ISO Low Thermal Conductivity Insulation Heat Insulating Plate For Ultra High

Product Specification

Ultra-low thermal conductivity insulation board solves customers' problems in ultra-high temperature applications
 
 
Product Details

When it comes to ultra-high temperature applications, addressing the challenge of heat transfer becomes paramount. An ultra-low thermal conductivity insulation board can help solve customers' problems by minimizing heat transfer and maintaining temperature stability. Here are some key points on how an ultra-low thermal conductivity insulation board can address these challenges:

1. Thermal Insulation Performance: The primary advantage of an ultra-low thermal conductivity insulation board is its exceptional ability to minimize heat transfer. These boards are designed with advanced insulation materials that have extremely low thermal conductivity values. This property reduces the amount of heat flowing through the board, helping to maintain stable and controlled temperatures in ultra-high temperature environments.

2. Temperature Stability: Ultra-low thermal conductivity insulation boards assist in achieving temperature stability by reducing heat loss or gain. By limiting the transfer of thermal energy, these boards help maintain the desired temperature within the application, ensuring consistent performance and product quality.

3. Energy Efficiency: The reduced heat transfer provided by ultra-low thermal conductivity insulation boards contributes to improved energy efficiency. By minimizing heat loss, less energy is required to maintain the desired temperature, resulting in energy savings and cost reduction.

4. Material Compatibility: These insulation boards are often designed to withstand extreme temperatures without degradation. They are engineered to be compatible with ultra-high temperature applications and are resistant to thermal shock, deformation, and chemical reactions. This ensures the long-term stability and reliability of the insulation board in challenging environments.

5. Customization and Versatility: Ultra-low thermal conductivity insulation boards can be customized to meet specific application requirements. They are available in various sizes, thicknesses, and configurations to accommodate different equipment and systems. This versatility allows for easy integration and installation in a wide range of ultra-high temperature applications.

6. Safety and Environmental Considerations: Ultra-low thermal conductivity insulation boards are typically designed to be non-combustible and have low smoke emission. They contribute to improved safety by minimizing the risk of fire hazards and reducing the release of toxic gases or smoke in the event of a fire.

When selecting an ultra-low thermal conductivity insulation board for ultra-high temperature applications, it is crucial to consider factors such as temperature limits, material compatibility, installation requirements, and specific industry standards. Consulting with insulation material suppliers or industry experts will help identify the most suitable insulation board for your specific needs and ensure successful thermal management in ultra-high temperature environments.

 
Product Specifications

 
 
Availability
Keeprecisionregistered trade-mark-400-SL soft insulation pads can be specially customized according to customer application equipment specifications, such as thickness, area, threaded mounting hole distribution, etc.
-Max. sheet dimension: 600 x 2000 mm
- Thickness: 5-10 mm
 
All information in this data sheet is given in good faith and represents our latest knowledge. The values above are typical test results from short time tests and should not be taken as guaranteed, for specifications or primary selection of materials.
Keeprecision-400-SL is a registered trade-mark from Keeprecision Thermal Insulation Materials Co., Ltd.

 
Feature of product
In addition to efficient thermal insulation properties, Jiangsu Jingjing's mold insulation panels are also designed for high-pressure applications and have excellent mechanical properties. This makes our insulation materials particularly suitable for the need for material stability.
 
Features
Thermal insulation panels are highly resistant to pressure, especially in higher temperature applications
 
Efficient thermal insulation
 
Allows you to control mold temperature more accurately and better improve product quality and production efficiency
 
Ensure the stable flow of thermoplastic plastics during processing and forming.
 
 
Typical application industries

                            Mold insulation                                      Thermosetting heat press insulation board

   Injection molding machine heat insulation board                  Blow mold insulation board

            Hot runner heat insulation board                                                  extruder
 
Jiangsu Jingjing insulation board processing and shipping time reference
Are you still worried about processing heat insulation boards, such as flying dust, affecting equipment accuracy and personnel health?
Are you still worried about product quality problems caused by processing heat insulation boards, such as cracks in holes, out-of-tolerance dimensions, product delamination, etc.
We now provide customer drawing processing services, and the shipping time is as follows:
 

 
Remark:
The above is the factory shipping time. For the intermediate transportation time, please refer to the transportation time MAP on the website.
*Drawings, please try your best to provide CAD drawings so that our company can speed up the delivery time.
*If the customer is particularly urgent, please use our expedited shipping service. Please refer to the emergency shipping service on the website for details.