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Dongguan Ziitek Electronical Material and Technology Co., Ltd

  • China,Dongguan ,Guangdong
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China CPU Thermal Pad Thermal Interface Material Silicone Base With 3.0W/mK Thermal
China CPU Thermal Pad Thermal Interface Material Silicone Base With 3.0W/mK Thermal

  1. China CPU Thermal Pad Thermal Interface Material Silicone Base With 3.0W/mK Thermal
  2. China CPU Thermal Pad Thermal Interface Material Silicone Base With 3.0W/mK Thermal

CPU Thermal Pad Thermal Interface Material Silicone Base With 3.0W/mK Thermal

  1. MOQ: 1000 pcs
  2. Price: 0.1-10 USD/PCS
  3. Get Latest Price
Hardness 12 shore 00
Thickness 5.0mmT
Color Dark gray
Thermal conductivity 3.0W/mK
Density 3.15g/cm³
Keywords Thermal Pad
Payment Terms T/T
Supply Ability 100000pcs/month
Delivery Time 3-8 work days
Packaging Details 24*13*12cm cartons
Sample Free
Products name CPU Thermal Pad Thermal Interface Material Silicone Base With 3.0W/mK Thermal Conductivity For Cooling
Brand Name Ziitek
Model Number TIF1200-30-11ES thermal pad
Certification UL
Place of Origin China

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  1. Product Details
  2. Company Details

Product Specification

Hardness 12 shore 00 Thickness 5.0mmT
Color Dark gray Thermal conductivity 3.0W/mK
Density 3.15g/cm³ Keywords Thermal Pad
Payment Terms T/T Supply Ability 100000pcs/month
Delivery Time 3-8 work days Packaging Details 24*13*12cm cartons
Sample Free Products name CPU Thermal Pad Thermal Interface Material Silicone Base With 3.0W/mK Thermal Conductivity For Cooling
Brand Name Ziitek Model Number TIF1200-30-11ES thermal pad
Certification UL Place of Origin China
High Light 2.9 g/cc silicone sheets ,12 shore 00 silicone thermal pad ,gray thermal pad silicone
CPU Thermal Pad Thermal Interface Material Silicone Base With 3.0W/mK Thermal Conductivity For Cooling
Product Overview
The TIF®1200-30-11ES Series is a thermal pad specifically designed to tackle high-level cooling challenges and environments sensitive to extreme mechanical stress. It combines high thermal conductivity with near-fluid ultimate softness, ensuring perfect filling of the contact interface even under ultra-low mounting pressure, completely eliminating air thermal resistance, and providing superior thermal solutions and physical protection for the most precise and high heat flux electronic components.
Key Features
  • Good thermal conductivity: 3.0W/mK
  • Thickness: 5.0mm
  • Hardness: 12 Shore 00
  • Moldability for complex parts
  • High tack surface reduces contact resistance
  • Fiberglass reinforced for puncture, shear and tear resistance
Applications
  • Power supply
  • Heat pipe thermal solutions
  • Memory Modules
  • Mass storage devices
  • IT infrastructure
  • GPS navigation and other portable devices
  • CD-Rom, DVD-Rom cooling
  • New energy vehicle
  • Motherboard chip
  • Radiator
  • AI Processors AI Servers
Technical Specifications of TIF®100-30-11ES
Property Value Test Method
Color Dark Gray Visual
Construction & Composition Ceramic filled silicone elastomer ******
Density (g/cm³) 3.15 ASTM D792
Thickness Range (inch/mm) 0.020~0.030 (0.50~0.75) | 0.040~0.200 (1.00~5.00) ASTM D374
Hardness (Shore 00) 12 ASTM 2240
Continuous Use Temp -40 to 200℃ ***
Breakdown Voltage (V/mm) ≥5500 ASTM D149
Dielectric Constant @1MHz 7.0 ASTM D150
Volume Resistivity >1.0×10¹² Ohm-meter ASTM D257
Thermal Conductivity (W/m-K) 3.0 ASTM D5470 / ISO22007
Fire rating V-0 UL 94 (E331100)
Product Specifications

Standard Thickness: 0.020" (0.50 mm)~0.200" (5.00 mm) with increments of 0.010" (0.25 mm)

Standard Size: 16"×16" (406 mm×406 mm)

Component Codes:

  • Reinforcement Fabric: FG (Fiberglass)
  • Coating Options: NS1 (Non-adhesive treatment), DC1 (Single-sided hardening)
  • Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive)

The TIF® series is available in custom shapes and various forms. For other thicknesses or more information, please contact us.

CPU Thermal Pad Thermal Interface Material product image
Company Advantages
Ziitek has an independent R&D team with experience, rigorous and pragmatic approach. They undertake the core research and development tasks of Ziitek thermal conductive materials. With well-equipped testing equipment, we can also perform tests with customers' samples to find more suitable Ziitek materials for every customer.
Frequently Asked Questions
Q: Do you offer free samples?
A: Yes, we are willing to offer free samples.
Q: What thermal conductivity test method was used to achieve the values given on the data sheets?
A: A test fixture is utilized that meets the specifications outlined in ASTM D5470.
Q: Is GAP PAD offered with an adhesive?
A: Currently, most thermal gap pad surfaces have double side natural inherent tack. Non-stick surface can also be treated according to customer's requirements.

Company Details

Bronze Gleitlager

,

Bronze Sleeve Bushings

 and 

Graphite Plugged Bushings

 from Quality China Factory
  • Business Type:

    Manufacturer,Seller

  • Year Established:

    2006

  • Total Annual:

    30000000-35700000

  • Employee Number:

    600~700

  • Ecer Certification:

    Verified Supplier

Dongguan Ziitek Electronical Material and Technology Co., Ltd. provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent. ENTERPRISE CULTUREVISIONBuild a w... Dongguan Ziitek Electronical Material and Technology Co., Ltd. provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent. ENTERPRISE CULTUREVISIONBuild a w...

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Get in touch with us

  • Reach Us
  • Dongguan Ziitek Electronical Material and Technology Co., Ltd
  • No.12 Xiju Road, Hengli Township, Dongguan City, 523465 Guangdong Province, China
  • https://www.thermazig.com/

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