voltage(V/mm) | ≥5500 | ASTM D149 | |
| Dielectric Constant | 6.2 MHz | ASTM D150 | |
| Volume Resistivity | >1.0X1012 Ohm-meter | ASTM D257 | |
| Flame rating | V-0 | UL 94 (E331100) | |
| Thermal conductivity | 2.8 W/m-K | ASTM D5470 | |
| 2.8 W/m-K | ISO22007 | ||
Product Specifications
Standard Thickness: 0.010" (0.25 mm)~0.200" (5.00 mm) with increments of 0.010" (0.25 mm)
Standard Size: 16"X16" (406 mmX406 mm)
Component Codes:
Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment),
DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).
The TIF® series is available in custom shapes and various forms.
For other thicknesses or more information, please contact us.
![]()
Packaging Details & Lead time
The packaging of thermal pad
1.with PET film or foam-for protection
2. use Paper Card To Separate Each Layer
3. export carton inside and outside
4. meet with customers' requirement-customized
Lead Time :Quantity(Pieces):5000
Est. Time(days): To be negotiated
Ziitek Culture
Quality :
Do it right the first time, total quality control
Effectiveness:
Work precisely and thoroughly for effectiveness
Service:
Quick response, On time delivery and Excellent service
Team work:
Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.
Company Details
Business Type:
Manufacturer
Year Established:
2006
Total Annual:
100000-160000
Employee Number:
100~150
Ecer Certification:
Verified Supplier
Dongguan Ziitek Electronical Material and Technology Ltd. provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent. ENTERPRISE CULTURE VISI... Dongguan Ziitek Electronical Material and Technology Ltd. provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent. ENTERPRISE CULTURE VISI...
Get in touch with us
Leave a Message, we will call you back quickly!