Dongguan Ziitek Electronic Materials & Technology Ltd.
| Supply Ability | 10000/day |
| Delivery Time | 3-5work days |
| Packaging Details | 1000pcs/bag |
| Products name | Custom High Performance Cpu Silicone High Thermal Conductivity Pad Factory |
| Keywords | Thermal Conductivity Pad |
| Color | Gray |
| Thermal conductivity& Compostion | 3.0W/m-K |
| Specific Gravity | 3.1g/cc |
| Thickness | 0.012"(0.30mm)~0.200"(5.00mm) |
| Construction | Ceramic filled silicone elastomer |
| Continuos Use Temp | -45℃ to 200℃ |
| Application | PCB and LED CPU GPU EV Battery |
| Hardness | 30 Shore 00 |
| Brand Name | ZIITEK |
| Model Number | TIF100C 3030-11 |
| Certification | UL and RoHs |
| Place of Origin | China |
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Product Specification
| Supply Ability | 10000/day | Delivery Time | 3-5work days |
| Packaging Details | 1000pcs/bag | Products name | Custom High Performance Cpu Silicone High Thermal Conductivity Pad Factory |
| Keywords | Thermal Conductivity Pad | Color | Gray |
| Thermal conductivity& Compostion | 3.0W/m-K | Specific Gravity | 3.1g/cc |
| Thickness | 0.012"(0.30mm)~0.200"(5.00mm) | Construction | Ceramic filled silicone elastomer |
| Continuos Use Temp | -45℃ to 200℃ | Application | PCB and LED CPU GPU EV Battery |
| Hardness | 30 Shore 00 | Brand Name | ZIITEK |
| Model Number | TIF100C 3030-11 | Certification | UL and RoHs |
| Place of Origin | China | ||
| High Light | thermal gap filler Factory ，Custom High Performance Cpu Silicone Pad ，High Thermal Conductivity Cpu Silicone Pad | ||
Custom High Performance Cpu Silicone High Thermal Conductivity Pad thermal gap filler Factory
TS-TIF®100C 3030-11 series is a silicone-based thermal material designed to fill the gaps between heat-generating components and liquid cooling plates or metal bases. lts flexibility and elasticity make it ideal for covering highly uneven surfaces. With excellent thermal conductivity, it efficiently transfers heat from heat-generating elements or PCBs to liquid cooling plates or metal heat dissipation structures,thereby improving the cooling efficiency of high-power electronic components and extending the lifespan of the equipment.
Features:
>Good thermal conductive
>Moldability for complex parts
>Soft and compressible for low stress applications
>Naturally tacky needing no further adhesive coating
>Available in varies thicknesses
>Broad range of hardnesses available
Applications:
>Cooling components to the chassis of frame
>High speed mass storage drives
>Heat Sinking Housing at LED-lit BLU in LCD
>Semiconductor automated test equipment (ATE)
>CPU
>Display card
>Mainboard/mother board
>Notebook
>Power supply
>Heat pipe thermal solutions
| Typical Properties of TS-TIF®100C 3030-11 Series | ||
| Color | Gray | Visual |
| Construction & Compostion | Ceramic filled silicone elastomer | ****** |
| Specific Gravity | 3.1g/cc | ASTM D297 |
| thickness | 0.012"(0.30mm)~0.200"(5.00mm) | ASTM D374 |
| Hardness (thickness＜1.0mm) | 30 (Shore 00) | ASTM 2240 |
| Continuos Use Temp | -45 to 200℃ | ****** |
| Dielectric Breakdown Voltage | >5500 VAC | ASTM D149 |
| Dielectric Constant | 4.5MHz | ASTM D150 |
| Volume Resistivity | ≥1.0X10¹²Ohm-meter | ASTM D257 |
| Fire rating | 94 V0 | equivalent UL |
| Thermal conductivity | 3.0W/m-K | ASTM D5470 |
Standard Thicknesses:
0.020" (0.51mm) 0.030" (0.76mm)
0.040" (1.02mm) 0.050" (1.27mm) 0.060" (1.52mm)
0.070" (1.78mm) 0.080" (2.03mm) 0.090" (2.29mm)
0.100" (2.54mm) 0.110" (2.79mm) 0.120" (3.05mm)
0.130" (3.30mm) 0.140" (3.56mm) 0.150" (3.81mm)
0.160" (4.06mm) 0.170" (4.32mm) 0.180" (4.57mm)
0.190" (4.83mm) 0.200" (5.08mm)
Consult the factory to alternate thickness.
The packaging of thermal pad
1.with PET film or foam-for protection
2. use Paper Card To Separate Each Layer
3. export carton inside and outside
4. meet with customers' requirement-customized
Lead Time :Quantity(Pieces):5000
Est. Time(days): To be negotiated
Ziitek Electronic Material and Technology Ltd. provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent.
Our services
Online-service : 12 hours , Inquiry reply within fastest.
Working time: 8:00am - 5:30pm, Monday to Saturday (UTC+8).
Well-trained & experienced staff are to answer all your inquiries in English of course.
Standard Export Carton Or Marked With Customer's Information Or Customized.
Provide free samples
After-service: Even our products have passed strict inspection, if you find the parts can not work well, please show us the proof.
we will help you to deal with it and give you satisfactory solution.
FAQ:
Q: Are you trading company or manufacturer ?
A: We are manufacturer in China.
Q: What's the thermal conductivity test method given on the data sheet ?
A: All the data in the sheet are actual tested.Hot Disk and ASTM D5470 are utilized to test the thermal conductivity.
Q: How to find a right thermal conductivity for my applications
A: It depends on the watts of power source , ability of heat dissipation. Please tell us your detailed applications and the power, so we can recommend most suitable thermal conductive materials.
Company Details
Business Type:
Manufacturer
Year Established:
2006
Total Annual:
100000-160000
Employee Number:
100~150
Ecer Certification：
Verified Supplier
Dongguan Ziitek Electronical Material and Technology Ltd. provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent. Ziitek D-U-N-S... Dongguan Ziitek Electronical Material and Technology Ltd. provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent. Ziitek D-U-N-S...
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