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Dongguan Ziitek Electronical Material and Technology Co., Ltd

  • China,Dongguan ,Guangdong
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China High Thermal Conductivity 8.0W/MK Low Dielectric Thermally Conductive Gap Filler
China High Thermal Conductivity 8.0W/MK Low Dielectric Thermally Conductive Gap Filler

  1. China High Thermal Conductivity 8.0W/MK Low Dielectric Thermally Conductive Gap Filler
  2. China High Thermal Conductivity 8.0W/MK Low Dielectric Thermally Conductive Gap Filler

High Thermal Conductivity 8.0W/MK Low Dielectric Thermally Conductive Gap Filler

  1. MOQ: 1000pcs
  2. Price: Negotiation
  3. Get Latest Price
Payment Terms T/T
Keywords High thermal conductivity thermal pad
Recommended Operating Temperature (°C) -40 to 200℃
Delivery Time 3-7 work days
Sample Sample free
Flame Rating UL 94 V-0
Construction Ceramic filled silicone elastomer
Hardness 85 Shore 00
Supply Ability 10000/day
Thermal conductivity(W/mk) 8.0W/mK
Product name High Thermal Conductivity 8.0W/MK Low Dielectric Thermally Conductive Gap Filler Pads For Semiconductor Microwave Components
Packaging Details 1000pcs/bag
Application Semiconductor Microwave Components
Breakdown Strength(V/mm) ≥3000
Model Number TIF100N 8085-06
Certification UL and RoHs
Brand Name ZIITEK
Place of Origin China

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  1. Product Details
  2. Company Details

Product Specification

Payment Terms T/T Keywords High thermal conductivity thermal pad
Recommended Operating Temperature (°C) -40 to 200℃ Delivery Time 3-7 work days
Sample Sample free Flame Rating UL 94 V-0
Construction Ceramic filled silicone elastomer Hardness 85 Shore 00
Supply Ability 10000/day Thermal conductivity(W/mk) 8.0W/mK
Product name High Thermal Conductivity 8.0W/MK Low Dielectric Thermally Conductive Gap Filler Pads For Semiconductor Microwave Components Packaging Details 1000pcs/bag
Application Semiconductor Microwave Components Breakdown Strength(V/mm) ≥3000
Model Number TIF100N 8085-06 Certification UL and RoHs
Brand Name ZIITEK Place of Origin China
High Light High thermal conductivity gap filler padsThermally conductive pads for semiconductorsLow dielectric thermal gap filler
High Thermal Conductivity 8.0W/MK Low Dielectric Thermally Conductive Gap Filler Pads For Semiconductor Microwave Components
Product Overview

The TIF®100N 8085-06 Series is a thermal pad that combines excellent heat dissipation performance with reliable structural support capability. It can fill interface gaps, establish efficient thermal conduction pathways, and provide stable mechanical support for stacked or adjacent electronic components, effectively meeting long-term durability requirements. In addition, the material itself has low dielectric properties, which can effectively reduce energy loss during high-frequency signal transmission and ensure signal integrity.

Key Features
  • Low dielectric constant effectively reduces signal loss
  • Excellent thermal conductivity
  • Excellent weather resistance and aging resistance
  • Excellent long-term reliability
Applications
  • Millimeter wave radar
  • Semiconductor microwave components
  • 5G base station
  • RF power amplifier
  • High performance computing
Technical Specifications of TIF®100 8085-06 Series
Property Value Test Method
Color white Visual
Construction Ceramic filled silicone elastomer -
Density (g/cm³) 1.6 ASTM D792
Thickness Range (inch/mm) 0.012~0.120
0.30~3.00
ASTM D374
Hardness (Shore 00) 85 ASTM 2240
Recommended Operating Temperature -40 to 200℃ -
Breakdown Strength (V/mm) ≥3000 ASTM D149
Dielectric Constant @1MHz 4.0 ASTM D150
Volume Resistivity (Ohm-meter) >1.0×10¹² ASTM D257
Flame Rating V-0 UL 94 (E331100)
Thermal Conductivity (W/m-K) 8.0 ASTM D5470
ISO22007
Product Specifications

Standard Thickness: 0.012" (0.30 mm)~0.120" (3.00 mm)

Standard Size: 4.7"×4.7" (120 mm×120 mm)

The TIF® series is available in custom shapes and various forms. For other thicknesses or more information, please contact us.

TIF®100N 8085-06 Series Thermal Gap Filler Pad
Packaging & Lead Time

Packaging Details:

  • PET film or foam for protection
  • Paper card to separate each layer
  • Export carton inside and outside
  • Customized packaging available to meet customer requirements

Lead Time: 5000 pieces - To be negotiated

Company Profile

Ziitek is a high-tech enterprise dedicated to the R&D, manufacture and sales of thermal interface materials (TIMs). With rich experience in this field, we provide the latest, most effective one-step thermal management solutions. Our facility includes advanced production equipment, full test equipment, and fully automatic coating production lines capable of manufacturing high performance thermal products including:

All products are compliant with UL94 V-0, SGS and ROHS standards.

Certifications: ISO9001:2015, ISO14001:2004, IATF16949:2016, IECQ QC 080000:2017, UL

Our Services
  • Online service: 12 hours, inquiry reply within fastest response time
  • Working time: 8:00am - 5:30pm, Monday to Saturday (UTC+8)
  • Well-trained & experienced staff answering all inquiries in English
  • Standard export carton or marked with customer's information or customized
  • Free samples available
  • After-service support: If products don't work as expected, we provide satisfactory solutions with proper proof
Frequently Asked Questions
Q: What thermal conductivity test method was used to achieve the values given on the data sheets?
A: A test fixture is utilized that meets the specifications outlined in ASTM D5470.
Q: Is GAP PAD offered with an adhesive?
A: Currently, most thermal gap pad surfaces have double side natural inherent tack. Non-stick surface can also be treated according to customer's requirements.
Q: What are thermal pads used for?
A: Thermal pads transfer heat away from hot electronic parts like computer chips into a metal cooler or heat sink. They fill empty air spaces between surfaces, provide electrical safety, and keep parts from getting too hot.
Q: Is a thermal pad effective?
A: While a pad is not as compressible as a paste, the range of available materials means thermal pads are extremely effective with any substrate.
Q: What is Thermal Conductivity?
A: Thermal conductivity indicates a material's ability to conduct heat and is typically measured in W/m*K. Under the same testing conditions, a higher thermal conductivity generally indicates better heat-conduction capability.
Q: What is Thermal Resistance?
A: Thermal resistance indicates the resistance to heat flow through a material or interface and is typically expressed in K/W or °C/W. Lower thermal resistance generally means that heat can pass through the material more efficiently.

Company Details

Bronze Gleitlager

,

Bronze Sleeve Bushings

 and 

Graphite Plugged Bushings

 from Quality China Factory
  • Business Type:

    Manufacturer

  • Year Established:

    2006

  • Total Annual:

    30000000-35700000

  • Employee Number:

    600~700

  • Ecer Certification:

    Verified Supplier

Dongguan Ziitek Electronical Material and Technology Co., Ltd.  provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent. ENTERPRISE CULTUREVISIONBui... Dongguan Ziitek Electronical Material and Technology Co., Ltd.  provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent. ENTERPRISE CULTUREVISIONBui...

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Get in touch with us

  • Reach Us
  • Dongguan Ziitek Electronical Material and Technology Co., Ltd
  • No.12 Xiju Road, Hengli Township, 523465 Dongguan City
  • https://www.thermalconductivematerials.com/

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