
Dongguan Ziitek Electronical Material and Technology Co., Ltd
| Thickness | 1.5mmT |
| Payment Terms | T/T |
| Supply Ability | 1000000 pcs/month |
| Delivery Time | 3-5 work days |
| Packaging Details | 24*13*12cm cartons |
| Breakdown Voltage(Vmm) | ≥5500 |
| keywords | thermal pad |
| Thermal conductivity | 1.5W/m-K |
| Color | Green |
| Specific Gravity | 2.2 g/cm³ |
| Application | Gpu IC Chip AI Service |
| Products name | Green Color Electronic Thermal Gap Filler Gpu IC Chip Thermal Conductive Pad for AI Service dissipate heat |
| Brand Name | Ziitek |
| Model Number | TIF160-07S Series |
| Certification | UL & RoHS |
| Place of Origin | China |
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Product Specification
| Thickness | 1.5mmT | Payment Terms | T/T |
| Supply Ability | 1000000 pcs/month | Delivery Time | 3-5 work days |
| Packaging Details | 24*13*12cm cartons | Breakdown Voltage(Vmm) | ≥5500 |
| keywords | thermal pad | Thermal conductivity | 1.5W/m-K |
| Color | Green | Specific Gravity | 2.2 g/cm³ |
| Application | Gpu IC Chip AI Service | Products name | Green Color Electronic Thermal Gap Filler Gpu IC Chip Thermal Conductive Pad for AI Service dissipate heat |
| Brand Name | Ziitek | Model Number | TIF160-07S Series |
| Certification | UL & RoHS | Place of Origin | China |
| High Light | 1.5mmT Thermal Gap Filler Pad ,GPU Thermal Gap Filler Pad ,IC Chip Thermal Conductive Pad | ||
The TIF®160-07S Series thermal gap filler is engineered for efficient heat transfer in electronic applications, filling gaps between heating and cooling components while providing insulation, damping, and sealing functions. This material supports equipment miniaturization and ultra-thin design requirements.
| Property | Value | Test Method |
|---|---|---|
| Color | Green | Visual |
| Construction & Composition | Ceramic filled silicone elastomer | ****** |
| Density (g/cm³) | 2.2 | ASTM D792 |
| Thickness Range (inch/mm) | 0.010~0.020 | 0.030~0.200 0.25~0.5 | 0.75~5.0 |
ASTM D374 |
| Hardness (Shore 00) | 65 | 45 | ASTM 2240 |
| Recommended Operating Temperature | -40 to 200℃ | ****** |
| Breakdown Voltage (V/mm) | ≥5500 | ASTM D149 |
| Dielectric Constant @ 1MHz | 4.5 | ASTM D150 |
| Volume Resistivity | >1.0×10¹² Ohm-meter | ASTM D257 |
| Flame Rating | V-0 | UL 94 (E331100) |
| Thermal Conductivity | 1.5 W/m-K 1.5 W/m-K |
ASTM D5470 ISO22007 |
Standard Thickness: 0.010" (0.25 mm)~0.200" (5.00 mm) with increments of 0.010" (0.25 mm)
Standard Size: 16"×16" (406 mm×406 mm)
Reinforcement Fabric: FG (Fiberglass)
Coating Options: NS1 (Non-adhesive treatment), DC1 (Single-sided hardening)
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive)
The TIF® series is available in custom shapes and various forms. For other thicknesses or more information, please contact us.
Ziitek maintains an independent R&D team with extensive experience in thermal conductive materials. Our well-equipped testing facilities allow us to conduct comprehensive testing with customer samples, ensuring we identify the most suitable thermal solution for each application.
Company Details
Business Type:
Manufacturer,Seller
Year Established:
2006
Total Annual:
30000000-35700000
Employee Number:
600~700
Ecer Certification:
Verified Supplier
Dongguan Ziitek Electronical Material and Technology Co., Ltd. provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent. ENTERPRISE CULTUREVISIONBuild a w... Dongguan Ziitek Electronical Material and Technology Co., Ltd. provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent. ENTERPRISE CULTUREVISIONBuild a w...
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