Dongguan Ziitek Electronical Material and Technology Ltd.
| Payment Terms | T/T |
| Supply Ability | 1000000 pcs/month |
| Delivery Time | 3-5 work days |
| Packaging Details | 24*13*12cm cartons |
| Products name | Good Insulation Silicone Based Ultra Soft Thermal GAP PAD Materials For AI Processors AI Servers |
| Thermal conductivity | 5.0W/m-K |
| Construction | Ceramic filled silicone elastomer |
| Thickness | 0.25-5.0mmT |
| Dielectric Breakdown Voltage | >5500 VAC |
| Specific Gravity | 3.4 g/cm³ |
| Keywords | Thermal GAP PAD Materials |
| Application | 5G Aerospace， AI Processors，AI Servers |
| Brand Name | Ziitek |
| Model Number | TIF100-50-11U |
| Certification | UL & RoHS |
| Place of Origin | China |
View Detail Information
Explore similar products
LED Heat Conduction Silicone Pad High Thermal Conductivity For Optimal Thermal
Garnet Telecommunication Hardware Naturally Tacky 6.0W Silicon Thermal Pad
China Manufacturer High Thermal Conductivity 13.0W Gray Silicone Thermal Pad
Compressible Silicone Thermal Pad 13.0W/mK High Conductivity Micro Heat Pipe
Product Specification
| Payment Terms | T/T | Supply Ability | 1000000 pcs/month |
| Delivery Time | 3-5 work days | Packaging Details | 24*13*12cm cartons |
| Products name | Good Insulation Silicone Based Ultra Soft Thermal GAP PAD Materials For AI Processors AI Servers | Thermal conductivity | 5.0W/m-K |
| Construction | Ceramic filled silicone elastomer | Thickness | 0.25-5.0mmT |
| Dielectric Breakdown Voltage | >5500 VAC | Specific Gravity | 3.4 g/cm³ |
| Keywords | Thermal GAP PAD Materials | Application | 5G Aerospace， AI Processors，AI Servers |
| Brand Name | Ziitek | Model Number | TIF100-50-11U |
| Certification | UL & RoHS | Place of Origin | China |
| High Light | silicone thermal gap pad for AI processors ，ultra soft thermal pad for servers ，insulation silicone thermal pad materials | ||
Good Insulation Silicone Based Ultra Soft Thermal GAP PAD Materials For AI Processors AI Servers
Products description
TIF®100-50-11U Series is an ultra-soft thermal interface material designed specifically to protect precision components that are extremely sensitive to mechanical stress. This product combines high thermal conductivity with exceptional gel-level softness, achieving a perfectly low-stress fit. It is suitable for addressing issues such as large tolerances, uneven surfaces, and the susceptibility of precision components to mechanical damage in high-precision assemblies.
Features
>High thermal conductivity
>Super soft and highly compliant
>Self-adhesive without the need for additional surface adhesives
>Good insulation performance
Application:
Electronic components - 5G, Aerospace, AI, AIoT, AR/VR/MR/XR, Automotive, Consumer Devices, Datacom, Electric Vehicle, Electronic Products, Energy Storage, Industrial, Lighting Equipment, Medical, Military, Netcom, Panel, Power Electronics, Robot, Servers, Smart Home, Telecom, etc.
| Typical Properties of The TIF®100-50-11U Series | |||
| Property | Value | Test method | |
| Color | Dark gray | Visual | |
| Construction & Compostion | Ceramic filled silicone elastomer | ****** | |
| Density(g/cm³) | 3.4 | ASTM D792 | |
| Thickness Range(inch/mm) | 0.010~0.020 | 0.030~0.200 | ASTM D374 |
| (0.25~0.5) | (0.75~5.0) | ||
| Hardness | 65 Shore 00 | 27 Shore 00 | ASTM 2240 |
| Recommended Operating Temperature | -40 to 200℃ | ****** | |
| Breakdown Voltage(V/mm) | ≥5500 | ASTM D149 | |
| Dielectric Constant | 7.0MHz | ASTM D150 | |
| Volume Resistivity | ＞1.0X1012 Ohm-meter | ASTM D257 | |
| Flame rating | V-0 | UL 94 (E331100) | |
| Thermal conductivity | 5.0 W/m-K | ASTM D5470 | |
| 5.0W/m-K | ISO22007 | ||
Product Specifications
Standard Thickness: 0.010" (0.25 mm)~0.200" (5.00 mm) with increments of 0.010" (0.25 mm)
Standard Size: 16"X16" (406 mmX406 mm)
Component Codes:
Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment),
DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).
The TIF® series is available in custom shapes and various forms.
For other thicknesses or more information, please contact us.
Company profile
Dongguan Ziitek Electronic Material Technology Co., Ltd. was established in 2006. Is a high-tech enterprise specializing in the research, development, production and sales of thermal interface materials. We mainly produce: heat-conducting joint filler, low melting point thermal interface materials, heat-conducting insulator, heat-conducting adhesive tape, heat-conducting interface pad and heat-conducting grease, heat-conducting plastic, silicone rubber, silicone rubber foam, etc. We adhere to the business philosophy of "survival by quality, development by quality", and continue to provide the most efficient and best service for new and old customers with excellent quality in the spirit of rigor, pragmatism and innovation.
Factory Size:8000~10,000 square meters
Factory Country/Region:No.12, Xiju Road, Hengli Township, Dongguan City, Guangdong Province, P.R.China
Online-service : 12 hours , Inquiry reply within fastest.
Working time: 8:00am - 5:30pm, Monday to Saturday (UTC+8).
Well-trained & experienced staff are to answer all your inquiries in English of course.
Standard Export Carton Or Marked With Customer's Information Or Customized.
Provide free samples
After-service: Even our products have passed strict inspection, if you find the parts can not work well, please show us the proof.
we will help you to deal with it and give you satisfactory solution.
FAQ:
Q: Are you trading company or manufacturer ?
A: We are manufacturer in China.
Q: What thermal conductivity test method was used to achieve the values given on the data sheets?
A: A test fixture is utilized that meets the specifications outlined in ASTM D5470.
Q: Is GAP PAD offered with an adhesive?
A: Currently, Most of thermal gap pad surface has double side natural inherent tack,Non-stick surface can also be treated according to customer's requirements.
Q: How do I request customized samples?
A: To request samples, you can leave us message on website, or just contact us by send email or call us.
Q: What's the thermal conductivity test method given on the data sheet ?
A: All the data in the sheet are actual tested.Hot Disk and ASTM D5470 are utilized to test the thermal conductivity.
Company Details
Business Type:
Manufacturer,Seller
Year Established:
2006
Total Annual:
30000000-35700000
Employee Number:
600~700
Ecer Certification：
Verified Supplier
Dongguan Ziitek Electronical Material and Technology, Ltd. provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent. ENTERPRISE CULTURE ... Dongguan Ziitek Electronical Material and Technology, Ltd. provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent. ENTERPRISE CULTURE ...
Get in touch with us
Leave a Message, we will call you back quickly!