Dongguan Ziitek Electronic Materials & Technology Ltd.
| Supply Ability | 100000pcs/day |
| Delivery Time | 3-5 days |
| Packaging Details | 1000pcs/bag |
| Payment Terms | T/T |
| Product name | Heat Transfer Thermal Interface Materials Thermal Conductive Silicone Thermal Gap Filler Pad For Pcb |
| Keywords | Thermal Gap Filler Pad |
| Thickness | 0.010"(0.25mm)~0.200"(5.00mm) |
| Hardness | 27Shore 00 |
| Application | LED PCB |
| Fire rating | 94-V0 |
| Features | Ultra soft and highly conformable |
| Thermal conductivity | 2.0W/m-K |
| Color | Dark Gray |
| Brand Name | ZIITEK |
| Model Number | TIF500-20-11U |
| Certification | UL and RoHs |
| Place of Origin | China |
View Detail Information
Explore similar products
Factory Price Hot Selling Thermal Conductive Silicon Pad1.5W 0.5~5.0mm Thick
Pink 3.0W/MK CPU Heatsink Colling Thermal Conductive Ultra Soft Gap Filler Pad
Yellow High Dielectric Strength Thermal Conductive Pad 3.0W/MK For Telecommunica
1mm thickness 2W/m.K sticky silicone thermal conductive pad 45 SHORE00 2.32 g/cc
Product Specification
| Supply Ability | 100000pcs/day | Delivery Time | 3-5 days |
| Packaging Details | 1000pcs/bag | Payment Terms | T/T |
| Product name | Heat Transfer Thermal Interface Materials Thermal Conductive Silicone Thermal Gap Filler Pad For Pcb | Keywords | Thermal Gap Filler Pad |
| Thickness | 0.010"(0.25mm)~0.200"(5.00mm) | Hardness | 27Shore 00 |
| Application | LED PCB | Fire rating | 94-V0 |
| Features | Ultra soft and highly conformable | Thermal conductivity | 2.0W/m-K |
| Color | Dark Gray | Brand Name | ZIITEK |
| Model Number | TIF500-20-11U | Certification | UL and RoHs |
| Place of Origin | China | ||
| High Light | Heat Transfer Thermal Pad ，Thermal Conductive Thermal Interface Materials ，Thermal Gap Filler Pad | ||
Heat Transfer Thermal Interface Materials Thermal Conductive Silicone Thermal Gap Filler Pad For PCB
The TIF®500-20-11U Series is an ultra-soft thermal interface material designed specifically to protect precision components that are extremely sensitive to mechanical stress. This product combines high thermal conductivity with an exceptionally gel-like softness, achieving a low-stress perfect fit. It is suitable for addressing issues in high-precision assemblies, such as large tolerances, uneven surfaces, and the susceptibility of delicate components to mechanical damage.
Features:
> Good thermal conductive
> Moldability for complex parts
> Soft and compressible for low stress applications
> Broad range of hardnesses available
> Moldability for complex parts
> Outstanding thermal performance
Applications:
> Cooling components to the chassis of frame
> High speed mass storage drives
> Heat Sinking Housing at LED-lit BLU in LCD
> LED TV and LED-lit lamps
> RDRAM memory modules
> Micro heat pipe thermal solutions
> Automotive engine control units
> Telecommunication hardware
> Handheld portable electronics
> Semiconductor automated test equipment (ATE)
> CPU
| Typical Properties of TIF®500-20-11U Series | |||
| Property | Value | Test method | |
| Color | Dark Gray | Visual | |
| Construction & Compostion | Ceramic filled silicone elastomer | ****** | |
| Density(g/cm³) | 2.5 | ASTM D792 | |
| Thickness Range(inch/mm) | 0.010~0.020 | 0.030~0.200 | ASTM D374 |
| (0.25~0.50) | (0.75~5.0) | ||
| Hardness | 65 Shore 00 | 27 Shore 00 | ASTM 2240 |
| Recommended Operating Temperature | -40 to 200℃ | ****** | |
| Breakdown Voltage(V/mm) | ≥5500 | ASTM D149 | |
| Dielectric Constant | 4.5 MHz | ASTM D150 | |
| Volume Resistivity | ＞1.0X1012 Ohm-meter | ASTM D257 | |
| Flame rating | V-0 | UL94 (E331100) | |
| Thermal conductivity | 2.0 W/m-K | ASTM D5470 | |
| 2.0 W/m-K | ISO22007 | ||
Packaging Details & Lead time
The packaging of thermal pad
1.with PET film or foam-for protection
2. use Paper Card To Separate Each Layer
3. export carton inside and outside
4. meet with customers' requirement-customized
Lead Time :Quantity(Pieces):5000
Est. Time(days): To be negotiated
Company profile
With a wide range, good quality, reasonable prices and stylish designs, Ziitek thermal conductive interface materials are extensively used in Mainboards, VGA cards, Notebooks, DDR&DDR2 products, CD-ROM ,LCD TV, PDP products, Server Power products, Down lamps, Spotlights, Street lamps, Daylight lamps, LED Server Power products and others.
Certifications:
ISO9001:2015
ISO14001: 2004 IATF16949:2016
IECQ QC 080000:2017
UL
Independent R&D team
Q: How do I place an order?
A:1. Click the "Sent messages" button to continue with the process.
2. Fill out the message form by entering a subject line, and message to us.
This message should include any questions you might have about the products as well as your purchase requests.
3. Click the "Send" button when you are finished to complete the process and send your message to us.
4. We will reply you as soon as possible with Email or online.
Company Details
Business Type:
Manufacturer
Year Established:
2006
Total Annual:
30000000-35700000
Employee Number:
600~700
Ecer Certification：
Verified Supplier
Dongguan Ziitek Electronical Material and Technology, Ltd. provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent. ENTERPRISE CULTURE VIS... Dongguan Ziitek Electronical Material and Technology, Ltd. provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent. ENTERPRISE CULTURE VIS...
Get in touch with us
Leave a Message, we will call you back quickly!