Dongguan Ziitek Electronic Materials & Technology Ltd.
| Supply Ability | 10000/day |
| Delivery Time | 3-5work days |
| Packaging Details | 1000pcs/bag |
| Products name | Premium Soft 2.5W Silicone Thermal Pad Thermal Conductive Gap Filler Pad For Electronic Equipment |
| Thermal conductivity& Compostion | 2.5 W/m-K |
| Specific Gravity | 1.6g/cc |
| Hardness | 45 Shore 00 |
| Color | Blue-Violet |
| Thickness | 0.020"(0.50mm)~0.200"(5.00mm) |
| Continuos Use Temp | -40℃ to 200℃ |
| Application | Electronic Equipment |
| Keywords | Thermal Gap Filler Pad |
| Construction | Boron Nitride-Filled Silicone Rubber |
| Brand Name | ZIITEK |
| Model Number | TIF100N-25-16S |
| Certification | UL and RoHs |
| Place of Origin | China |
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Product Specification
| Supply Ability | 10000/day | Delivery Time | 3-5work days |
| Packaging Details | 1000pcs/bag | Products name | Premium Soft 2.5W Silicone Thermal Pad Thermal Conductive Gap Filler Pad For Electronic Equipment |
| Thermal conductivity& Compostion | 2.5 W/m-K | Specific Gravity | 1.6g/cc |
| Hardness | 45 Shore 00 | Color | Blue-Violet |
| Thickness | 0.020"(0.50mm)~0.200"(5.00mm) | Continuos Use Temp | -40℃ to 200℃ |
| Application | Electronic Equipment | Keywords | Thermal Gap Filler Pad |
| Construction | Boron Nitride-Filled Silicone Rubber | Brand Name | ZIITEK |
| Model Number | TIF100N-25-16S | Certification | UL and RoHs |
| Place of Origin | China | ||
| High Light | Soft 2.5W Silicone Thermal Pad ，Electronic Equipment Silicone Thermal Pad ，Thermal Conductive Gap Filler Pad | ||
Premium Soft 2.5W Silicone Thermal Pad Thermal Conductive Gap Filler Pad For Electronic Equipment
TIF®100N-25-16S series is a silicone-based thermal material designed to fill the gaps between heat-generating components and liquid cooling plates or metal bases. lts flexibility and elasticity make it ideal for covering highly uneven surfaces. With excellent thermal conductivity, it efficiently transfers heat from heat-generating elements or PCBs to liquid cooling plates or metal heat dissipation structures,thereby improving the cooling efficiency of high-power electronic components and extending the lifespan of the equipment.
Features:
> Excellent thermal conductivity 2.5W/mK
> Naturally tacky needing no further adhesive coating
> High compliance adapts to various pressure
> Available in different thickness options
> Easy release construction
> Electrically isolating
> High durability
Applications:
> Cooling components to the chassis of frame
> CPU and GPU processors and other chipsets
> High-performance computing (HPC)
> Industrial equipment
> Network communication devices
> New energy vehicles
>Display card
>Mainboard/mother board
>Notebook
>Power supply
>Heat pipe thermal solutions
>Memory Modules
| Typical Properties of TIF®100N-25-16S Series | ||
| Color | Blue-Violet | Visual |
| Construction & Compostion | Boron Nitride-Filled Silicone Rubber | ***** |
| Specific Gravity | 1.6 g/cc | ASTM D792 |
| thickness | 0.020"(0.5mm)~0.200"(5.00mm) | ASTM D374 |
| Hardness (thickness＜1.0mm) | 45 (Shore 00) | ASTM 2240 |
| Continuos Use Temp | -40 to 200℃ | ****** |
| Dielectric Breakdown Voltage | ≥5500 VAC | ASTM D149 |
| Dielectric Constant | 2.8 MHz | ASTM D150 |
| Fire rating | 94 V0 | UL (E331100) |
| Thermal conductivity | 2.5 W/m-K | ASTM D5470 |
Standard Thicknesses:
0.020" (0.51mm) 0.030" (0.76mm)
0.040" (1.02mm) 0.050" (1.27mm) 0.060" (1.52mm)
0.070" (1.78mm) 0.080" (2.03mm) 0.090" (2.29mm)
0.100" (2.54mm) 0.110" (2.79mm) 0.120" (3.05mm)
0.130" (3.30mm) 0.140" (3.56mm) 0.150" (3.81mm)
0.160" (4.06mm) 0.170" (4.32mm) 0.180" (4.57mm)
0.190" (4.83mm) 0.200" (5.08mm)
Consult the factory to alternate thickness.
The packaging of thermal pad
1.with PET film or foam-for protection
2. use Paper Card To Separate Each Layer
3. export carton inside and outside
4. meet with customers' requirement-customized
Lead Time :Quantity(Pieces):5000
Est. Time(days): To be negotiated
With professional R&D capabilities and many year experiences in thermal interface material industry, Ziitek company own many unique formulations which are our core technologies and advantages. Our goal is to provide quality & competitive products to our customers worldwide aiming for long-term business cooperation.
Why Choose us ?
1.Our value message is'' Do it right the First time, total quality control''.
2.Our core competencies is thermal conductive interface materials.
3.Competitive advantage products.
4.Condidentiality agreement Bussiness Secrect Contract.
5.Free sample offer.
6.Quality assurance contract.
Company Details
Business Type:
Manufacturer
Year Established:
2006
Total Annual:
100000-160000
Employee Number:
100~150
Ecer Certification：
Verified Supplier
Dongguan Ziitek Electronical Material and Technology Ltd. provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent. Ziitek D-U-N-S... Dongguan Ziitek Electronical Material and Technology Ltd. provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent. Ziitek D-U-N-S...
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