Dongguan Ziitek Electronic Materials & Technology Ltd.
| Payment Terms | T/T |
| Supply Ability | 100000pcs/day |
| Delivery Time | 3-5 work days |
| Packaging Details | 1000pcs/bag |
| Prodcuts name | Low Thermal Impedance 5.0W Ultra Soft Thermal Pad For Cloud Computing And Servers |
| Keywords | Ultra Soft Thermal Pad |
| Flame Rating | UL 94 V-0 |
| Hardness | 35 Shore 00 |
| Thermal conductivity | 5.0W/m-K |
| Continuos Use Temp | -40 to 200℃ |
| Specific Gravity | 3.4g/cc |
| Application | Cloud Computing And Servers |
| Brand Name | ZIITEK |
| Model Number | TIF100-50-10E |
| Certification | UL and RoHs |
| Place of Origin | China |
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Product Specification
| Payment Terms | T/T | Supply Ability | 100000pcs/day |
| Delivery Time | 3-5 work days | Packaging Details | 1000pcs/bag |
| Prodcuts name | Low Thermal Impedance 5.0W Ultra Soft Thermal Pad For Cloud Computing And Servers | Keywords | Ultra Soft Thermal Pad |
| Flame Rating | UL 94 V-0 | Hardness | 35 Shore 00 |
| Thermal conductivity | 5.0W/m-K | Continuos Use Temp | -40 to 200℃ |
| Specific Gravity | 3.4g/cc | Application | Cloud Computing And Servers |
| Brand Name | ZIITEK | Model Number | TIF100-50-10E |
| Certification | UL and RoHs | Place of Origin | China |
| High Light | 5.0W ultra soft thermal pad ，low thermal impedance thermal pad ，thermal conductive pad for servers | ||
Low Thermal Impedance 5.0W Ultra Soft Thermal Pad For Cloud Computing And Servers
TIF®100-50-10E Ultra Soft Thermal Pad
Low thermal impedance
This thermal pad's ultra-soft texture can effectively fill the gaps between electronic components and heat sinks, achieving a seamless fit.
Feature
Specifically developed for network communications, cloud computing, servers, and other high-speed computing industries, TIF®100-50-10E Ultra Soft Thermal Pad have outstanding thermal conductivity (5.0 W/m·K) and achieve an ultra-soft texture of Shore OO 35/65. Only a light amount of pressure is needed to achieve a seamless fit and fill the gaps between electronic components and heat sinks. This enables quicker and more effective heat dissipation, enhancing overall cooling performance.
Application:
Electronic components - 5G, Aerospace, AI, AIoT, AR/VR/MR/XR, Automotive, Consumer Devices, Datacom, Electric Vehicle, Electronic Products, Energy Storage, Industrial, Lighting Equipment, Medical, Military, Netcom, Panel, Power Electronics, Robot, Servers, Smart Home, Telecom, etc.
| Typical Properties of The TIF®100-50-10E Series | |||
| Property | Value | Test method | |
| Color | Gray | Visual | |
| Construction & Compostion | Ceramic filled silicone elastomer | ****** | |
| Density(g/cm³) | 3.4 | ASTM D792 | |
| Thickness Range(inch/mm) | 0.010~0.020 | 0.030~0.200 | ASTM D374 |
| (0.25~0.5) | (0.75~5.0) | ||
| Hardness | 65 Shore 00 | 35 Shore 00 | ASTM 2240 |
| Recommended Operating Temperature | -40 to 200℃ | ****** | |
| Breakdown Voltage(V/mm) | ≥5500 | ASTM D149 | |
| Dielectric Constant | 6.0 MHz | ASTM D150 | |
| Volume Resistivity | ＞1.0X1012 Ohm-meter | ASTM D257 | |
| Flame rating | V-0 | UL 94 (E331100) | |
| Thermal conductivity | 5.0 W/m-K | ASTM D5470 | |
| 5.0 W/m-K | ISO22007 | ||
Product Specifications
Standard Thickness: 0.010" (0.25 mm)~0.200" (5.00 mm) with increments of 0.010" (0.25 mm)
Standard Size: 16"X16" (406 mmX406 mm)
Component Codes:
Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment),
DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).
The TIF® series is available in custom shapes and various forms.
For other thicknesses or more information, please contact us.
Packaging Details & Lead time
The packaging of thermal pad
1.with PET film or foam-for protection
2. use Paper Card To Separate Each Layer
3. export carton inside and outside
4. meet with customers' requirement-customized
Lead Time :Quantity(Pieces):5000
Est. Time(days): To be negotiated
Why Choose us ?
1.Our value message is'' Do it right the First time, total quality control''.
2.Our core competencies is thermal conductive interface materials.
3.Competitive advantage products.
4.Condidentiality agreement Bussiness Secrect Contract.
5.Free sample offer.
6.Quality assurance contract.
Company Details
Business Type:
Manufacturer
Year Established:
2006
Total Annual:
30000000-35700000
Employee Number:
600~700
Ecer Certification：
Verified Supplier
Dongguan Ziitek Electronical Material and Technology, Ltd. provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent. ENTERPRISE CULTURE VIS... Dongguan Ziitek Electronical Material and Technology, Ltd. provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent. ENTERPRISE CULTURE VIS...
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