Dongguan Ziitek Electronical Material and Technology Ltd.
| Payment Terms | T/T |
| Supply Ability | 100000pcs/month |
| Delivery Time | 3-8 work days |
| Packaging Details | 24*13*12cm carton |
| Products name | CPU Thermal Pad High Thermal Conductive Material For Heat Transfer In Electronic Devices And Telecommunication Equipment |
| Hardness | 65/20 shore00 |
| Keywords | CPU Thermal Pad |
| Color | Dark gray |
| Part number | TIF1100-30-11US |
| Material | Ceramic filled silicone elastomer |
| Thickness | 2.5mmT |
| Thermal conductivity | 3.0W/mK |
| Brand Name | Ziitek |
| Model Number | TIF1100-30-11US thermal pad |
| Certification | UL |
| Place of Origin | China |
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Product Specification
| Payment Terms | T/T | Supply Ability | 100000pcs/month |
| Delivery Time | 3-8 work days | Packaging Details | 24*13*12cm carton |
| Products name | CPU Thermal Pad High Thermal Conductive Material For Heat Transfer In Electronic Devices And Telecommunication Equipment | Hardness | 65/20 shore00 |
| Keywords | CPU Thermal Pad | Color | Dark gray |
| Part number | TIF1100-30-11US | Material | Ceramic filled silicone elastomer |
| Thickness | 2.5mmT | Thermal conductivity | 3.0W/mK |
| Brand Name | Ziitek | Model Number | TIF1100-30-11US thermal pad |
| Certification | UL | Place of Origin | China |
| High Light | 2.5mmT Thermal Conductive Gap Filler ，Telecommunication Thermal Conductive Gap Filler ，20±5 Shore 00 Thermal Gap Filler | ||
CPU Thermal Pad High Thermal Conductive Material For Heat Transfer In Electronic Devices And Telecommunication Equipment
Company Profile
Ziitek Electronic Material and Technology Ltd(ZIITEK) has been deeply involved in the field of heat conducting materials for 20 years, and is a high-tech enterprise integrating R&D, production and sales. Headquartered in Dongguan, with four production bases in Kunshan, Taiwan Province and Viet Nam, the global delivery capacity is stable and reliable. Mainly engaged in thermal conductive silica pads, thermal conductive graphite sheets, thermal conductive insulation materials, PCM phase change materials, thermal conductive plastics, thermal conductive silicone grease/paste, thermal conductive gel, thermal conductive epoxy potting glue, thermal conductive silicone adhesive, silicone foam, and silicon-free thermal pads. The core explosive heating plate is widely recognized by the market. Our products have passed ISO9001 and IATF16949 certification, and meet RoHS/UL standards, and are widely used in new energy, 5G, data center, automotive electronics and other fields.
>Telecommunication hardware
>Handheld portable electronics
>Semiconductor automated test equipment (ATE)
>LED floor light
>Routers
>Medical Devices
>Auditioning electronic products
>Unmanned aerial vehicle(UAV)
>Photovoltaic
>Signal communication
>New energy vehicle
>Motherboard chip
>Radiator
>AI Processors AI Servers
| Typical Properties of TIF®100-30-11US Series | |||
| Property | Value | Test method | |
| Colo | Dark Gray | Visual | |
| Construction & Compostion | Ceramic filled silicone elastomer | ****** | |
| Density(g/cm³) | 3.0 | ASTM D792 | |
| Thickness Range(inch/mm) | 0.010~0.020 | 0.030~0.200 | ASTM D374 |
| (0.25~0.50) | (0.75~5.00) | ||
| Hardness | 65 Shore 00 |
20 Shore 00 |
ASTM 2240 |
| Recommended Operating Temperature | -40 to 200℃ | ****** | |
| Breakdown Voltage(V/mm) | ≥5500 | ASTM D149 | |
| Dielectric Constant @1MHz | 7.0 | ASTM D150 | |
| Volume Resistivity(Ohm-meter) | ＞1.0X1012 | ASTM D257 | |
| Flame rating | V-0 | UL 94 (E331100) | |
| Thermal conductivity (W/m-K) | 3.0 | ASTM D5470 | |
| 3.0 | ISO22007 | ||
Product Specifications
Standard Thickness:0.010" (0.25 mm)～0.200" (5.00 mm) with increments of 0.010" (0.25 mm).
Standard Size: 16" X16" (406 mm X406 mm).
Component Codes:
Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment),
DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).
The TIF®series is available in custom shapes and various forms.
For other thicknesses or more information, please contact us.
Packaging Details & Lead time
The packaging of thermal pad
1.with PET film or foam-for protection
2. use Paper Card To Separate Each Layer
3. export carton inside and outside
4. meet with customers' requirement-customized
Lead Time :Quantity(Pieces):5000
Est. Time(days): To be negotiated
Our services
Online-service : 12 hours , Inquiry reply within fastest.
Working time: 8:00am - 5:30pm, Monday to Saturday (UTC+8).
Well-trained & experienced staff are to answer all your inquiries in English of course.
Standard Export Carton Or Marked With Customer's Information Or Customized.
Provide free samples
After-service: Even our products have passed strict inspection, if you find the parts can not work well, please show us the proof.
we will help you to deal with it and give you satisfactory solution.
Company Details
Business Type:
Manufacturer,Seller
Year Established:
2006
Total Annual:
30000000-35700000
Employee Number:
600~700
Ecer Certification：
Verified Supplier
Dongguan Ziitek Electronical Material and Technology, Ltd. provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent. ENTERPRISE CULTURE ... Dongguan Ziitek Electronical Material and Technology, Ltd. provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent. ENTERPRISE CULTURE ...
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