Dongguan Ziitek Electronical Material and Technology Ltd.
| Payment Terms | T/T |
| Supply Ability | 100000pcs/month |
| Delivery Time | 3-8 work days |
| Packaging Details | 24*13*12cm cartons |
| Products Name | Fiberglass Reinforced Excellent Insulator Silicone Cpu Thermal Pad For Smd Led Module |
| Application | Notebook SMD LED module |
| Continuos Use Temp | -40 to 200℃ |
| Color | blue |
| Specific gravity | 3.0 g/cc |
| Dielectric Constant | 7.0 MHz |
| Keywords | Thermal Pad |
| Thermal conductivity | 3.0W/mK |
| Brand Name | Ziitek |
| Model Number | TIF140-30-05US thermal pad |
| Certification | UL |
| Place of Origin | China |
View Detail Information
Explore similar products
High Cost-Effective 2.6W/MK CPU Thermal Pad The Outstanding Thermal Performance
Ultra Soft Thermal Conductive Gap Filler 20shore00 3.5mmT For IT Infrastructure
High Performance Low Cost CPU Thermal Pad TIFT500-30-11US With Blue Color For
High performance low cost CPU thermal pad TIF500-40-11US with grey color for
Product Specification
| Payment Terms | T/T | Supply Ability | 100000pcs/month |
| Delivery Time | 3-8 work days | Packaging Details | 24*13*12cm cartons |
| Products Name | Fiberglass Reinforced Excellent Insulator Silicone Cpu Thermal Pad For Smd Led Module | Application | Notebook SMD LED module |
| Continuos Use Temp | -40 to 200℃ | Color | blue |
| Specific gravity | 3.0 g/cc | Dielectric Constant | 7.0 MHz |
| Keywords | Thermal Pad | Thermal conductivity | 3.0W/mK |
| Brand Name | Ziitek | Model Number | TIF140-30-05US thermal pad |
| Certification | UL | Place of Origin | China |
| High Light | high durability cpu thermal pad ，4.0 mhz cpu thermal pad ，smd silicone pad thermal conductivity | ||
Fiberglass Reinforced Excellent Insulator Silicone Cpu Thermal Pad For Smd Led Module
Company Profile
With a wide range, good quality, reasonable prices and stylish designs, Ziitek thermal conductive interface materials are extensively used in Mainboards, VGA cards, Notebooks, DDR&DDR2 products, CD-ROM ,LCD TV, PDP products, Server Power products, Down lamps, Spotlights, Street lamps, Daylight lamps, LED Server Power products and others.
TIF®140-30-05US thermal pad is a very cost-effective general economic thermal gap filling gasket, soft with its own micro-stick, easy assembly. Under low compressing force to show good thermal conductivity and electrical insulation properties. Bedding on the gap between the heat device and the heat sink or the machine shell to extrude air to reach the full contact forming a continuous thermal conduction. Using heat sink or machine shell as a cooling device can effectively increase the cooling area to achieve a good cooling purposes.
Features
> Good thermal conductive 3.0W/mK
> Moldability for complex parts
> Soft and compressible for low stress applications
> Naturally tacky needing no further adhesive coating
> Available in varies thicknesses
Applications:
> Routers
> Medical Devices
> Auditioning electronic products
> Unmanned aerial vehicle(UAV)
> Photovoltaic
> Signal communication
> New energy vehicle
> Motherboard chip
> Radiator
> AI Processors AI Servers
> CPU
> Display card
> Mainboard/mother board
| Typical Properties of TIF®100-30-05US Series | |||
| Property | Value | Test method | |
| Color | Blue | Visual | |
| Construction & Compostion | Ceramic filled silicone elastomer | ****** | |
| Density(g/cm³) | 3.0 | ASTM D792 | |
| Thickness Range(inch/mm) | 0.010~0.020 | 0.030~0.200 | ASTM D374 |
| (0.25~0.50) | (0.75~5.00) | ||
| Hardness | 50 Shore 00 | 20 Shore 00 | ASTM 2240 |
| Recommended Operating Temperature | -40 to 200℃ | ****** | |
| Breakdown Voltage(V/mm) | ≥5500 | ASTM D149 | |
| Dielectric Constant | 7.0 MHz | ASTM D150 | |
| Volume Resistivity | ＞1.0X1012 Ohm-meter | ASTM D257 | |
| Flame rating | V-0 | UL 94 (E331100) | |
| Thermal conductivity | 3.0 W/m-K | ASTM D5470 | |
| 3.0 W/m-K | ISO22007 | ||
Product Specification
Product Thicknesses: 0.010"(0.25mm)~ 0.200" (5.00mm) with increments of 0.010"(0.25mm).
Product Sizes: 16" x 16" (406mm x 406mm)
Component Codes:
Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment),
DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).
The TIF® series is available in custom shapes and various forms.
For other thicknesses or more information, please contact us.
Packaging Details & Lead time
The packaging of thermal pad
1.with PET film or foam-for protection
2. use Paper Card To Separate Each Layer
3. export carton inside and outside
4. meet with customers' requirement-customized
Lead Time :Quantity(Pieces):5000
Est. Time(days): To be negotiated
1.Our value message is'' Do it right the First time, total quality control''.
2.Our core competencies is thermal conductive interface materials
3.Competitive advantage products.
4.Condidentiality agreement Bussiness Secrect Contract
5.Free sample offer
6.Quality assurance contract
FAQ
Q: What is your terms of payment ?
A: Payment<=2000USD, T/T in advance. Paying in time and faithful for several months, we can apply other payment term for you, pay together in every month or 30 days.
Company Details
Business Type:
Manufacturer,Seller
Year Established:
2006
Total Annual:
1000000-16000000
Employee Number:
100~150
Ecer Certification：
Verified Supplier
Dongguan Ziitek Electronical Material and Technology Ltd. provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent. ENTERPRISE CULTURE ... Dongguan Ziitek Electronical Material and Technology Ltd. provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent. ENTERPRISE CULTURE ...
Get in touch with us
Leave a Message, we will call you back quickly!