Dongguan Ziitek Electronical Material and Technology Ltd.
| Payment Terms | T/T |
| Supply Ability | 1000000 pcs/month |
| Delivery Time | 3-5 work days |
| Packaging Details | 24*13*12cm cartons |
| Products name | UL Compliant Good Insulation Performance Ultra-Soft Thermally Conductive Gap Filler Pads For AI Processors AI Servers |
| Application | AI Processors AI Servers |
| Thickness | 0.010~0.2inch(0.25~5.0mm) |
| Specific Gravity | 3.1g/cm³ |
| Dielectric Breakdown Voltage | >5500 VAC |
| Thermal conductivity | 4.0W/m-K |
| Color | Dark Gray |
| Keywords | Thermal Gap Pad |
| Operating Temp | -45~200℃ |
| Brand Name | Ziitek |
| Model Number | TIF100-40-11E |
| Certification | UL & RoHS |
| Place of Origin | China |
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Product Specification
| Payment Terms | T/T | Supply Ability | 1000000 pcs/month |
| Delivery Time | 3-5 work days | Packaging Details | 24*13*12cm cartons |
| Products name | UL Compliant Good Insulation Performance Ultra-Soft Thermally Conductive Gap Filler Pads For AI Processors AI Servers | Application | AI Processors AI Servers |
| Thickness | 0.010~0.2inch(0.25~5.0mm) | Specific Gravity | 3.1g/cm³ |
| Dielectric Breakdown Voltage | >5500 VAC | Thermal conductivity | 4.0W/m-K |
| Color | Dark Gray | Keywords | Thermal Gap Pad |
| Operating Temp | -45~200℃ | Brand Name | Ziitek |
| Model Number | TIF100-40-11E | Certification | UL & RoHS |
| Place of Origin | China | ||
| High Light | UL compliant thermal gap filler pads ，ultra-soft CPU thermal pads ，thermally conductive AI server pads | ||
Extremely Soft 6.5W/M-K Thermal Conductive Silica Gap Pad For Telecom Equipment
Company Profile
Product introduction
TIF®100-40-11E Series is a wellbalanced, general-purpose thermal pad. It offers high thermal conductivity and moderate hardness. This balanced design provides both excellent surface conformity and superior ease of use, making it capable of effectively transferring heat and providing basic physical protection for a wide range of electronic components. It is an ideal choice for addressing medium to high power heat dissipation needs, achieving the best balance between cost and performance.
Features
> High thermal conductivity: 4.0W/mK
> Good softness and fillability
> Self-adhesive without the need for additional surface adhesives
> Good insulation performance
Applications
> Power tools
> Network communication products
> Electric vehicle batteries
> Computer CPU/GPU Cooling
> New energy vehicle power systems
> Signal communication
> New energy vehicle
> Motherboard chip
> Radiator
> AI Processors AI Servers
| Typical Properties of TIF®100-40-11E Series | |||
| Property | Value | Test method | |
| Color | Dark Gray | Visual | |
| Construction & Compostion | Ceramic filled silicone elastomer | ****** | |
| Density(g/cm³) | 3.1 | ASTM D792 | |
| Thickness Range(inch/mm) | 0.010~0.020 | 0.030~0.200 | ASTM D374 |
| (0.25~0.50) | (0.75~5.00) | ||
| Hardness | 65 Shore 00 | 35 Shore 00 | ASTM 2240 |
| Continuos Use Temp | -40 to 200℃ | ****** | |
| Breakdown Voltage(V/mm) | ≥5500 | ASTM D149 | |
| Dielectric Constant | 6.0 MHz | ASTM D150 | |
| Volume Resistivity | ＞1.0X1012 Ohm-meter | ASTM D257 | |
| Thermal Conductivity (W/m-K) | 4.0 | ASTM D5470 | |
| 4.0 | ISO22007 | ||
| Fire rating | V-0 | UL 94 (E331100) | |
Product Specifications
Standard Thickness:0.010" (0.25 mm)~0.200" (5.00 mm) with increments of 0.010" (0.25 mm)
Standard Size:16"X16" (406 mmX406 mm)
Component Codes:
Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment),
DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).
The TIF® series is available in custom shapes and various forms.
For other thicknesses or more information, please contact us.
Packaging Details & Lead time
The packaging of thermal pad
1.with PET film or foam-for protection
2. use Paper Card To Separate Each Layer
3. export carton inside and outside
4. meet with customers' requirement-customized
Lead Time :Quantity(Pieces):5000
Est. Time(days): To be negotiated
Why Choose us ?
1.Our value message is'' Do it right the First time, total quality control''.
2.Our core competencies is thermal conductive interface materials.
3.Competitive advantage products.
4.Condidentiality agreement Bussiness Secrect Contract.
5.Free sample offer.
6.Quality assurance contract.
FAQ:
Q: Are you trading company or manufacturer ?
A: We are manufacturer in China.
Q: What thermal conductivity test method was used to achieve the values given on the data sheets?
A: A test fixture is utilized that meets the specifications outlined in ASTM D5470.
Q: Is GAP PAD offered with an adhesive?
A: Currently, Most of thermal gap pad surface has double side natural inherent tack,Non-stick surface can also be treated according to customer's requirements.
Company Details
Business Type:
Manufacturer,Seller
Year Established:
2006
Total Annual:
1000000-16000000
Employee Number:
100~150
Ecer Certification：
Verified Supplier
Dongguan Ziitek Electronical Material and Technology Ltd. provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent. ENTERPRISE CULTURE ... Dongguan Ziitek Electronical Material and Technology Ltd. provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent. ENTERPRISE CULTURE ...
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