
Dongguan Ziitek Electronical Material and Technology Ltd.
| Payment Terms | T/T |
| Supply Ability | 1000000 pcs/month |
| Delivery Time | 3-5 work days |
| Packaging Details | 24*13*12cm cartons |
| Products name | Good Thermal Conductive Thermal Gap Pad UL Recognized For Memory Modules |
| Density | 2.3 g/cm³ |
| Flame rating | 94 V0 |
| Thermal conductivity | 1.5W/m-K |
| Keywords | Thermal Gap Pad |
| Features | Good softness and fillability |
| Hardness(Shore OO) | 60 |
| Application | Memory Modules |
| Brand Name | Ziitek |
| Model Number | TIF180-02F Series |
| Certification | UL & RoHS |
| Place of Origin | China |
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Product Specification
| Payment Terms | T/T | Supply Ability | 1000000 pcs/month |
| Delivery Time | 3-5 work days | Packaging Details | 24*13*12cm cartons |
| Products name | Good Thermal Conductive Thermal Gap Pad UL Recognized For Memory Modules | Density | 2.3 g/cm³ |
| Flame rating | 94 V0 | Thermal conductivity | 1.5W/m-K |
| Keywords | Thermal Gap Pad | Features | Good softness and fillability |
| Hardness(Shore OO) | 60 | Application | Memory Modules |
| Brand Name | Ziitek | Model Number | TIF180-02F Series |
| Certification | UL & RoHS | Place of Origin | China |
| High Light | Memory Modules Thermal Gap Pad ,UL Thermal Gap Filler Pad ,94 V0 Thermal Gap Pad | ||
Good Thermal Conductive Thermal Gap Pad UL Recognized For Memory Modules
Company Profile
Ziitek company is a high-tech enterprise dedicated to the R&D, manufacture and sales of thermal interface materials (TIMs). With rich experience in this field, we provide the latest, most effective one-step thermal management solutions. Our facility includes advanced production equipment, full test equipment, and fully automatic coating production lines capable of manufacturing high performance thermal products including:
All products are compliant with UL94 V-0, SGS and ROHS standards.
Certifications: ISO9001:2015, ISO14001:2004, IATF16949:2016, IECQ QC 080000:2017, UL
Products description
The TIF180-02F Series is not only designed to take advantage of the gap heat transfer, to fill gaps, complete the heat transfer between heating and cooling parts, but also played insulation, damping, sealing and so on, to meet the equipment miniaturization and ultra-thin design Requirements, which is a highly technology and use, and the thickness of the wide range of applications, is also an excellent thermal conductivity filler material.
Features
> Good thermal conductive: 1.5W/mK
> Naturally tacky needing no further adhesive coating
> Soft and Compressible for low stress applications
> Available in varies thickness
> Easy release construction
> Electrically isolating
> High durability
Applications
> Mainboard/mother board
> Notebook
> Power supply
> Heat pipe thermal solutions
> Memory Modules
> Mass storage devices
> Automotive electronics
> Set top boxes
> Audio and video components
> IT infrastructure
> GPS navigation and other portable devices
> Motherboard chip
> Radiator
> AI Processors AI Servers
| Typical Properties of TIF®100-02F Series | |||
| Property | Value | Test method | |
| Color | Gray White | Visual | |
| Construction & Compostion | Ceramic filled silicone elastomer | ****** | |
| Density(g/cm³) | 3.0 | ASTM D792 | |
| Thickness Range(inch/mm) | 0.010~0.020 | 0.030~0.200 | ASTM D374 |
| (0.25~0.50) | (0.75~5.00) | ||
| Hardness | 65 Shore 00 | 60 Shore 00 | ASTM 2240 |
| Recommended Operating Temperature | -40 to 200℃ | ****** | |
| Breakdown Voltage(V/mm) | ≥5500 | ASTM D149 | |
| Dielectric Constant | 4.0 MHz | ASTM D150 | |
| Volume Resistivity | >1.0X1012 Ohm-meter | ASTM D257 | |
| Flame rating | V-0 | UL 94 (E331100) | |
| Thermal conductivity | 1.5W/m-K | ASTM D5470 | |
| 1.5W/m-K | ISO22007 | ||
Product Specifications
Standard Thickness: 0.010" (0.25 mm)~0.200" (5.00 mm) with increments of 0.010" (0.25 mm)
Standard Size: 16"X16" (406 mmX406 mm)
Component Codes:
Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment),
DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).
TheTIF® series is available in custom shapes and various forms.
For other thicknesses or more information, please contact us.
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Why Choose us ?
1.Our value message is'' Do it right the First time, total quality control''.
2.Our core competencies is thermal conductive interface materials
3.Competitive advantage products.
4.Condidentiality agreement Bussiness Secrect Contract
5.Free sample offer
6.Quality assurance contract
Ziitek Culture
Quality :
Do it right the first time, total quality control
Effectiveness:
Work precisely and thoroughly for effectiveness
Service:
Quick response, On time delivery and Excellent service
Team work:
Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.
Company Details
Business Type:
Manufacturer,Seller
Year Established:
2006
Total Annual:
1000000-16000000
Employee Number:
100~150
Ecer Certification:
Verified Supplier
Dongguan Ziitek Electronical Material and Technology Ltd. provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent. ENTERPRISE CULTURE ... Dongguan Ziitek Electronical Material and Technology Ltd. provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent. ENTERPRISE CULTURE ...
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