Dongguan Ziitek Electronic Materials & Technology Ltd.
| Payment Terms | T/T |
| Supply Ability | 10000/day |
| Delivery Time | 3-5work days |
| Packaging Details | 1000pcs/bag |
| Product name | Low Volatility Silicone Thermally Conductive Gap Filler Pads For Embedded Motherboard |
| Construction & Compostion | Ceramic filled silicone elastomer |
| Dielectric Constant @1MHz | 7.0 |
| Application | Embedded Motherboard |
| Sample | Sample free |
| Recommended Operating Temperature (°C) | -40 to 200℃ |
| Thermal conductivity（W/mk） | 2.0W/mK |
| Hardness | 65/50 Shore 00 |
| Flame Rating | UL 94 V-0 |
| Keywords | thermal Gap Filler Pads |
| Brand Name | ZIITEK |
| Model Number | TIF100L 2050-06 |
| Certification | UL and RoHs |
| Place of Origin | China |
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Product Specification
| Payment Terms | T/T | Supply Ability | 10000/day |
| Delivery Time | 3-5work days | Packaging Details | 1000pcs/bag |
| Product name | Low Volatility Silicone Thermally Conductive Gap Filler Pads For Embedded Motherboard | Construction & Compostion | Ceramic filled silicone elastomer |
| Dielectric Constant @1MHz | 7.0 | Application | Embedded Motherboard |
| Sample | Sample free | Recommended Operating Temperature (°C) | -40 to 200℃ |
| Thermal conductivity（W/mk） | 2.0W/mK | Hardness | 65/50 Shore 00 |
| Flame Rating | UL 94 V-0 | Keywords | thermal Gap Filler Pads |
| Brand Name | ZIITEK | Model Number | TIF100L 2050-06 |
| Certification | UL and RoHs | Place of Origin | China |
Low Volatility Silicone Thermally Conductive Gap Filler Pads For Embedded Motherboard
Products description
The TIF®100L 2050-06 eries is a thermal pad with ultra-lowsiliconoxygen volatilization, designed specifically for optical and high-precision applications. Its soft and elastic material can fill the uneven gaps between heating elements and heat sinks or metal bases, limprove thermal conductivity efficiency,and effectively extend the life of electronic components. The silicone structure filled with ceramics not only has good thermal conductivity, but also has extremely low volatility of low molecular weight siloxanes, which can significantly reduce the risk of internal contamination in optical devices.
Features
>Ultra low volatility of siloxane
>Good thermal conductivity
>Self adhesive without the need for extermal surface adhesive
>Highly compressible,easy to install and operate
>Good insulation performance
Applications
>Embedded Motherboard
>Industrial visual inspection equipment
>Graphics card cooling module
>Charging pile power module
>Central control screen
| Typical Properties of TIF®100L 2050-06 Series | |||
| Property | Value | Test method | |
| Color | White | Visual | |
| Construction & Compostion | Ceramic filled silicone elastomer | ****** | |
| Density(g/cm³) | 2.9 | ASTM D792 | |
| Thickness Range(inch/mm) | 0.010~0.020 | 0.030~0.200 | ASTM D374 |
| (0.25~0.50) | (0.75~5.00) | ||
| Hardness | 65 Shore 00 | 50 Shore 00 | ASTM 2240 |
| Recommended Operating Temperature | -40 to 200℃ | ****** | |
| Breakdown Voltage(V/mm) | ≥5500 | ASTM D149 | |
| Dielectric Constant @1MHz | 7.0 | ASTM D150 | |
| Volume Resistivity(Ohm-meter) | ＞1.0X1012 | ASTM D257 | |
| Flame rating | V-0 | UL 94 (E331100) | |
| Thermal conductivity (W/m-K) | 2.0 | ASTM D5470 | |
| 2.0 | ISO22007 | ||
Product Specifications
Standard Thickness:0.010" (0.25 mm)～0.200" (5.00 mm),with increments of 0.010" (0.25 mm).
Standard Size: 16"×16" (406 mmx406 mm)
The TIF® series is available in custom shapes andvarious forms.
For other thicknesses or more information, please contact us.
Packaging Details & Lead time
The packaging of thermal pad
1.with PET film or foam-for protection
2. use Paper Card To Separate Each Layer
3. export carton inside and outside
4. meet with customers' requirement-customized
Lead Time :Quantity(Pieces):5000
Est. Time(days): To be negotiated
Ziitek company is a high-tech enterprise dedicated to the R&D, manufacture and sales of thermal interface materials (TIMs). With rich experience in this field, we provide the latest, most effective one-step thermal management solutions. Our facility includes advanced production equipment, full test equipment, and fully automatic coating production lines capable of manufacturing high performance thermal products including:
All products are compliant with UL94 V-0, SGS and ROHS standards.
Certifications: ISO9001:2015, ISO14001:2004, IATF16949:2016, IECQ QC 080000:2017, UL
Independent R&D team
Q: How do I place an order?
A:1. Click the "Sent messages" button to continue with the process.
2. Fill out the message form by entering a subject line, and message to us.
This message should include any questions you might have about the products as well as your purchase requests.
3. Click the "Send" button when you are finished to complete the process and send your message to us.
4. We will reply you as soon as possible with Email or online.
FAQ
Q: What thermal conductivity test method was used to achieve the values given on the data sheets?
A: A test fixture is utilized that meets the specifications outlined in ASTM D5470.
Q: Is GAP PAD offered with an adhesive?
A: Currently, Most of thermal gap pad surface has double side natural inherent tack,Non-stick surface can also be treated according to customer's requirements.
Q:Is there promotion price for big buyer?
A:Yes, we do have promotion price for big buyer. Please send us email for inquiry.
Company Details
Business Type:
Manufacturer
Year Established:
2006
Total Annual:
30000000-35700000
Employee Number:
600~700
Ecer Certification：
Verified Supplier
Dongguan Ziitek Electronical Material and Technology, Ltd. provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent. ENTERPRISE CULTURE VIS... Dongguan Ziitek Electronical Material and Technology, Ltd. provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent. ENTERPRISE CULTURE VIS...
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