| Supply Ability | 1000KG |
| Delivery Time | 2-3 work day |
| Packaging Details | 1kg/can |
| Payment Terms | T/T |
| Products name | Easy Application Epoxy Potting Compound Glue Electronic Epoxy Resin Adhesive High Thermal Conductive Potting Epoxy Adhesive |
| keywords | Epoxy Potting Compound Glue |
| Hardness (Shore 00) | 85 |
| Recommended Operating Temperature (℃) | -40℃ to 160℃ |
| Cure @ 25°℃ | 12 hours |
| Cure @ 70°C | 30 mins |
| Thermal Conductivity | 2.5 W/m-K |
| Application | Potting capacitors Potting of small electrical devices |
| Brand Name | Ziitek |
| Model Number | TIE280-25AB |
| Certification | RoHs |
| Place of Origin | China |
View Detail Information
Explore similar products
High Performance One Component Thermal Conductivity Epoxy Glue For Electronic
Excellent Insulation Performance 1.5W/M-K Two Component Epoxy Sealant For
Two-Component High Thermal Conductivity Epoxy Resin Glue Compound For Electronic
High Thermal Conductive Potting Epoxy Adhesive Thermally Conductive Glue For
Product Specification
| Supply Ability | 1000KG | Delivery Time | 2-3 work day |
| Packaging Details | 1kg/can | Payment Terms | T/T |
| Products name | Easy Application Epoxy Potting Compound Glue Electronic Epoxy Resin Adhesive High Thermal Conductive Potting Epoxy Adhesive | keywords | Epoxy Potting Compound Glue |
| Hardness (Shore 00) | 85 | Recommended Operating Temperature (℃) | -40℃ to 160℃ |
| Cure @ 25°℃ | 12 hours | Cure @ 70°C | 30 mins |
| Thermal Conductivity | 2.5 W/m-K | Application | Potting capacitors Potting of small electrical devices |
| Brand Name | Ziitek | Model Number | TIE280-25AB |
| Certification | RoHs | Place of Origin | China |
| High Light | Easy Application Epoxy Resin Adhesive ,High Thermal Conductive Epoxy Resin Adhesive ,Electronic Epoxy Resin Adhesive | ||
Easy Application Epoxy Potting Compound Glue Electronic Epoxy Resin Adhesive High Thermal Conductive Potting Epoxy Adhesive
TIE®280-25AB is a two-component epoxy resin sealantwithgood thermal conductivity and room temperature curing properties. It can complete the curing process at room temperature and is convenient for on-site operation and construction. And this material has excellent fire and flame retardant properties, which can meet the high safety requirements of electronic devices.It is particularly suitable for the sealing protection of capacitors,small electronic components,and precision circuit modules,and can provide long-term reliable mechanical support and environmental protectionfor sensitive components.
Features
> Good thermal conductive: 2.5W/mK
> Excellent insulation and smoothly sourface.
> Low shrinkage
> Low viscosity, expediting air releaseed.
> Excellent in solvents and water proof.
> Longer life time.
> Excellent thermal shock efficiecy and impact resistance
Application
> Automotive starters potting; General potting Thermal detector potting
> Ferrite adhesion; TIP type LED; Good adhesion to aromatic polyester
> Relay sealant; Good adhesion to rubber, ceramics PCB and plastics
> Power transformers and coils; Potting capacitors Potting of small electrical devices
> Adhesion to metal glass and plastic LCD & substrates adhesion; Coating and sealant; Coil ; IGBTS; Transformer; Fire retardant
> Optical / medical component adhesive
| Typical Properties of TIE®280-25AB Series | ||
| Uncured Material Properties | ||
| Property | Value | Test Method |
| Construction | Epoxy resin | - |
| Color/Part A | Black | Visual |
| Color/Part B | Gray | Visual |
| Part A Viscosity (mPa·S) | 50,000 | ASTM D2196 |
| Part B Viscosity (mPa·S) | 30,000 | ASTM D2196 |
| Mix Ratio | 1:1 | - |
| Shelf life (Month) | 12(Unopened) | - |
| Cure Schedule | ||
| Pot Life @ 25°C | 45 mins | Ziitek Test Method |
| Cure @ 25°℃ | 12 hours | Ziitek Test Method |
| Cure @ 70°C | 30 mins | Ziitek Test Method |
| Cure @ 100℃ | 15 mins | Ziitek Test Method |
| Cure Material Properties | ||
| Color | Gray | Visual |
| Density(g/cm³) | 2.0 | ASTM D792 |
| Hardness (Shore 00) | 85 | ASTM D2240 |
| Breakdown Voltage (V/mm) | ≥10,000 | ASTM D149 |
| Dielectric Constant @1MHz | 4.2 | ASTM D150 |
| Volume Resistivity (Ohm·cm) | >1.0x1012 | ASTM D257 |
| Thermal Conductivity (W/m·K) | 2.5 | ASTM D5470 |
| Recommended Operating Temperature (℃) | -40~160 | - |
| Flame Rating | V-0 | UL 94 |
![]()
Ziitek company is a high-tech enterprise dedicated to the R&D, manufacture and sales of thermal interface materials (TIMs). With rich experience in this field, we provide the latest, most effective one-step thermal management solutions. Our facility includes advanced production equipment, full test equipment, and fully automatic coating production lines capable of manufacturing high performance thermal products including:
All products are compliant with UL94 V-0, SGS and ROHS standards.
Certifications: ISO9001:2015, ISO14001:2004, IATF16949:2016, IECQ QC 080000:2017, UL
Company Details
Business Type:
Manufacturer
Year Established:
2006
Total Annual:
100000-160000
Employee Number:
100~150
Ecer Certification:
Verified Supplier
Dongguan Ziitek Electronical Material and Technology Ltd. provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent. ENTERPRISE CULTURE VISI... Dongguan Ziitek Electronical Material and Technology Ltd. provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent. ENTERPRISE CULTURE VISI...
Get in touch with us
Leave a Message, we will call you back quickly!