
Dongguan Ziitek Electronical Material and Technology Co., Ltd
| Thickness | 0.04~0.12inch / 1.0~3.0mmT |
| Keywords | Silicone Thermal Pads |
| Hardness | 10 Shore 00 |
| Construction | Ceramic filled silicone elastomer |
| Thermal conductivity | 8.5W/m-K |
| Color | Gray |
| Continuos Use Temp | -40℃ to 200℃ |
| Payment Terms | T/T |
| Products name | 8.5W/MK High Temperature 0.5mm Custom Silicone Gap Filler Electric Thermal Pads For Gpu Cpu Led |
| Supply Ability | 10000/day |
| Delivery Time | 3-7 work days |
| Packaging Details | 1000pcs/bag |
| Density | 3.5g/cm³ |
| Application | Heat Transfer In GPU CPU LED Components |
| Brand Name | ZIITEK |
| Model Number | TIF700RES |
| Certification | UL and RoHs |
| Place of Origin | China |
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Product Specification
| Thickness | 0.04~0.12inch / 1.0~3.0mmT | Keywords | Silicone Thermal Pads |
| Hardness | 10 Shore 00 | Construction | Ceramic filled silicone elastomer |
| Thermal conductivity | 8.5W/m-K | Color | Gray |
| Continuos Use Temp | -40℃ to 200℃ | Payment Terms | T/T |
| Products name | 8.5W/MK High Temperature 0.5mm Custom Silicone Gap Filler Electric Thermal Pads For Gpu Cpu Led | Supply Ability | 10000/day |
| Delivery Time | 3-7 work days | Packaging Details | 1000pcs/bag |
| Density | 3.5g/cm³ | Application | Heat Transfer In GPU CPU LED Components |
| Brand Name | ZIITEK | Model Number | TIF700RES |
| Certification | UL and RoHs | Place of Origin | China |
| High Light | 8.5W/mK silicone thermal pads ,GPU CPU thermal gap filler ,LED thermal pads -40℃ to 200℃ | ||
TIF®700RES Series thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base. Their flexibility and elasticity make them suited to coat very uneven surfaces. Heat can transmit to the metal housing or dissipation plate from the heating elements or even the entire PCB, which effectively enhances the efficiency and life-time of the heat-generating electronic components.
| Property | Value | Test method |
|---|---|---|
| Color | Gray | Visual |
| Construction & Composition | Ceramic filled silicone elastomer | ******* |
| Density | 3.5g/cm³ | ASTM D792 |
| Thickness range | 0.016~0.200inch / 0.40~5.0mm | ASTM D374 |
| Hardness | 10 Shore 00 | ASTM 2240 |
| Breakdown Voltage(V/mm) | ≥5000 | ASTM D149 |
| Recommended Operating Temp | -40 ~200℃ | Ziitek Test Method |
| Dielectric Constant @1MHz | 6.7 | ASTM D150 |
| Volume Resistivity | >1.0X1012Ohm-meter | ASTM D257 |
| Fire rating | V-0 | UL94 (E331100) |
| Thermal conductivity | 8.5W/mK | ASTM D5470 |
Standard Thickness: 0.016"(0.40mm)~ 0.200"(5.0mm)
Standard Size: 16"X16"(406 mm×406 mm).
The TIF® series is available in custom shapes and various forms. For other thicknesses or more information, please contact us.
The packaging of thermal pad:
Lead Time: Quantity(Pieces):5000
Est. Time(days): To be negotiated
Ziitek company is a manufacturer of thermal conductive gap fillers, low melting point thermal interface materials, thermal conductive insulators, thermally conductive tapes, electrically & thermally conductive Interface pads and thermal grease, Thermal Conductive plastic, Silicone Rubber, Silicone Foams, Phase Changing Materials products, with well-equipped testing equipment and strong technical force.
Independent R&D team
Company Details
Business Type:
Manufacturer
Year Established:
2006
Total Annual:
30000000-35700000
Employee Number:
600~700
Ecer Certification:
Verified Supplier
Dongguan Ziitek Electronical Material and Technology Co., Ltd. provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent. ENTERPRISE CULTUREVISIONBui... Dongguan Ziitek Electronical Material and Technology Co., Ltd. provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent. ENTERPRISE CULTUREVISIONBui...
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