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Dongguan Ziitek Electronic Materials & Technology Ltd.

  • China,Dongguan ,Guangdong
  • Verified Supplier

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China Thermal Interface Material 13W Soft Silicone Thermal Conductive Pad Gpu Cpu
China Thermal Interface Material 13W Soft Silicone Thermal Conductive Pad Gpu Cpu

  1. China Thermal Interface Material 13W Soft Silicone Thermal Conductive Pad Gpu Cpu
  2. China Thermal Interface Material 13W Soft Silicone Thermal Conductive Pad Gpu Cpu

Thermal Interface Material 13W Soft Silicone Thermal Conductive Pad Gpu Cpu

  1. MOQ: 1000pcs
  2. Price: Negotiation
  3. Get Latest Price
Supply Ability 10000/day
Delivery Time 3-5work days
Packaging Details 1000pcs/bag
Products name Thermal Interface Material 13W Soft Silicone Thermal Conductive Pad Gpu Cpu Light Thermal Gap Filler
Continuos Use Temp -40℃ to 200℃
Hardness 45 Shore 00
Keywords Thermal Gap Filler
Thermal conductivity& Compostion 13.0W/m-K
Specific Gravity 3.7g/cc
Thickness 0.030"~0.20"(0.75mm~5.0mm)
Color Gray
Construction Ceramic filled silicone elastomer
Brand Name ZIITEK
Model Number TIF800Q Series
Certification UL and RoHs
Place of Origin China

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  1. Product Details
  2. Company Details

Product Specification

Supply Ability 10000/day Delivery Time 3-5work days
Packaging Details 1000pcs/bag Products name Thermal Interface Material 13W Soft Silicone Thermal Conductive Pad Gpu Cpu Light Thermal Gap Filler
Continuos Use Temp -40℃ to 200℃ Hardness 45 Shore 00
Keywords Thermal Gap Filler Thermal conductivity& Compostion 13.0W/m-K
Specific Gravity 3.7g/cc Thickness 0.030"~0.20"(0.75mm~5.0mm)
Color Gray Construction Ceramic filled silicone elastomer
Brand Name ZIITEK Model Number TIF800Q Series
Certification UL and RoHs Place of Origin China
High Light Gpu Cpu Thermal Interface MaterialSoft Silicone Thermal Interface Material13W Thermal Interface Material

Thermal Interface Material 13W Soft Silicone Thermal Conductive Pad Gpu Cpu Light Thermal Gap Filler

 

TIF®800Q series of thermal interface materials is specifically designed to fill air gaps between heat-generating components and heat sinks or metal baseplates. It offers excellent compliance, alowing it to conform fightly to heat sources with varying shapes and height dferences. Even in confined or iregular spaces,it maintains stable thermal conductivity, enabling efficient heat transfer from discrete components or the entire PCB to the metal housing or heat sink. This significantly improves the heat dissipation efficiency of electronic components, thereby enhancing operational stability and extending device lifespan.

 

Features:
> Excellent thermal conductivity 13.0W/mK

> Naturally tacky needing no further adhesive coating
> High compliance adapts to various pressure application environments
> Available in different thickness options


Applications:
> Heat dissipation structure for radiators

> Telecommunication equipment
> Automotive electronics
> Battery packs for electric vehicles

> LED drivers and lamps

Typical Properties of TIF®800Q Series
Color Gray Visual
Construction & Compostion Ceramic filled silicone elastomer ******
Specific Gravity 3.7g/cc ASTM D297
thickness 0.030"(0.75mm)~0.200"(5.00mm) ASTM D374
Hardness (thickness<1.0mm) 45 (Shore 00) ASTM 2240
Continuos Use Temp -40 to 200℃ ******
Dielectric Breakdown Voltage ≥5500 VAC ASTM D149
Dielectric Constant 8.0MHz ASTM D150
Volume Resistivity ≥1.0X10¹²Ohm-meter ASTM D257
Fire rating 94 V0 equivalent UL
Thermal conductivity 13.0W/m-K ASTM D5470

Standard Thicknesses:

 

0.020" (0.51mm) 0.030" (0.76mm)

0.040" (1.02mm) 0.050" (1.27mm) 0.060" (1.52mm)

0.070" (1.78mm) 0.080" (2.03mm) 0.090" (2.29mm)

0.100" (2.54mm) 0.110" (2.79mm) 0.120" (3.05mm)

0.130" (3.30mm) 0.140" (3.56mm) 0.150" (3.81mm)

0.160" (4.06mm) 0.170" (4.32mm) 0.180" (4.57mm)

0.190" (4.83mm) 0.200" (5.08mm)

Consult the factory to alternate thickness.

 

Product Specification
Product Thicknesses: 0.03"(0.75mm)~0.200"(5.00mm) with increments of 0.01(0.25mm)
Product Sizes:16" x 16"(406mm x406mm)
 
Component Codes:
Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment), DC1(Single-sided hardening).
Adhesive Options: A1/A2(Single-sided/Double-sided adhesive).
Notes:FG (Fiberglass) provides enhanced strength, suitable for materials with thicknesses of 0.01 to 0.02 inch (0.25to 0.5mm).
The TIF series is available in custom shapes and various forms.For other thicknesses or more information, please contact us.

Packaging Details & Lead time

 

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

 

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

 

Company Profile

 

Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite thermal solution and manufacturing superior thermal interface materials for competitive market. Our vast experience allows us to assist our customers best in thermal engineering field.We serve customers with customized products, full product lines and flexible production, which makes us be the best and reliable partner of you. Let's make your design more perfect!

 

FAQ:

Q: Are you trading company or manufacturer ?

A: We are manufacturer in China.

 

Q:How can we get detailed price list?

A:Please offer us detailed information of the product such as Size(length,width,thickness),color,specific packaging requirements and purchasing quantity.

 

Q: What kind of packaging you offer?

A: During the packaging process, preventive measures will be taken by us to assure that the goods are in a good condition during storage and delivery.

Company Details

Bronze Gleitlager

,

Bronze Sleeve Bushings

 and 

Graphite Plugged Bushings

 from Quality China Factory
  • Business Type:

    Manufacturer

  • Year Established:

    2006

  • Total Annual:

    100000-160000

  • Employee Number:

    100~150

  • Ecer Certification:

    Verified Supplier

Dongguan Ziitek Electronical Material and Technology Ltd. provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent.     Ziitek D-U-N-S... Dongguan Ziitek Electronical Material and Technology Ltd. provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent.     Ziitek D-U-N-S...

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Get in touch with us

  • Reach Us
  • Dongguan Ziitek Electronic Materials & Technology Ltd.
  • Building B8, Industry District Ⅱ, Xicheng, Hengli Township, 523460 Dongguan City
  • https://www.thermalconductivematerials.com/

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